According to the customs data in 2018, the import amount of China's integrated circuit (IC) exceeded US $310 billion, an increase of 19.8% over 2017. As a national key strategy to develop emerging industries, the technological breakthrough of IC industry chain has become the focus of the industry.

Wafer manufacturing is the core of the IC industry chain, and the key materials are very important. It mainly includes CMP material, photoresist, wet electronic chemicals (development, cleaning, stripping, etching, etc.), electronic gas, photomask plate, target material, etc. According to the national integrated circuit industry development promotion program, it is clearly required to break through the key equipment and materials of integrated circuit, speed up the industrialization process and enhance the industrial supporting capacity. Local enterprises will usher in unprecedented development opportunities.

Industry data shows that in 2018, the global market size of wafer manufacturing materials is nearly 30 billion US dollars. As Fab plants in China are completed and put into operation, there will be a vast growth space for key materials and chemicals market in the future. Due to the high technical barriers and market barriers, the localization of semiconductor materials is relatively low, less than 10%. Leading enterprises in Europe, America, Japan and South Korea occupy the main market share. China's wafer manufacturing materials industry is facing huge market opportunities, and the development of technology and application is imminent.

The first China wafer manufacturing material technology and market forum 2019 will be held in Hangzhou from September 10 to 11. The conference will focus on China's IC and wafer manufacturing industry policies, global and China's wafer capacity expansion and material demand outlook, China's Fab plant investment and wafer manufacturing material market, the latest technology of overseas enterprises, technology and market trends of photoresist, wet electronic chemicals, high-purity electronic gas, sputtering target materials, photomask plates, CMP materials, as well as the increasing localization rate Opportunities and challenges.

Seminar topics:

1. China's IC and wafer manufacturing industry policies
2. Global and Chinese wafer capacity expansion and material demand outlook
3. China Fab plant investment layout and wafer manufacturing material Market
4. Advanced materials and technology at home and abroad
5. Photoresist technology and market status and cutting-edge trend: KrF / ARF / EUV
6. Improvement of the localization of semiconductor wet electronic chemicals
7. Supply and demand of high-purity electronic gas and investment opportunities
8. High purity sputtering target and photomask technology and market
9. CMP material new technology and project investment
10. Development status of semiconductor silicon in China
11. Industrial visit and investigation

Conference fee: 3200 yuan / person, 2900 yuan / person for team application (same company ≥ 3 persons); English service fee of 2000 yuan for foreign guests

Note: the fee on the day of the meeting includes: lunch, tea break, dinner, Chinese Conference information, venue tickets, etc., excluding accommodation. The accommodation fee is directly settled with the hotel before check-out. The English service fee includes: English conference information, simultaneous interpretation fee, etc. on the day of the meeting
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For different plans, please contact the person in charge: Miss Chen 021-68726606-109 / 13701609248 (the same as wechat) or email to Joanna gun@
The measure of area: 350m2

• Truename:Manager Chen
• Mobile:13701609248
• E-mail:Joanna_chen@chemweekly.com
• QQ:410192892
• Address:Xinjinqiao Road, Pudong New Area, Shanghai

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