Against the backdrop of a new round of technological revolution and industrial transformation, the electronic information industry is accelerating to become the core support for the development of the digital economy. From integrated circuits, new displays, basic electronic components, to artificial intelligence, intelligent terminals, intelligent automobiles, data storage, and new generation communication technologies, the integration of the electronic information industry with various industries is constantly deepening, and the industrial chain, innovation chain, and application chain are forming a closer collaborative relationship. In the face of technological iteration and market demand changes in the global electronic information industry, how to accelerate the transformation of innovative achievements and promote the coordinated development of the industry chain has become an important direction that the industry continues to pay attention to.

Entering 2027, artificial intelligence is becoming an important variable driving a new round of upgrading in the electronic information industry. The demand for AI computing power, advanced storage, high-performance chips, intelligent terminals, intelligent manufacturing, and intelligent automobiles continues to grow, which is also driving technological innovation in industries such as semiconductors, displays, components, communication equipment, and electronic manufacturing. At the same time, new energy vehicles, low altitude economy, robots, smart homes, industrial Internet and other emerging applications are constantly expanding, bringing new market space to electronic information enterprises.

Based on the well-established electronic information industry foundation in Shenzhen and the Guangdong Hong Kong Macao Greater Bay Area, this expo will further strengthen the connection between the industrial chain and the application end. The exhibition will focus on key areas such as semiconductors and integrated circuits, basic electronics, new displays, consumer electronics, smart cars, artificial intelligence, data storage, and smart homes. It will showcase the development achievements of chips, components, display technology, intelligent devices, automotive electronics, and related solutions, allowing industry chain enterprises and terminal application enterprises to have more efficient communication and cooperation on the same platform.

Estimated scale:
80000+professional audience
105000+square meters of exhibition area
1200+exhibitors
30+industry seminars and events

Hall 1: New Generation Information Technology Innovation Application Hall, Consumer Electronics, Intelligent Terminals, Smart Homes, Intelligent Robots, Intelligent Wearables, Sports Technology, Information Technology Application Innovation, International Innovation Cooperation.
Hall 2: AI Computing&Data Center Hall, AI Computing&AI Large Model Exhibition Area, Data Center&Liquid Cooling Exhibition Area, Data Storage and Computing Exhibition Area, Computing Operations&Intelligent Computing Center Exhibition Area, OPC Lobster Farming; Data infrastructure, software, and digital services.
Hall 3-4: Electronic sports equipment, IP games, game competition area, electronic sports activity experience area, electronic sports derivatives area, VR/AR hardware, VR/AR industry application solutions, new display technologies.
Hall 6: E-life Ecological Hall, Consumer Electronics, E-life Experience Area, Entertainment Imaging, Cross border Ecological Chain.
Hall 7: Dual use Electronic Technology Hall, Dual use Technology Equipment Exhibition Area, Electronics and Information Technology Exhibition Area, Intelligent Unmanned Systems Exhibition Area, Supporting and Comprehensive Support Exhibition Area.
Hall 8: National Special Electronic Components Hall, Core High end Basic Components, Special Integrated Circuits, Special Electronics, Electronic Process Materials and Testing Equipment, University Industry Research Zone.
Hall 9: Core Leading Components Hall, Basic Components, Passive Components, Semiconductor Equipment and Core Components, Semiconductor Discretes, Connectors, Sensors, Future Network Information.

Please contact the exhibition organizer before participating in the exhibition to confirm.

• Telephone:13162209353
• Contact:Li Yan
• Mobile:13162209353
• E-mail:2543368807@qq.com
• Address:Intersection of Fuhua 3rd Road and Jintian Road, Futian District, Shenzhen, Guangdong Province

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