Focus on it!2027 Shenzhen International Electronic Resin Industry Development Conference and Exhibition

2027 Shenzhen International Electronic-Grade Resin Industry Development Conference & Exhibition

Date: April 9-11, 2027 Location: Shenzhen Convention and Exhibition Center

Electronic grade epoxy resin exhibition, special electronic resin exhibition, semiconductor epoxy resin exhibition, copper-clad laminate epoxy resin exhibition

Exhibition Introduction:
Electronic resin is one of the three core materials for manufacturing PCBs, and its characteristics play an important role in achieving PCB performance. In recent years, with the rapid development of AI technology, the market demand for high-frequency and high-speed PCBs has grown sharply, directly promoting the upgrading and iteration of electronic resin technology.

Electronic grade resin, as the core basic material for PCB manufacturing and the "invisible chip" of computing infrastructure, directly determines the signal transmission efficiency and reliability of high-end equipment such as 5G base stations and AI servers based on its performance. In recent years, China has provided guidance for electronic grade resins to break through key technical indicators such as dielectric constant Dk<2.5 and dielectric loss Df<0.001 through the "Development Plan for Raw Material Industry", "Implementation Opinions on Improving Manufacturing Reliability", "Action Plan for High Quality Development of Computing Infrastructure", "Action Plan for High Quality Development of Computing Infrastructure", "Implementation Plan for Promoting Equipment Renewal in the Industrial Field", etc., promoting the industry to upgrade towards high-frequency, high-speed, green and low-carbon direction, and helping China seize the technological high ground in global electronic material competition.

The 2027 Shenzhen International Electronic Resin Industry Development Conference and Exhibition will be held from April 9-11, 2027 at the Shenzhen Convention and Exhibition Center. At the same time, in order to achieve a good effect of the conference and create an atmosphere of communication between new and old friends! This conference will be presented in the form of a report, interactive communication, and exhibition display. Invite senior experts in the industry, researchers from research institutes, well-known entrepreneurs, colleges and universities, and industry colleagues to interact and exchange ideas. Set up several conference topics, starting from industry pain points and blind spots, close to enterprise needs, and share high-quality reports on site. Welcome to take the time out of your busy schedule to attend the grand ceremony together!

Scope of exhibits:
1. Electronic resin raw materials:

1.1 Electronic grade epoxy resin: Bisphenol A-type epoxy, phenolic epoxy, cycloaliphatic epoxy, DCPD epoxy, low bromine/halogen-free epoxy, high Tg low Dk/Df high-frequency high-speed epoxy, semiconductor packaging specific epoxy resin, copper-clad laminate specific epoxy resin, etc;

1.2 High performance special electronic resins: benzoxazine resin, polyphenylene ether (PPE/PPO) resin, BT resin (bismaleimide triazine), cyanate ester resin, polyimide PI resin, liquid crystal polymer LCP resin, organosilicon electronic resin, polyurethane electronic resin, electronic resin, phenolic aldehyde electronic resin, etc;

1.3 Resin monomers and basic raw materials: Bisphenol monomers, phenolic monomers, acid anhydrides, functional monomers, reactive diluents, etc;

2. Supporting additives, fillers, and auxiliary materials:

Curing agents, accelerators, toughening agents, flame retardants, coupling agents, defoamers, rheology regulators, antioxidants, release agents; Silicon powder, aluminum oxide, boron nitride, aluminum hydroxide, inorganic filler, nano powder; Pre impregnated materials, adhesive films, semi cured resin systems, resin solutions, etc;

3. Resin downstream electronic material products:

3.1. Copper clad laminate (CCL) resin system, PCB substrate materials, high-frequency and high-speed board resins, flexible FPC resin materials, etc;

3.2. Semiconductor packaging resins: plastic packaging materials, bottom filling adhesives, wafer level packaging resins, chip bonding resins, packaging materials, etc;

3.3. Electronic ink and lithography matching resin: PCB solder mask ink, circuit ink, photoresist resin, photosensitive resin, etc;

3.4. Electronic potting/bonding resin: power device potting resin, thermal insulation resin, electronic structural adhesive, UV electronic adhesive, etc;

4. Production, processing, and environmental protection equipment:

Reactor, disperser, grinder, stirring system, filtration and purification equipment, resin synthesis production line, resin coating equipment, automatic batching system; Curing equipment, molding molds; VOC waste gas treatment, wastewater treatment, resin recycling and regeneration equipment; Hazardous waste treatment, green synthesis process equipment, etc;

5. Testing instruments, analytical equipment, and quality control:

Dielectric constant/dielectric loss tester, thermogravimetric analyzer TGA, differential scanning calorimetry DSC, rheometer, gel time tester, thermal expansion coefficient CTE tester; Testing equipment for viscosity, purity, water absorption, and flame retardancy; Material reliability aging testing equipment, etc;

6. Technical services, research institutions, and solutions:

Resin formula research and development, material simulation, material performance testing and certification, process consulting; Universities, research institutes, and testing institutions; High frequency high-speed PCB, advanced semiconductor packaging, AI computing power board, new energy vehicle electronics, optical module matching resin overall solution, etc;

7. Application terminal:

Computing power servers, optical communication modules, PCB/carrier boards, semiconductor packaging, new energy vehicle electronics, energy storage electronic control, display panels, consumer electronics, radar and military electronic applications, etc;

Target audience

Terminal enterprises such as AI servers/data centers, communication equipment, automotive electronics, consumer electronics, PCB production enterprises, suppliers of copper-clad laminates (CCL), bonding sheets, ceramic substrates, key material enterprises such as special resins, electronic glass fiber yarns/fabrics, electronic copper foils, silicon micro powders, copper balls/copper powders, specialized chemicals for copper deposition/electroplating, photosensitive films, CBF/ABF laminated films, core equipment solution providers such as lamination, exposure, development, etching, drilling, chemical copper deposition/electroplating, testing, as well as universities and research institutes;

Exhibition matters
1. Exhibitors shall fill in the "Exhibition Contract Form" in detail and affix their official seal, and mail or fax it to the organizing committee;
2. The organizing committee has received the confirmation application form. Exhibitors must transfer 50% or the full amount of the exhibition fee to the organizing committee's account within 5 working days, and fax the remittance voucher to the organizing committee for verification. Otherwise, the reserved booth will not be retained.
3. The booth arrangement is based on the principle of "first come, first paid, first arranged", and the organizing committee has the right to adjust a small number of booths;
4. The transportation of exhibits, exhibition reception, accommodation and other matters will be separately sent by the organizing committee in the form of an "Exhibitor Handbook" one month before the event.

Exhibition Consultation

Baoli Exhibition Planning (Shanghai) Co., Ltd
Hotline: 021-52237201
Contact: Mr. Zhang 13162771109

Scope of exhibits:
1. Electronic resin raw materials:

1.1 Electronic grade epoxy resin: Bisphenol A-type epoxy, phenolic epoxy, cycloaliphatic epoxy, DCPD epoxy, low bromine/halogen-free epoxy, high Tg low Dk/Df high-frequency high-speed epoxy, semiconductor packaging specific epoxy resin, copper-clad laminate specific epoxy resin, etc;

1.2 High performance special electronic resins: benzoxazine resin, polyphenylene ether (PPE/PPO) resin, BT resin (bismaleimide triazine), cyanate ester resin, polyimide PI resin, liquid crystal polymer LCP resin, organosilicon electronic resin, polyurethane electronic resin, electronic resin, phenolic aldehyde electronic resin, etc;

1.3 Resin monomers and basic raw materials: Bisphenol monomers, phenolic monomers, acid anhydrides, functional monomers, reactive diluents, etc;

2. Supporting additives, fillers, and auxiliary materials:

Curing agents, accelerators, toughening agents, flame retardants, coupling agents, defoamers, rheology regulators, antioxidants, release agents; Silicon powder, aluminum oxide, boron nitride, aluminum hydroxide, inorganic filler, nano powder; Pre impregnated materials, adhesive films, semi cured resin systems, resin solutions, etc;

3. Resin downstream electronic material products:

3.1. Copper clad laminate (CCL) resin system, PCB substrate materials, high-frequency and high-speed board resins, flexible FPC resin materials, etc;

3.2. Semiconductor packaging resins: plastic packaging materials, bottom filling adhesives, wafer level packaging resins, chip bonding resins, packaging materials, etc;

3.3. Electronic ink and lithography matching resin: PCB solder mask ink, circuit ink, photoresist resin, photosensitive resin, etc;

3.4. Electronic potting/bonding resin: power device potting resin, thermal insulation resin, electronic structural adhesive, UV electronic adhesive, etc;

4. Production, processing, and environmental protection equipment:

Reactor, disperser, grinder, stirring system, filtration and purification equipment, resin synthesis production line, resin coating equipment, automatic batching system; Curing equipment, molding molds; VOC waste gas treatment, wastewater treatment, resin recycling and regeneration equipment; Hazardous waste treatment, green synthesis process equipment, etc;

5. Testing instruments, analytical equipment, and quality control:

Dielectric constant/dielectric loss tester, thermogravimetric analyzer TGA, differential scanning calorimetry DSC, rheometer, gel time tester, thermal expansion coefficient CTE tester; Testing equipment for viscosity, purity, water absorption, and flame retardancy; Material reliability aging testing equipment, etc;

6. Technical services, research institutions, and solutions:

Resin formula research and development, material simulation, material performance testing and certification, process consulting; Universities, research institutes, and testing institutions; High frequency high-speed PCB, advanced semiconductor packaging, AI computing power board, new energy vehicle electronics, optical module matching resin overall solution, etc;

7. Application terminal:

Computing power servers, optical communication modules, PCB/carrier boards, semiconductor packaging, new energy vehicle electronics, energy storage electronic control, display panels, consumer electronics, radar and military electronic applications, etc;

• Contact:Mr. Zhang
• Mobile:13162771109
• Address:Intersection of Fuhua 3rd Road and Jintian Road, Futian District, Shenzhen, Guangdong Province

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