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2026 High Tech Fair Asia AI Computing Power and Data Center Liquid Cooling Technology Exhibition
Industry: Communications / Electronics
Cycle: Once a year
Time: 2026/11/26 - 11/28 (Thur To Sat Total 3 Days)    Error Correction
Address: Guangdong Shenzhen International Convention and Exhibition Center (New Building) ChinaGuangdong ProvinceShenzhenBao'an District No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen
Sponsor:Shenzhen Municipal People's Government
Organizer:Zhenwei Exhibition Group Shanghai Saimao Exhibition Co., Ltd
38Days To Go
  • Company:Shanghai Saimao Exhibition Co., Ltd
  • Telephone:021-61243975
  • Contact:Mr. Yang
  • Mobile:13585756185
  • E-mail:shskygq@163.com
  • Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

INTRODUCTION

2026 High Tech Fair Asia AI Computing Power and Data Center Liquid Cooling Technology Exhibition - www.globalomp.com

2026 High Tech Fair Asia AI Computing Power and Data Center Liquid Cooling Technology Exhibition - www.globalomp.com

2026 High Tech Fair Asia AI Computing Power and Data Center Liquid Cooling Technology Exhibition

Date: November 26-28, 2026 Address: Shenzhen International Convention and Exhibition Center (Bao'an)

The China International High tech Fair (CIFTIS), known as the first exhibition of Chinese technology, will create a vertical professional sub exhibition in 2026- the Asia AI Computing Power Industry and Data Center Liquid Cooling Technology Exhibition. Focusing on the needs of AI high-density computing power heat dissipation and data center green and low-carbon transformation, relying on the advantages of the national level science and technology innovation platform of the CIFTIS, it will create the industry benchmark exhibition for the Asia Pacific liquid cooling industry with the largest scale, most comprehensive resources, and highest commercial conversion efficiency, helping enterprises seize the trillion dollar computing power liquid cooling blue ocean market.

1、 Supported by national authoritative platforms, comprehensive aggregation of industrial resources across all dimensions

This year's High Tech Fair, approved by the State Council, is one of the three national level exhibitions in China, along with the Canton Fair and the China International Import Expo. Its industry credibility and international influence are irreplaceable. The total exhibition area of this exhibition is 400000 square meters, gathering more than 5000 science and technology innovation enterprises from around the world. It is expected to receive 450000 professional visitors from home and abroad in three days, radiating to more than 120 countries and regions around the world.

Planning of Liquid Cooling Special Exhibition Area30000 ㎡ exclusive exhibition hallAdopting a three exhibition linkage mode of computing power, data center, and liquid cooling technology, the top enterprises have an unprecedented lineup: Huawei, Inspur, Zhongke Shuguang, Yingweike, ZTE, CATL, Gree, Yibillion Ke and other industry leaders will participate in the exhibition, releasing a complete set of high-density liquid cooling solutions with PUE as low as 1.15 or below and single cabinet capacity of over 50kW, showcasing cutting-edge technologies in immersion, cold plate, and spray liquid cooling across all categories.


Scope

00001. Immersion/Cold Plate Liquid Cooling Machine Solution PavilionLiquid cooled servers, high-density liquid cooled cabinets, fully immersed liquid cooled machine rooms, and single cabinet ultra high density heat dissipation complete sets of equipment, suitable for the construction of large-scale intelligent computing centers and the renovation of air-cooled machine rooms.

00002. Liquid cooled core components sectionCore supporting components such as cold plates, liquid cooled pipelines, quick couplings, high-efficiency pump valves, sealing components, heat exchange modules, temperature control sensors, flow control systems, etc.

00003. New Heat Dissipation Materials and Coolant ZoneInsulating coolant, fluorinated liquid, heat conduction gel, heat conduction gasket, anti-corrosion sealing material, lightweight metal heat dissipation base material, new composite heat conduction material.

00004. Data center infrastructure supporting areaModular data center, prefabricated computer room, UPS uninterruptible power supply, high-voltage power supply and distribution, intelligent fire protection, computer room environment monitoring, intelligent operation and maintenance management platform.

00005. AI Computing Power and Server ZoneGPU/DPU computing server, large model training machine, edge computing node, high-density computing cluster, distributed storage device.

00006. Energy storage and new energy liquid cooling heat dissipation zoneLiquid cooled temperature control for energy storage power stations, thermal management for power batteries, liquid cooled cooling systems for supercharging stations, and temperature control equipment for wind, solar, and photovoltaic energy storage.

00007. Liquid cooling engineering and EPC general contracting zoneOverall planning of data center, general contracting for liquid cooling room renovation, energy-saving renovation solutions, room operation and maintenance hosting, and energy consumption monitoring optimization services.

00008. Industrial Investment and Financing and Scientific Research Achievement Transformation ZoneUniversity laboratories, cutting-edge scientific research achievements of the National Supercomputing Center, investment institutions in the computing power industry, transfer of liquid cooling technology patents, and platform for industry university research cooperation docking.


Costs & Precautions

Please contact the exhibition organizer before participating in the exhibition to confirm.

2026 High Tech Fair Asia AI Computing Power and Data Center Liquid Cooling Technology Exhibition - www.globalomp.com

2026 High Tech Fair Asia AI Computing Power and Data Center Liquid Cooling Technology Exhibition - www.globalomp.com

Contact

  • Company:Shanghai Saimao Exhibition Co., Ltd
  • Telephone:021-61243975
  • Contact:Mr. Yang
  • Mobile:13585756185
  • E-mail:shskygq@163.com
  • Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

Disclaimer

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870

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