Edge AI and embedded artificial intelligence are the core carriers for artificial intelligence to sink from the cloud to the terminal. Relying on the advantages of low latency, high reliability, local data processing, and controllable privacy and security, it has deeply integrated into many fields such as industrial intelligent manufacturing, intelligent automobiles, robots, smart cities, consumer electronics, and the Internet of Things, becoming a key computing power base for the deep integration of the digital economy and the real economy. The domestic industry is in a critical upward period of accelerated technological iteration and commercial scale landing. From the current situation of the industry, China has formed a relatively complete industrial chain layout of "chip hardware embedded system lightweight algorithm industry solutions terminal applications". At the hardware level, domestic edge AI chips, NPUs, AIMCUs, and RISCV embedded processors are rapidly emerging. A group of local enterprises have launched inference acceleration chips that are suitable for low-power scenarios, gradually achieving practical applications in industrial vision, security terminals, smart homes, and other fields. In terms of software ecology, TinyML's lightweight model, end-to-end large model pruning optimization, embedded operating system, and one click model deployment tool are becoming increasingly mature, greatly reducing the technical threshold for small and medium-sized enterprises to develop edge intelligent products.

On the market application side, the industry landing scenarios are constantly expanding. In the industrial field, embedded AI is widely used for equipment fault detection, visual quality inspection, and intelligent monitoring of production lines, achieving real-time autonomous judgment of production equipment; Intelligent cars, humanoid robots, and service robots rely on edge embedded computing power to achieve environmental perception and motion control, meeting millisecond level response requirements; A large number of edge visual terminals are deployed in scenarios such as smart cities, security monitoring, and drone inspections, effectively reducing the bandwidth pressure on cloud transmission. At the same time, consumer electronics, smart homes, and wearable devices are constantly adding local AI inference functions, and embedded intelligence is entering the mainstream terminal products. However, the industry still faces many challenges in its development. High end and energy-efficient edge chips, as well as dedicated IP cores, partially rely on overseas technology; The software and hardware ecosystem is severely fragmented, with insufficient compatibility between hardware and frameworks from different manufacturers; The optimization cost of adapting lightweight large models to embedded terminals is relatively high, and small and medium-sized developers have limited resources. In addition, there are many homogenization schemes, long customized development cycles for segmented scenarios, and long commercial return cycles for some applications in the industry, which restrict further rapid expansion of the industry.

The future edge AI and embedded artificial intelligence industries will usher in a new round of growth opportunities. The deployment of small parameters and large models on the end side will become the norm, and more and more intelligent terminals can independently complete voice, visual, and multimodal perception tasks without relying on the cloud. The hybrid collaborative architecture of cloud edge terminals will become mainstream. The focus of industrial competition will also shift from simply competing in computing power to comprehensive ability competition with high energy efficiency, low power consumption, and high stability, which is more in line with the practical needs of limited power consumption in embedded devices. With the explosion of humanoid robots and embodied intelligence industries, embedded edge computing power will serve as the "cerebellum" of robot bodies, supporting real-time interaction between robots and the physical world, and opening up a huge incremental market. The acceleration of intelligent transformation in industries such as industry, energy, and transportation will generate a large demand for customized embedded AI solutions. At the same time, the domestic chip and supporting software ecosystem continues to improve, the independent and controllable level of the industrial chain steadily increases, and the industry development tool chain continues to simplify, which will further accelerate the technological sinking and empower the vast number of small and medium-sized enterprises. In the long run, edge AI and embedded intelligence will achieve the perception and intelligence of all things, becoming an indispensable foundation for the intelligent upgrading of various industries, and the market growth space is vast.

The 2027 China (Shenzhen) International Edge AI and Embedded Artificial Intelligence Exhibition adheres to the principles of specialization, internationalization, and branding, and strives to create an internationally influential industry event. The exhibition gathers guidance and empowerment from government regulatory units, collaborative participation from industry authoritative institutions, and gathers high-quality resources from upstream and downstream of the industrial chain. Its brand awareness and industry influence continue to rise, and it has become a core communication platform for industry enterprises to gain insight into cutting-edge information, analyze market trends, showcase brand strength, expand commercial channels, and explore strategic cooperation opportunities. With excellent exhibition results and high-quality business services, the exhibition has gained widespread recognition and high praise from participating enterprises and professional audiences. Based on the advantages of the Guangdong Hong Kong Macao Greater Bay Area's opening up to the outside world and the clustering of intelligent manufacturing industries, the exhibition focuses on upgrading end side computing power, replacing domestic chips, and implementing embedded technology applications. It is committed to promoting the deep integration of high-quality products, core technologies, and solutions in China's edge AI and embedded artificial intelligence fields into the global supply chain system, promoting high-level exchanges and cooperation between the industry and industrial resources around the world, building a new industrial pattern of mutual benefit and collaborative development, and helping China's edge AI and embedded intelligence industries to enter the global market with high quality.

At the same time as this exhibition, a series of high-level international summits, cutting-edge technology seminars, and industry themed forums will be launched. The event will focus on in-depth discussions on cutting-edge industry topics such as the large-scale implementation of edge models, innovation in lightweight artificial intelligence algorithms, autonomous controllability of embedded core chips, end-to-end cloud collaborative architecture, hardware iteration of intelligent terminals, and security and compliance governance of embedded systems. Bringing together top experts, scholars, representatives of leading enterprises, research institutes, and technology research and development institutions from home and abroad, we explore the technological evolution path of the global edge intelligent industry, analyze the pain points and opportunities of industry development, promote cross-border technology exchanges, deep collaboration between industry, academia, and research, and efficient docking of innovative resources, and build an open, win-win, and interconnected international high-end industrial ecosystem.

1、 Edge AI, embedded core chips, and computing hardware

Edge AI chips, NPUs, AI accelerators, MCUs, MPUs, SoCs, FPGAs, DSPs, RISC V processors, automotive/industrial grade processors, AI IP cores, storage chips, power semiconductors, power management chips, sensor chips, and other computing core components.

2、 Edge computing hardware, embedded modules and carrier devices

Edge gateway, edge AI box, industrial edge server, embedded motherboard, core computing module, development board, fanless industrial computer, human-computer interaction terminal, reinforced embedded device, AIoT intelligent hardware, end-to-end cloud collaborative hardware platform.

3、 Sensors, sensing and signal acquisition supporting devices

MEMS sensors, visual sensors, LiDAR, infrared sensors, acoustic sensors, environmental perception modules, positioning and navigation modules, wireless communication modules, connectors, passive components, embedded power modules, heat dissipation components and other supporting hardware.

4、 Embedded operating systems, software, algorithms, and AI toolchains

Embedded real-time operating systems, Linux embedded systems, firmware, drivers, middleware; Lightweight AI algorithm, TinyML technology, end-to-end large model, model quantization clipping tool, reasoning framework; Develop debugging, simulation testing, software and hardware in the loop testing tools, secure encryption software, embedded security solutions.

5、 Edge AI vision, speech, and multimodal intelligent solutions

Embedded machine vision module, intelligent AI camera, offline speech recognition module, multimodal perception terminal, humanoid robot end side control system, embedded motion control solution.

6、 Industry Embedded and Edge AI Implementation Solutions

Industrial field: intelligent manufacturing quality inspection, equipment predictive maintenance, industrial Internet of Things, embedded control systems for production lines;

Intelligent vehicles and travel: in vehicle domain controllers, autonomous driving edge perception, embedded systems for vehicle regulations;

► Robotics field: edge cerebellar control systems for humanoid robots, service robots, and mobile robots;

Smart City: Smart Security, Edge Video Analysis, Smart Parks, Traffic Perception Terminals;

► Consumer electronics, smart home, wearable devices, medical embedded terminals, energy and power, low altitude inspection, logistics and warehousing, etc. ► Vertical scene edge intelligent overall solution.

7、 Research achievements, industrial support and services

Innovation achievements of university research institutes, testing and certification services, solution integrators, cloud edge end collaborative platforms, industry media, industrial parks, investment and financing institutions, etc.

• Company:Shanghai Yewen Exhibition Service Co., Ltd
• Telephone:021-54388602
• Contact:Li Cheng
• Mobile:13122870856
• E-mail:2410927403@qq.com
• Address:Intersection of Fuhua 3rd Road and Jintian Road, Futian District, Shenzhen, Guangdong Province

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