2027 Hangzhou International PCB and Intelligent Manufacturing Equipment Exhibition

Date: May 27-29, 2027 Location: Hangzhou Grand Convention and Exhibition Center

Host and Strategic Unit

Zhejiang Artificial Intelligence Society

Zhejiang Semiconductor Industry Association

Zhejiang Robot Industry Development Association

Zhejiang Computer Information System Integration Industry Association

Golden Exhibition Group

organizing unit

Hangzhou Changxin International Exhibition Management Co., Ltd

Simultaneously held: The 2nd Hangzhou International Semiconductor and Integrated Circuit Innovation Exhibition

Exhibition Overview

Printed circuit board (PCB) is known as the "mother of electronic products" and is the core carrier for achieving electrical interconnection of chips. IC carrier board and high-frequency high-speed PCB are key basic materials for advanced packaging, Chiplets, and AI computing chips. Driven by AI computing power, new energy vehicles, and the third-generation semiconductor industry, there is an explosive demand for high-end IC carrier boards, high-frequency high-speed boards, and high multilayer boards in China, accelerating the process of domestic substitution; At the same time, the PCB industry is comprehensively promoting production line automation and digital upgrading, and the market demand for intelligent manufacturing equipment and intelligent testing equipment continues to rise.

The Yangtze River Delta is a core gathering place for the domestic PCB and IC board industry. Jiangsu and Zhejiang have a large number of PCB finished product factories, material and equipment enterprises, and downstream semiconductor, computing power, and new energy industries have complete supporting facilities, possessing unique industrial location advantages.

As the core supporting sub section of the Changxin Exhibition, this exhibition area deeply collaborates with the main exhibition semiconductor industry chain: the Changxin main exhibition gathers IC design, wafer manufacturing, advanced packaging Chiplet、 Third generation semiconductor and AI chip companies, a large number of chip companies urgently need to find reliable IC carrier boards and high-frequency high-speed PCB supply chains; The PCB exhibition area fills in the key link of "chip substrate hardware manufacturing", achieving face-to-face interaction between upstream chip enterprises and PCB/carrier board and intelligent manufacturing equipment enterprises. Share all pre registered professional visitors, forum system, supply and demand matching meetings, and media promotion resources of Changxin Exhibition, without the need for independent drainage, accurately serving the upstream and downstream of the semiconductor industry chain, and connecting the complete chain from chip design to hardware manufacturing.

target audience

1. Semiconductor companies: IC design companies, advanced packaging/testing factories, Chiplet R&D companies, third-generation semiconductor, power device, AI/storage chip procurement companies, R&D engineers;

2. PCB industry chain: equipment procurement, process research and development, and quality departments of PCB/FPC/IC carrier board production enterprises, copper-clad laminates and material manufacturers;

3. Downstream terminals: AI servers, computing hardware, new energy vehicle electronics, communication equipment, industrial control, consumer electronics hardware manufacturers;

4. Research institutes, microelectronics related laboratories in universities, industrial parks, and government industry regulatory departments;

5. Investment institutions, industry associations, traders, system integrators.

Exhibition Scope

1. Various types of circuit board products: rigid PCB, flexible FPC, rigid flex joint board, high-frequency and high-speed board, thick copper plate, special circuit board;

2. Key raw and auxiliary materials for PCB: copper-clad laminate, semi cured sheet, ink, dry film, solder mask, copper foil, drilling and grinding consumables, etc;

3. PCB intelligent manufacturing process equipment: drilling, electroplating, pressing, etching, gold deposition, solder mask, forming equipment, LDI exposure, laser processing equipment;

4. Testing and Inspection Equipment: AOI Optical Testing, AXI X-ray Testing, Impedance Testing, Flying Needle Testing Equipment;

5. Automated production line and digitalization solution: PCB automated production line, AGV logistics system, MES manufacturing execution system, factory digitalization, and overall intelligent manufacturing solution for environmental protection processing.

Exhibition participation fee

Kind reminder: For specific marketing opportunities, sponsorship plans, and booth fee standards, please contact the sales manager of the organizing unit to obtain them

A. Standard booth size of 9 square meters per unit (3M * 3M)

B. Indoor open space:

Note: (Minimum rental area of 36 square meters) "bare space" only provides exhibition area and does not include display racks, exhibition equipment, carpets, power supplies, etc.

The following attachments can be obtained from the organizing committee

1. Exhibition Application Form (Contract) 2. Exhibition Booth Map 3. Advertising Sponsorship and Application Form

Exhibition Contact

Mobile/WeChat: 159 2108 9962 (WeChat note: Company participates in PCB exhibition)

Phone/Tel: (86-21) 6047-2525

Exhibition Scope

1. Various types of circuit board products: rigid PCB, flexible FPC, rigid flex joint board, high-frequency and high-speed board, thick copper plate, special circuit board;

2. Key raw and auxiliary materials for PCB: copper-clad laminate, semi cured sheet, ink, dry film, solder mask, copper foil, drilling and grinding consumables, etc;

3. PCB intelligent manufacturing process equipment: drilling, electroplating, pressing, etching, gold deposition, solder mask, forming equipment, LDI exposure, laser processing equipment;

4. Testing and Inspection Equipment: AOI Optical Testing, AXI X-ray Testing, Impedance Testing, Flying Needle Testing Equipment;

5. Automated production line and digitalization solution: PCB automated production line, AGV logistics system, MES manufacturing execution system, factory digitalization, and overall intelligent manufacturing solution for environmental protection processing.

• Telephone:159 2108 9962
• Contact:Chairman's Committee
• Mobile:159 2108 9962
• Address:West of the intersection of Meishi Line and Yannan Line in Xiaoshan District, Hangzhou City

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