Shanghai International Embodied Intelligence Industry Expo (CIEI2027) - a cutting-edge integrated international exhibition platform focusing on the entire industry chain of "embodied intelligence". CIEI2027 aims to build a new value hub that goes beyond traditional exhibitions. We will take "technological innovation" as the pivot and "ecological integration" as the thread, not only gathering cutting-edge technology and top enterprises from around the world, but also deeply cultivating the core scenarios of business cooperation, co creation of ideas, and future insights.

At CIEI2027, global industrial chain resources will be efficiently linked, from key technologies, core components, system integration to diverse scenario applications, forming a closed loop. We are fully committed to promoting the widespread implementation of human-machine collaboration from a conceptual perspective, accelerating the systematic upgrading of the industrial ecosystem, and jointly creating a world-class intellectual and industrial feast that defines the future landscape of intelligent equipment.
CIEI2027- Empowering the present, envisioning the future, and co creating the next era of growth under the name of embodiment.

Embodied intelligent ontology: robots, drones, intelligent cars, others
Perception system: perception sensors (visual sensors/LiDAR), tactile sensors (force sensors), encoders/inertial navigation/GPS (position), decision cognition system: chips (hardware), software algorithms, motion capture execution system: bearings, hollow cup motors, dexterous hands, precision planetary reducers (applied to rotary joints), harmonic reducers (applied to rotary joints), frameless torque motors (applied to large joints), ball screws/planetary roller screws (used for linear joints)
Battery energy storage system: battery, energy storage equipment, power management system, charging equipment Automotive intelligent networking: automobile chip, wireless communication technology, auto drive system, simulation system, radar, camera and other vehicle sensor application scenarios Case display: typical cases of embodied intelligence, characteristic scenes of embodied intelligence, new products display of embodied intelligence, integration of industry, education and research in parks with embodied intelligence characteristics: universities, secondary vocational schools, research platforms, talent cultivation centers
Manufacturing equipment: machining equipment, additive manufacturing (3D printing)

Please contact the exhibition organizer before participating in the exhibition to confirm.

• Contact:Gao Jing
• E-mail:657874351@qq.com
• Address:695 Huilong Road, Qingpu District, Shanghai

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