2027 Hangzhou International Semiconductor Integrated Circuit Exhibition

Exhibition time: May 27-29, 2027

Exhibition location: Hangzhou Grand Convention and Exhibition Center

Exhibition Objective: Core Gathering Qiantang, Intelligent Connection Worldwide

Organizational unit:

Approved by the Ministry of Commerce of the People's Republic of China

Guidance unit: China Semiconductor Industry Association

Host: Zhejiang Semiconductor Industry Association

Shanghai Gaodeng Exhibition Group Co., Ltd

Co organizer: Hangzhou National "Xinhuo" Innovation and Entrepreneurship Base (Platform)

Undertaking Unit: Hangzhou Changxin International Exhibition Management Co., Ltd

Exhibition Objective: Core Gathering Qiantang, Intelligent Connection Worldwide

Exhibition Introduction:

With the rapid iteration of the global digital economy, artificial intelligence, new energy vehicles, and high-end advanced manufacturing, integrated circuits, as the core foundation supporting national scientific and technological self-reliance, have officially entered the golden development era of domestic substitution acceleration and coordinated progress of the entire industry chain. The Yangtze River Delta gathers the most complete and resource rich integrated circuit industry cluster in China, while Hangzhou has the unique industrial endowment of being the "first city of China's digital economy", gathering massive terminal application demands, top university research platforms, and diversified industrial capital. It is a core strategic hub connecting chip design, wafer manufacturing, packaging and testing, semiconductor equipment materials, and downstream applications, providing an irreplaceable development fertile ground for industrial collaborative innovation and precise supply-demand matching. The grand finale of the 2026 Hangzhou Changxin Exhibition has delivered a stunning performance that shook the industry: the exhibition boasts nearly 30000 square meters of professional exhibition space, gathering 173 domestic and foreign industry leaders and top research institutions to showcase, and linking more than 600 high-quality upstream and downstream enterprises to exchange ideas on the same stage; Accumulatively attracting 30000 precise professional visitors to attend the exhibition and negotiate, the total amount of cooperation intention reached on site reached up to 13.9 billion yuan, and the commercial landing effect was remarkable.

At the same time, 16 high-level industry summit forums were held, innovatively building a five in one comprehensive industry service platform of "exhibition+forum+supply and demand docking+industry investment+talent introduction". With professional and highly effective exhibition capabilities, it has received high praise and unanimous recognition from the national semiconductor industry. Inheriting the fruitful achievements of the first industry, we will embark on a new chapter of industrial glory! In order to continuously build a top-level communication and cooperation carrier for integrated circuits that connects the world and radiates across the country, the 2027 Second Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Exhibition (Hangzhou Changxin Exhibition) has officially opened a global exhibitor attraction channel. The exhibition is scheduled to land at the Hangzhou Convention and Exhibition Center from May 27th to 29th, 2027. With the core purpose of "gathering chips in Qiantang and connecting the world intelligently", relying on the advantages of Hangzhou's digital economy industry and the strong potential of the Yangtze River Delta integrated circuit cluster, we sincerely invite global semiconductor industry chain enterprises to visit Qiantang, gather chips and strength, and jointly embark on a new journey of high-quality development of the domestic semiconductor industry!

Core mission and original intention of the exhibition:

Based on the core location of the integrated circuit industry in the Yangtze River Delta, in response to the national strategic deployment of independent and controllable integrated circuits and technological self-reliance, we aim to build an international industrial platform that integrates integrated product display, commercial transactions, technology seminars, capital docking, and talent cultivation.

① Integrate chip design, wafer manufacturing, packaging and testing, equipment materials EDA、 Advanced packaging and AI chip full industry chain, showcasing breakthroughs and innovative achievements in domestic semiconductor cutting-edge technology;

② Promote precise supply-demand matching between upstream and downstream enterprises, break down information barriers, facilitate project signing and long-term strategic cooperation, accelerate the commercialization of high-end chips and core components in new energy vehicles, humanoid robots, high-end medical and other scenarios;

③ Linking the industrial clusters of Shanghai, Wuxi, and Suzhou, deepening regional industrial synergy, filling in the gaps in the industrial chain, and building a safe, stable, independent, and controllable local semiconductor supply chain system;

④ Gather academicians, industry experts, leading enterprises, and venture capital institutions to hold high-end forums, analyze industry trends, jointly solve technological bottlenecks, and promote the integration of the industrial chain, innovation chain, capital chain, talent chain, and policy chain;

⑤ Relying on the massive downstream application market of Hangzhou's digital economy and the research resources of top universities, we assist enterprises in expanding their customer base, upgrading their brands, attracting talent and intelligence, and landing financing, guiding the industry to develop in depth towards high-end, intelligent, and domestically produced products;

⑥ Strengthen the competitiveness of the world-class integrated circuit industry cluster in the Yangtze River Delta, smooth the domestic and international industrial cycle, promote the deep integration of the domestic semiconductor industry into the global value chain, and assist in the high-quality and high-speed development of the industry.

Previous hardcore strength, this year's new upgrade:

① Complete exhibition matrix for the entire industry chain

Covering EDA tools, chip design, wafer manufacturing, advanced packaging testing, high-end semiconductor equipment, key electronic chemicals, third-generation semiconductors, Chiplets, AI computing chips, integrated storage and computing, photonics integration, RISC-V ecosystem, and full scenario terminal applications, fully covering the upstream, midstream, and downstream industries.

② Highly valuable and precise professional audience invitation

Targeted global invitations for procurement leaders and technical decision-makers from semiconductor manufacturing, packaging and testing, equipment and material manufacturers, vehicle manufacturers, AI computing service providers, medical electronics, aerospace, research institutions, and industrial investment institutions; Strictly control the quality of the audience, eliminate ineffective traffic, and ensure efficient business negotiations.

③ Global Media Matrix Exposure

Collaborate with over 300 domestic and international vertical industry media, short video platforms, industry live broadcasts, and industry columns for full cycle promotion. Promote enterprise new products, technical solutions, and brand stories in a three-dimensional manner across the entire network, rapidly enhancing industry awareness.

④ A heavyweight concurrent forum to grasp the forefront trends of the industry

Nine top-level industry summits will be held simultaneously: National Integrated Circuit Talent Ecology Conference, Hangzhou New Era Semiconductor Development Summit Forum, EDA Innovation Ecology Forum, Semiconductor Materials and Equipment Forum, Optoelectronic Integration Forum, Advanced Packaging Technology Summit, Intelligent Manufacturing Forum, RISC-V Ecological Co construction Summit, and Industry Investment Matchmaking Conference. Academicians, industry experts, top corporate executives, and venture capitalists gathered to interpret policies, analyze technological trends, and share the path of localization implementation.

Audience organization:

This exhibition will fully invite professionals from around the world in the fields of semiconductors, integrated circuits, electronic power, electronic manufacturing, display manufacturing, as well as automotive, aerospace, medical and health, information and communication, and consumer electronics to gather in Hangzhou to explore cutting-edge technologies, discuss cooperation plans, and work together to decode the new ecology of the industry, building an open, collaborative, and resilient "chip" future for the global semiconductor and integrated circuit industry.

Major categories of exhibits:

IC Design/Chips and Applications: IC and related electronic product design, EDA, AI computing chips, storage chips, automotive chips, smart home appliance chips, artificial intelligence chips, IoT, artificial intelligence, automotive electronics, smart cities, intelligent terminals, health and medical products, etc;

IC manufacturing: semiconductor wafer manufacturing, semiconductor packaging and testing technology and products;

Advanced packaging: design, materials, testing, equipment, etc. for flip chip, bump, wafer level packaging, 2.5D/3D advanced packaging (TSV and TGV), fanout wafer level packaging, etc;

Wafer equipment/packaging and testing equipment: various precision equipment and semiconductor packaging equipment, semiconductor testing equipment, IC testing instruments, advanced packaging technology (such as SiP, 3D packaging) equipment, power device equipment, etc. required in the wafer processing process;

Compound semiconductors and power devices: Compound semiconductor materials (such as GaN, SiC, etc.) and related products, including power devices, RF devices, upstream equipment, materials, etc;

Semiconductor materials: monocrystalline silicon, silicon wafers and silicon-based materials, polishing pads, masks, sputtering targets, polishing solutions, etching solutions, ceramic packaging materials, bonding wires, lead frames, packaging substrates, photoresists, thin film deposition materials, specialty gases, ultrapure water, plastic packaging materials, high-performance plastics, etc;

Semiconductor core components: machine vision, sensors, sealing rings, precision bearings, metal components, valve valves, silicon/SiC parts Robots、 Quartz components, filters, RF power supplies, ceramic components, ESC electrostatic suction cups, pressure gauges, pumps, MFC flow meters, stepper motors, motion control, servo motors, linear modules, dust-free drag chains, packaging molds, refrigeration equipment, induction heaters, etc;

AI computing power: AI chips, servers, switches, power supplies, liquid cooled temperature control, etc;

Supporting facilities and services: support products/cleanrooms, general business services/consulting, sales and services, standards and others.

If you want to book a booth for the "SICE 2027" procurement trade fair or learn more information, please contact us through the following contact information:

Exhibition inquiry; Manager Qian+86 187 2102 0295 (same WeChat account)

• Telephone:187 2102 0295
• Contact:Manager Qian
• Mobile:187 2102 0295
• Address:West of the intersection of Meishi Line and Yannan Line in Xiaoshan District, Hangzhou City

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870