2027 Beijing International Optical Module Industry Exhibition

Date: March 24-26, 2027 Location: Beijing Yichuang International Convention and Exhibition Center

Exhibition theme: "Building the foundation with optical modeling and intelligent computing power"

Organizer

DeFei Exhibition (Shanghai) Co., Ltd

Undertaking Unit:

DeFei Exhibition (Shanghai) Co., Ltd

Exhibition Overview

Currently, the construction of the global digital economy and computing power network is accelerating, and optical modules, as the core optoelectronic conversion devices in high-speed communication, data centers, artificial intelligence computing power networks, 5G/6G carrier networks, and industrial interconnection systems, are entering a critical cycle of rapid growth and technological upgrading. With the industrialization of 800G/1.6T and higher rate optical modules, coherent communication, silicon optical integration, optoelectronic chips, advanced packaging, high-speed interfaces, and testing and measurement technologies have become the focus of the industry. Beijing Yichuang International Convention and Exhibition Center is located in the core area of Beijing Economic Development Zone, gathering optical communication, electronic information, artificial intelligence, computing infrastructure and high-end manufacturing resources in the Beijing Tianjin Hebei region. It is an important platform for showcasing cutting-edge technologies and promoting industrial synergy.

In order to promote technological innovation and coordinated development of China's optical module industry and strengthen communication and cooperation between upstream and downstream enterprises, research institutions, system manufacturers, communication operators, data center users, and investment institutions, the 2027 Beijing International Optical Module Industry Exhibition will be held from March 24 to 26, 2027 at the Beijing Yichuang International Convention and Exhibition Center. The exhibition focuses on the innovative achievements of the entire industry chain of optical modules, showcasing high-speed optical modules, optoelectronic chips, optical devices, fiber optic connectors, silicon optical products, packaging and testing equipment, communication modules, and industry solutions. It provides a professional platform for the industry to showcase technology, connect with commerce, exchange information, and implement applications.

We sincerely invite enterprises, institutions, industry associations, research institutes, and colleagues from all walks of life in the fields of optical modules, optical communication, high-speed interconnection, optoelectronic chips, advanced packaging, testing and measurement, data centers, and intelligent manufacturing to actively participate and gather in Beijing to explore new opportunities for the development of the optical module industry!

Exhibition influence:

Expected exhibition area of nearly 40000 square meters

Nearly 800 exhibitors

More than 11 participating countries and regions

The expected number of professional visitors is nearly 50000 from 16 countries and 20 provinces and cities

Nearly 300 industry cooperation media from 16 countries and 20 provinces and cities around the world have fully promoted and reported on the exhibition, enjoying the influence of the exhibition

Simultaneous activities:

1. Global Forum on High Speed Optical Module Technology and Industry Development;

2. Seminar on Silicon Optical Integration and Optoelectronic Chip Innovation;

3. 800G/1.6T and higher speed optical module application summit;

4. Data Center and Computing Network Optical Interconnection Forum;

5. Salon for Advanced Packaging and Testing Technology of Optical Modules;

6. Special press conferences for new products and technologies;

7. Industry chain supply and demand docking meeting and investment and financing negotiation meeting.

Exhibition scope:

1. Optical module products: high-speed optical module, low-speed optical module, tunable optical module, coherent optical module, silicon optical module, active optical cable, optical transceiver module;

2. Optoelectronic chips and devices: laser chips, detector chips, optoelectronic integrated chips, modulators, optical amplifiers, optical switches, optical couplers;

3. Fiber optic and connectivity products: fiber optic cables, fiber optic connectors, adapters, optical splitters, wavelength division multiplexers, optical transmission equipment;

4. Packaging and testing equipment: optical module packaging equipment, coupling alignment equipment, testing instruments, error code analyzer, spectrometer, oscilloscope, reliability testing equipment;

5. Communication and network solutions: data center optical interconnection, 5G/6G carrier network, telecommunications transmission network, industrial optical communication, computing power network interconnection solutions;

6. Materials, supporting facilities and services: optical module materials, ceramic sleeves, lenses PCB、 Cooling materials, software algorithms, testing and certification, industry media, and industry service organizations.

Organizing Committee Secretariat:

Contact: Mr. Wang 132 6169 9659 (same as WeChat)

Phone: 021-5296 2655

Reminder: The earlier you register and confirm, the more advantageous your position will be!

Exhibition scope:

1. Optical module products: high-speed optical module, low-speed optical module, tunable optical module, coherent optical module, silicon optical module, active optical cable, optical transceiver module;

2. Optoelectronic chips and devices: laser chips, detector chips, optoelectronic integrated chips, modulators, optical amplifiers, optical switches, optical couplers;

3. Fiber optic and connectivity products: fiber optic cables, fiber optic connectors, adapters, optical splitters, wavelength division multiplexers, optical transmission equipment;

4. Packaging and testing equipment: optical module packaging equipment, coupling alignment equipment, testing instruments, error code analyzer, spectrometer, oscilloscope, reliability testing equipment;

5. Communication and network solutions: data center optical interconnection, 5G/6G carrier network, telecommunications transmission network, industrial optical communication, computing power network interconnection solutions;

6. Materials, supporting facilities and services: optical module materials, ceramic sleeves, lenses PCB、 Cooling materials, software algorithms, testing and certification, industry media, and industry service organizations.

• Telephone:132 6169 9659
• Contact:Mr. Wang
• Mobile:132 6169 9659
• Address:No. 6 Rongchang East Street, Yizhuang, Daxing District, Beijing

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