- Industry: Other Industry
- Time: 2027/04/09 - 04/11 (Fri To Sun Total 3 Days) Error Correction
- Address: Guangdong Shenzhen Convention and Exhibition Center (Futian District) ChinaGuangdong ProvinceShenzhenFutian District Intersection of Fuhua 3rd Road and Jintian Road, Futian District, Shenzhen, Guangdong Province
- Sponsor:2027 China (Shenzhen) International Target Material Products and Applications Exhibition - Organizing Committee
- Organizer:2027 China (Shenzhen) International Target Material Products and Applications Exhibition - Organizing Committee
- Telephone:150 000 33892
- Contact:Mr. Zhao
- Mobile:150 000 33892
- Address:Intersection of Fuhua 3rd Road and Jintian Road, Futian District, Shenzhen, Guangdong Province
INTRODUCTION
2027 China (Shenzhen) International Target Material Products and Applications Exhibition
Date: April 9-11, 2027 Location: Shenzhen Convention and Exhibition Center (Futian)
Exhibition Information:
Exhibition Date: April 9-11, 2027
Exhibition cycle: once a year
Exhibition scale: 50000 square meters, 80000 visitors
Exhibition location: Shenzhen Convention and Exhibition Center (Futian)
Conference Introduction:
With the rapid development of electronic device markets such as semiconductors, electronic information, integrated circuits, computers, and new displays, the demand for high-strength, high conductivity, and high-purity metal materials and target materials will continue to grow, with increasingly high performance and quality requirements. In order to promote the application and development of target material products, facilitate cooperation and exchange between industries, enterprises and markets, the exhibition provides a centralized display platform for new technologies, materials, products and the latest application technology achievements in various fields of China's target material industry. At the same time, it also plays a crucial role in showcasing the corporate image, promoting product brands, collecting market information and strengthening industry exchanges for target material enterprises. Target materials are also key core materials in the fields of semiconductors, display panels, heterojunction photovoltaics, etc. After more than ten years of industrial precipitation and technological iteration, by 2026, China's target material industry has formed a complete industrial system covering all categories of metal target materials, alloy target materials, ceramic target materials, composite target materials, etc. The full chain capability from upstream high-purity metal purification, midstream precision forming and microstructure control, and downstream end customer long-term certification continues to improve, and the overall industry maturity has greatly increased. Its voice and market position in the global target material industry have steadily strengthened. As an indispensable core material in high-end manufacturing processes such as semiconductors, new displays, high-efficiency photovoltaics, and precision coatings, the technological maturity, independent supply capability, and overall industry chain matching level of target materials directly determine the supply chain security boundary and product iteration limit of downstream electronic information industries. In 2026, against the backdrop of the continuous concentration of global high-end manufacturing capacity in China and the entry of electronic materials into the deep water zone with independent and controllable strategies, China's target material industry has completely bid farewell to the development path of long-term dependence on external technology supply and extensive expansion of mid to low end production capacity. It has entered a new stage of structural upgrading, continuous breakthroughs in the high-end track, and reconstruction of the entire chain value system.
In 2026, China's target material industry is at a critical turning point, transitioning from the traditional basic materials industry to the high-end strategic core materials industry. The structural optimization of the supply side, the continuous improvement of the industrial chain collaborative ecology, the steady expansion of the market size, and the high-end adjustment of the segmented structure will jointly promote the entire industry to enter a new stage of high prosperity development. Looking towards the future, breakthroughs in high-end technology, vertical integration of the entire industry chain, and enhanced global competitiveness in the target material industry will not only provide solid support for the supply chain security of downstream high-end manufacturing industries such as semiconductors, new displays, and new energy, but also promote China to occupy a more core strategic position in the global electronic basic materials industry, becoming an important growth pole to support the high-quality development of the domestic new materials industry during the 15th Five Year Plan period.
Looking ahead to the future from the perspective of 2027, the domestic target material industry will enter a new cycle of high-quality development driven by the continuous demand for high-end downstream manufacturing and the deep promotion of independent and controllable strategies. The entire industry will achieve a historic leap from a large-scale industrial country to a global high-end target material technology and supply powerhouse. In this context, the 2027 China (Shenzhen) International Target Material Products and Applications Exhibition will be held from April 9-11, 2027 at the Shenzhen Convention and Exhibition Center (Futian) with the support of various units. The exhibition will further expand the upstream and downstream industrial chain of the target material industry, showcase new technologies, equipment, and products in the target material industry at home and abroad, gather global technology industry giants and innovative energy, analyze trend fluctuations, deeply explore future technologies, innovative applications, and market development opportunities.
Previous review:
The previous session was attended by representatives from Stanford Advanced Materials Corporation, Ans Super Science Corporation, Kotler&Co., TOSOH, JX Nippon Mining&Metals, Honeywell, ULVAC, Praxair Praxair, Heraeus, and others Dongfang Tantalum Industry, Youyan Yijin, Panshi, Mitsubishi, Ashichuang, Jiangfeng Electronics, Yunxi Group, Oulai New Materials, Changxin Technology, China Tungsten High tech, Yunnan Germanium Industry, Wanshun New Materials, Sumitomo Chemical, Youmei Science and Technology, Chengdu Ultra Pure, Jinglian Optoelectronics, Fenglian Science and Technology, Hunan Nonferrous Metals, Antai Technology, Xinjiang Zhonghe, Sujing Electronics, Wuhu Yingri, Torch Antai, Lida Optoelectronics, Yeke Technology, Kodipu New Materials, Ningbo Senxiang, Jinduicheng, Lanzhou Vacuum, Youyi Semiconductor, Saili Coating, Zibo Vacuum, Willide, Zhongke Science and Technology, Beiyi Innovation, Shaanxi Oukaili, Baoji Titanium Industry and other companies participated in the visit. Nearly 80000 people attended the exhibition, with over 50 peak forums held during the same period and over 100 top media outlets reporting on it. The successful hosting of the exhibition was highly recognized by the relevant regulatory authorities, At the same time, a series of forward-looking, practical, and directional technical exchanges and new product releases, as well as multiple technical seminars and forums, will be held. Domestic and foreign expert leaders and industry representatives will be invited to interact and discuss industry development trends, share their respective experiences and achievements.
Exhibition scope:
Target material products:
Sputtering targets: high-purity cobalt targets, ultra-high purity metal sputtering targets, ultra-high purity alloy targets, copper and copper alloy targets, titanium and titanium alloy targets, metal sputtering coating targets, alloy sputtering coating targets, ceramic sputtering coating targets, ceramic sputtering targets, indium phosphide targets, lead arsenide targets, indium arsenide targets, composite sputtering targets, microelectronic targets, magnetic recording targets, optical disc targets, precious metal targets, thin film resistor targets, conductive film targets, surface modified targets, mask layer targets, decorative layer targets, electrode targets, packaging targets, metal targets, alloy targets, ceramic compound targets, square targets, circular targets, irregular targets and other targets.
Metal target materials: nickel target, titanium target, zinc target, chromium target, magnesium target, niobium target, tin target, aluminum target, indium target, iron target, zirconium aluminum target, titanium aluminum target, zirconium target, aluminum silicon target, silicon target, copper target, tantalum target, germanium target, silver target, cobalt target, gold target, gadolinium target, lanthanum target, yttrium target, cerium target, tungsten target, stainless steel target, nickel chromium target, hafnium target, molybdenum target, iron nickel target, tungsten target and other metal sputtering targets.
Ceramic target materials: ITO target, AZO target, magnesium oxide target, iron oxide target, silicon nitride target, silicon carbide target, titanium nitride target, chromium oxide target, zinc oxide target, zinc sulfide target, silicon dioxide target, silicon monoxide target, cerium oxide target, zirconium dioxide target, niobium pentoxide target, titanium dioxide target, zirconium dioxide target, hafnium dioxide target, titanium diboride target, zirconium diboride target, tungsten trioxide target, aluminum trioxide target, tantalum pentoxide target, niobium pentoxide target, magnesium fluoride target, yttrium fluoride target, zinc selenide target, aluminum nitride target, silicon nitride target, boron nitride target, titanium nitride target, silicon carbide target, lithium niobate target, praseodymium titanate target Ceramic sputtering targets such as targets, barium titanate targets, lanthanum titanate targets, recording medium ceramic targets, display ceramic targets, superconducting ceramic targets, giant magnetoresistance ceramic targets, nickel oxide targets, etc.
Alloy target materials: high-purity alloy sputtering targets such as iron nickel chromium alloy targets, nickel vanadium alloy targets, aluminum silicon alloy targets, nickel copper alloy targets, titanium aluminum alloy targets, nickel vanadium alloy targets, boron iron alloy targets, ferrosilicon alloy targets, etc.
Coating materials: anti reflective film, semi reflective film, crystal coating, infrared coating, ultraviolet coating, optical fiber coating, aluminum coating, color coating, coating, composite film, radium coating
Film, capacitor film, reflective film, filter film, spectral film, beam splitter, filter, bandpass film, cutoff film, high reflectivity film, metal film material, oxide
Fluoride, sulfide, titanate, mixtures and other film materials, coating evaporation materials; PVD coating, TiN coating, TiC coating, TiCN coating ZrN
Coating, CrN coating, MoS2 coating, TiAlN coating, TiAlN CN coating, TiN AlN coating, CNx coating, DLC coating, ta-C coating
Multi element composite coating with layers.
Low temperature superconducting thin film: Low melting point superconducting thin film: Low melting point superconducting thin film, alloy thin film; High melting point superconducting thin films: refractory metals, alloy thin films; Compound superconducting thin films: NbN and Nb3Sn, Nb3Ge thin films; High temperature superconducting thin film; Yttrium based thin films, bismuth based thin films, and thallium based thin films;
Functional films: optical films, backlight/display films, display screen films, industrial films, photovoltaic films.
Superconducting devices: superconducting tunneling devices, superconducting quantum interference devices.
Target material production and processing equipment: testing equipment, analysis and detection instruments, measuring instruments, cold isostatic pressing machines, hot isostatic pressing machines, high-temperature brazing furnaces, sintering furnaces, vacuum furnaces, intermediate frequency induction furnaces, electron beam melting furnaces, large-area target material brazing furnaces, high-temperature vacuum hot pressing furnaces, rolling mills, etc.
Other material preparation: purification, melting, heat treatment, industrial furnace, manufacturing process, production technology, analysis and testing, etc.
Exhibition influence:
Exhibition area of 50000 square meters
Over 80000 professional visitors
About 60 visiting groups came to visit
Over 50 business matching events organized by the host organization
Time schedule:
April 7, 2027: Light booth construction and exhibitor setup
April 8, 2027: Construction of bare space exhibition booths and standard booths, as well as exhibition setup
April 9, 2027: Exhibitors enter the museum/Opening ceremony and VIP visits/Professional personnel visit the exhibition
April 10, 2027: Exhibition/Professional visitors have no lunch break
April 11, 2027 afternoon (after 16:00): Exhibitors withdraw from the exhibition
Please communicate and contact us in a timely manner to obtain the latest exhibition information
2027 China (Shenzhen) International Target Material Products and Applications Exhibition - Organizing Committee
Contact: Mr. Zhao
Phone: 021-59780182
Mobile/WeChat: 150000 33892
Scope
Exhibition scope:
Target material products:
Sputtering targets: high-purity cobalt targets, ultra-high purity metal sputtering targets, ultra-high purity alloy targets, copper and copper alloy targets, titanium and titanium alloy targets, metal sputtering coating targets, alloy sputtering coating targets, ceramic sputtering coating targets, ceramic sputtering targets, indium phosphide targets, lead arsenide targets, indium arsenide targets, composite sputtering targets, microelectronic targets, magnetic recording targets, optical disc targets, precious metal targets, thin film resistor targets, conductive film targets, surface modified targets, mask layer targets, decorative layer targets, electrode targets, packaging targets, metal targets, alloy targets, ceramic compound targets, square targets, circular targets, irregular targets and other targets.
Metal target materials: nickel target, titanium target, zinc target, chromium target, magnesium target, niobium target, tin target, aluminum target, indium target, iron target, zirconium aluminum target, titanium aluminum target, zirconium target, aluminum silicon target, silicon target, copper target, tantalum target, germanium target, silver target, cobalt target, gold target, gadolinium target, lanthanum target, yttrium target, cerium target, tungsten target, stainless steel target, nickel chromium target, hafnium target, molybdenum target, iron nickel target, tungsten target and other metal sputtering targets.
Ceramic target materials: ITO target, AZO target, magnesium oxide target, iron oxide target, silicon nitride target, silicon carbide target, titanium nitride target, chromium oxide target, zinc oxide target, zinc sulfide target, silicon dioxide target, silicon monoxide target, cerium oxide target, zirconium dioxide target, niobium pentoxide target, titanium dioxide target, zirconium dioxide target, hafnium dioxide target, titanium diboride target, zirconium diboride target, tungsten trioxide target, aluminum trioxide target, tantalum pentoxide target, niobium pentoxide target, magnesium fluoride target, yttrium fluoride target, zinc selenide target, aluminum nitride target, silicon nitride target, boron nitride target, titanium nitride target, silicon carbide target, lithium niobate target, praseodymium titanate target Ceramic sputtering targets such as targets, barium titanate targets, lanthanum titanate targets, recording medium ceramic targets, display ceramic targets, superconducting ceramic targets, giant magnetoresistance ceramic targets, nickel oxide targets, etc.
Alloy target materials: high-purity alloy sputtering targets such as iron nickel chromium alloy targets, nickel vanadium alloy targets, aluminum silicon alloy targets, nickel copper alloy targets, titanium aluminum alloy targets, nickel vanadium alloy targets, boron iron alloy targets, ferrosilicon alloy targets, etc.
Coating materials: anti reflective film, semi reflective film, crystal coating, infrared coating, ultraviolet coating, optical fiber coating, aluminum coating, color coating, coating, composite film, radium coating
Film, capacitor film, reflective film, filter film, spectral film, beam splitter, filter, bandpass film, cutoff film, high reflectivity film, metal film material, oxide
Fluoride, sulfide, titanate, mixtures and other film materials, coating evaporation materials; PVD coating, TiN coating, TiC coating, TiCN coating ZrN
Coating, CrN coating, MoS2 coating, TiAlN coating, TiAlN CN coating, TiN AlN coating, CNx coating, DLC coating, ta-C coating
Multi element composite coating with layers.
Low temperature superconducting thin film: Low melting point superconducting thin film: Low melting point superconducting thin film, alloy thin film; High melting point superconducting thin films: refractory metals, alloy thin films; Compound superconducting thin films: NbN and Nb3Sn, Nb3Ge thin films; High temperature superconducting thin film; Yttrium based thin films, bismuth based thin films, and thallium based thin films;
Functional films: optical films, backlight/display films, display screen films, industrial films, photovoltaic films.
Superconducting devices: superconducting tunneling devices, superconducting quantum interference devices.
Target material production and processing equipment: testing equipment, analysis and detection instruments, measuring instruments, cold isostatic pressing machines, hot isostatic pressing machines, high-temperature brazing furnaces, sintering furnaces, vacuum furnaces, intermediate frequency induction furnaces, electron beam melting furnaces, large-area target material brazing furnaces, high-temperature vacuum hot pressing furnaces, rolling mills, etc.
Other material preparation: purification, melting, heat treatment, industrial furnace, manufacturing process, production technology, analysis and testing, etc.
Costs & Precautions
Contact
- Telephone:150 000 33892
- Contact:Mr. Zhao
- Mobile:150 000 33892
- Address:Intersection of Fuhua 3rd Road and Jintian Road, Futian District, Shenzhen, Guangdong Province
Disclaimer
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