Exhibition Introduction:

With China's significant investment in technologies such as 5G, AI, IoT, cloud computing, and big data, the "new infrastructure" represented by 5G networks, industrial Internet of Things, and others will drive the high-speed growth of the semiconductor industry. It is predicted that by 2030, the semiconductor market supply in China will reach 538.5 billion US dollars, still the largest in the world. 69% of the consumption will come from local Chinese companies, and the demand will mainly come from application fields such as data centers, consumer electronics, automobiles, and healthcare.

Shanghai has become the center and leading city of the semiconductor industry in the Yangtze River Delta and even the whole country. The Yangtze River Delta region, led by Shanghai, has gathered numerous semiconductor enterprises and has strong semiconductor industry cities such as Shanghai, Wuxi, Hangzhou, Hefei, Nanjing, and Suzhou. The industrial chain is complete and the industrial aggregation effect is good. The semiconductor industry in the Yangtze River Delta region continues to grow in scale due to its unique geographical location, policy, talent, and technological advantages. Shanghai is the core leading city of integrated circuits in China, with obvious comprehensive competitive advantages in integrated circuit design and manufacturing. It is led by chip manufacturing and design, and develops in synergy with equipment raw materials and packaging. Jiangsu has a complete integrated circuit industry chain and strong supporting capabilities. Its chip design and manufacturing capabilities have improved rapidly, and the output value of the packaging and testing industry accounts for half of the country's total. Zhejiang's emerging integrated circuit design enterprises are accelerating their agglomeration, with obvious advantages in areas such as silicon material production, special process chip manufacturing, and industry applications. Anhui's characteristic industries such as new displays, storage chips, driver chips, and home appliance chips have developed rapidly, with relatively prominent cost advantages.

In order to further strengthen exchanges and cooperation in the semiconductor industry, accelerate breakthroughs in key core semiconductor technologies, and effectively promote the coordinated development of the semiconductor industry chain, relying on the strong resource advantages of the industry, we are fully committed to launching the China Semiconductor Industry and Application Expo (IC Expo). The IC Expo is held in Shanghai every November to facilitate efficient collaboration between industry, academia, and research in the semiconductor industry, and to gather strength to strengthen, supplement, and extend the semiconductor industry chain in the Yangtze River Delta region.

Scope of exhibits:

Chip Design/Wafer Manufacturing: Integrated Circuit Design and Chip Manufacturing EDA、MCU、 Wafer manufacturing and equipment and components, etc;

Advanced packaging: Chiplet, SiP packaging, wafer level packaging (WLP), 3D packaging, panel level packaging (PLP), TSV/TGV packaging, organic/silicon/glass substrates, packaging substrates, packaging carriers, IC carriers, semiconductor packaging materials and equipment, etc;

Semiconductor specialized equipment/components: thinning machines, single crystal furnaces, grinding machines, heat treatment equipment, lithography machines, etching machines, ion implantation equipment, CVD/PVD equipment, cleaning equipment, cutting machines, mounting machines, bonding machines, testing machines, sorting machines, probe stations and components, etc;

Advanced materials/carbon materials/diamond semiconductors: silicon wafers and silicon-based materials, photomasks, electronic gases, photoresist and its supporting reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, ceramic substrates, chip bonding materials, carbon based materials, diamond semiconductors, graphite materials, superhard materials, etc;

Compounds and third-generation semiconductors: nitrides (GaN) and silicon carbide (SiC), zinc oxide (ZnO) diamonds, wafers, substrates and epitaxy, power devices, IGBT packaging materials, RF devices and processing equipment, etc;

Power devices/automotive semiconductors: automotive grade semiconductor control/computing chips, power semiconductors (IGBT and MOSFET), automotive grade SiC modules, power management chips, automotive electronic microassembly and power devices, packaging and testing equipment, automation equipment, etc;

Computing power, storage, artificial intelligence, CPO co packaging: artificial intelligence chips, solutions, computing power chips and solutions, algorithm solutions, data storage, optoelectronic co packaging modules and technologies and equipment, etc;

Semiconductor empowerment hotspots and solutions: automotive electronics, specialty electronics, 5G, AI, IoT scenario applications, IoT, motor drives, industrial control, etc.

Scope of exhibits:

Semiconductor specialized equipment&components exhibition area: thinning machine, single product furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD equipment, cleaning equipment, cutting machine, mounting machine, bonding machine, testing machine, sorting machine, probe station and components, etc.

Design, Chip, Wafer Manufacturing and Packaging Exhibition Area: Integrated Circuit Design, Wafer Manufacturing, SiP Advanced Packaging Technology Power device packaging and testing, MEMS packaging technology Silicon wafers and IC packaging carriers, packaging substrates and application manufacturing and packaging testing, EDA software, MCU microcontrollers, packaging substrate semiconductor materials and equipment, and components.

New display exhibition area: OLED, AMOL. ED, Mini/Micro LED, silicon-based display, flexible display technology, etc.

Compound Semiconductor Exhibition Area: Gallium Nitride (GaN) and Silicon Carbide (SiC), Zinc Oxide (ZnO) Diamond, Wafer, Substrate and Epitaxy, Power Devices, IGBT Packaging Materials, RF Devices and Processing Equipment, etc.

Advanced Packaging Technology Exhibition Area: Semiconductor control and computing chips, power semiconductor IGBT and MOSFET, automotive grade SiC modules, energy storage power supplies and sensors, automotive electronic micro assembly and power devices, packaging testing equipment, automation equipment, instruments and components.

Advanced Materials Exhibition Area: Silicon wafers and silicon-based materials, photomask templates, electronic gases, photoresist and its supporting reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, ceramic substrates, chip bonding materials, etc.

• Company:Lijia Exhibition (Shanghai) Co., Ltd
• Contact:Lu Liang
• Mobile:13818219172
• E-mail:3087083730@qq.com
• Address:Shanghai

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