National debut exhibition, gathering 50000+industry elites and top brands

2027 Global Smart Computing Conference and Exhibition

Conference time: February 25-27, 2027

Venue: Hangzhou International Expo Center

Exhibition area: 40000 square meters

Exhibiting brands: 500+

Audience Count: 50000+

Simultaneous activities: 20+

Conference theme: Building a green computing power ecosystem to promote the upgrading of the digital economy

DIC 2027 Event Prospects and Industry Overview

Computing power is the core foundation of the digital economy, the strategic infrastructure for the development of the artificial intelligence industry, and the key support for cultivating new quality productivity and driving the digital transformation of thousands of industries. With the accelerated implementation of large-scale models, multimodal AI, and industrial intelligence, technologies such as high-density intelligent computing, green computing power, network integration, and storage computing integration are rapidly iterating. The construction of computing infrastructure, storage architecture upgrades, high-speed network interconnection, low-carbon transformation of data centers, cloud native and computing power scheduling ecology have become the focus of global industrial attention, and the demand for collaborative innovation and supply-demand docking in the industrial chain is becoming increasingly urgent.

The Digital Intelligence Computing Conference and Exhibition (DIC 2027) is an international industry exchange and exhibition platform that focuses on the five core tracks of computing power, storage, data centers, networks, and cloud computing. The conference adopts an integrated model of "high-level summit+large-scale conference+achievement display+new product release+supply and demand docking", connecting the entire industry chain of computing chips, server machines, high-speed interconnection, storage systems, liquid cooling and temperature control, data center construction and operation, cloud platform, computing power scheduling, security operation and maintenance, and industry computing power solutions.

The conference will gather global leading computing power enterprises, specialized and innovative manufacturers, research institutes, standard institutions, cloud service providers, computing power operators, investment and financing institutions, and end users in industries such as industry, finance, healthcare, transportation, energy, and smart cities to conduct in-depth discussions on cutting-edge topics such as green and low-carbon intelligent computing, domestic computing power ecology, computing power network construction, computing power inclusiveness, and industry implementation. It will focus on showcasing cutting-edge technologies, innovative products, and overall solutions for computing power infrastructure.

DIC 2027 Organizational Structure

Co hosting and strategic cooperation: Yingfo Conference and Exhibition (Shanghai) Co., Ltd., Zhejiang Artificial Intelligence Society, Hangzhou Science and Technology Innovation and Entrepreneurship Association, Hangzhou Digital Economy Federation, Hangzhou Artificial Intelligence Society, Zhejiang AI Intelligent Agent Industry Development Alliance, Zhejiang Big Data Industry Technology Alliance, Yangtze River Delta (Hangzhou) Manufacturing Digitalization Capability Center, Shenzhen Memory Industry Association

International Cooperation: Asian Computing Union (ACPU), American Association for Artificial Intelligence (AAIA)

Organizer: Jiangsu Yingfo Conference and Exhibition Co., Ltd., Bike Exhibition (Shanghai) Co., Ltd

Core Highlights of DIC 2027

Full chain coverage

Integrate chips, hardware, infrastructure, platforms, and applications to fully cover the entire digital industry chain of computing power.

High specification summit

Academicians, industry executives, and top executives of leading enterprises lead the way in sharing and interpreting national computing power policies and industry trends.

Technology Frontiers Focus

Emphasis will be placed on showcasing cutting-edge technologies such as green liquid cooling, integrated storage and computing, network integration, AI computing power scheduling, and domestic substitution.

Global New Product Launch

Gather global annual computing power new products, technological achievements, industry white papers, and standard specifications for centralized release.

Accurate supply-demand matching

Operators, cloud providers, government and enterprise procurement, integrators, and terminal enterprises are accurately connected face-to-face.

Domestic ecological co construction

Focusing on the autonomous and controllable computing power system, promoting the landing of domestic chip, server, storage, software and hardware ecosystems.

Scene landing guidance

Focusing on real-life scenarios such as industry, energy, transportation, healthcare, and urban governance, empowering digitalization of industries.

International perspective

Link global computing resources, technical standards, and industry cooperation to create an international level computing exchange platform.

DIC 2027 Contemporary Series Featured Activities

2027 Global Smart Computing Conference

Authoritative interpretation of the national development plan for computing power and data elements, the latest policies, and industry trends.

Introduce the achievements, service capabilities, and future development layout of the computing power storage system construction in Zhejiang Province and Hangzhou City.

Chinese and foreign academicians, as well as experts from international associations, share the forefront of global AI computing power and storage technology, international technological iteration, and the development trends of industries in Europe, America, Japan, and South Korea, analyzing green computing power, intelligent storage

The global development pattern of integrated storage and computing.

Carry out practical sharing of computing power supporting new quality productivity, serving the digital economy, and embodied intelligent robot industry.

Introduce industrial innovation achievements, typical application cases, and global experience in collaborative development between industry, academia, and research.

Set up on-site interactive questioning sessions with Chinese and foreign experts to conduct cross-border technical Q&A exchanges.

DIC 2027 Supporting Activities

Conference on Demand Release and Resource Matching for the "Computing Express"

Strategic Cooperation Signing Ceremony for "Intelligent Computing Navigation"

Parallel Forum on Special Topics

01. AI Reasoning Computing Power and Efficient Deployment Forum

02. HBM and Advanced Packaging Technology Forum

03. Silicon Optics and CPO Interconnection Technology Forum

04. AI Agent and Computing Intelligent Scheduling Forum

05. Forum on Domestic AI Chips and Autonomous Controllable Computing Power Ecology

06. Storage computing integration, edge computing and distributed computing forum

07. Forum on High end Storage, All Flash Memory, and New Storage Technologies

08. Forum on Intelligent Computing Center, AI Computing Power Cluster, and Large Model Computing Power Base

09. Data Center Green Low Carbon, Liquid Cooling and Energy saving Technology Forum

10. Forum on Data Security, Privacy Computing, and Data Elements

11. Forum on Computing Power Standards, Testing and Certification, and Industry Compliance

12. Computing Power Storage Tailored Intelligent Robot Fusion Application Forum

13. Forum on Industrial Investment, Financing, and Innovation Ecology

14. Global Forum on Computing Power Supply Chain and Cross border Industry Cooperation

Scope of exhibits for DIC 2027

Core devices and architecture for AI computing power

AI chip, DPU, CPU, GPU, NPU, FPGA, AI big model, AI accelerator card, computing module, storage computing integrated chip, server machine, rack server, blade server, industrial server, supercomputing equipment, AI training/reasoning server, cabinet, firewall and gateway, edge computing chip, edge computing, cloud service, Internet of Things, computing security, software application, computing network collaboration, computing power collaboration, etc.

Storage and Data Infrastructure

Full flash storage, distributed storage, NAS/SAN storage, object storage, disk array, solid-state drive, storage chip, storage server, disaster recovery backup equipment, data migration, data compression, data storage security system.

Network and high-speed interconnection

Computing power network, optical communication/optical module, high-speed fiber optic connection, data center interconnection, backbone network equipment, switches, routers, high-speed network cards, DPU/smart network cards, cabling systems, IDC network architecture, low latency interconnection equipment, computing network integration equipment, etc.

Data center infrastructure

Intelligent computing center, supercomputing center, edge data center, modular data center, micro module computer room, cabinet UPS、 Precision air conditioning, fresh air system, power supply and distribution system, intelligent monitoring, dynamic environmental monitoring system, etc.

Green energy-saving and heat dissipation technology

Liquid cooled servers, immersion liquid cooling, cold plate liquid cooling, air-cooled energy-saving solutions, energy-saving renovation of computer rooms, waste heat recovery, low-carbon energy-saving technologies, power distribution systems, photovoltaic energy storage computing power matching, green IDC solutions, fire protection and security, etc.

Cloud computing, computing power platform and scheduling

Public cloud, private cloud, hybrid cloud, edge cloud, computing power scheduling platform, computing power trading platform, computing power grid connection, cloud native technology, containers, virtualization, distributed computing power management, multi cloud management platform, etc.

Computing Security and Operations

Computing power network security, data security, host security, AI model security, privacy computing, confidential computing, computing power risk management, intelligent operation and maintenance, automated monitoring, disaster recovery security solutions, etc.

Industry computing power application solutions

Industrial computing power, financial computing power, medical computing power, transportation computing power, energy computing power, education and research computing power, autonomous driving computing power, smart city computing power, government big data, AI big model industry landing solutions, etc.

Research, services, and industrial support

University research institutes, computing power testing and certification, planning and design, engineering construction, operation and maintenance services, investment and financing institutions, industry media, industrial parks, computing power incubation platforms, etc.

DIC audience group

Government and industrial parks: local departments of industry and information technology, development and reform, government data management, digital economy industrial parks, computing power new cities, and intelligent computing industrial parks.

Computing infrastructure providers: the three major operators, computing centers, supercomputing centers, intelligent computing centers, and IDC construction and operation enterprises.

Industry chain enterprises: chip, server, storage, network, liquid cooling, data center equipment, cloud computing, big data, AI technology enterprises.

Industry end-users: industrial manufacturing, power and energy, finance, transportation, healthcare, education, public security emergency response, smart cities, and autonomous driving enterprises.

Technical service institutions: research institutes, university laboratories, testing and certification, planning and design, system integration, software development service providers.

Capital and Media: Venture capital institutions, industry funds, industry associations, authoritative media, industry platforms.

DIC 2027 Promotion Plan:

Through authoritative media endorsement, industry vertical cultivation, matrix seeding across the entire network, real-time on-site reporting, and post event long tail dissemination, we aim to create an annual benchmark event IP for the computing power industry and establish a top industry conference brand in the fields of domestic computing power infrastructure, AI computing power, green data centers, and computing network integration.

Authoritative comprehensive media

Central media, key portals, and local official media are used to report on the opening ceremony, deliver speeches by leaders, summarize the conference, and release achievements, enhancing the official level and authority of the conference.

Technology Industry Media

Focus on leading media in artificial intelligence, computing power, big data, cloud computing, digital economy, and new infrastructure, and output industry trends, guest opinions, forum insights, industry white papers, and technical interpretations.

Vertical industry media

IDC data center, server storage, optical communication, network security, industrial digitization, smart cities, energy computing power, financial technology media, accurately reaching exhibitors, buyers, engineers, integrators, and operators.

New Media Matrix

WeChat official account, video account, Tiktok, Xiaohongshu, B station, industry community, friend circle launch, KOL industry talent, responsible for warm-up and momentum building, countdown, guest spoilers, exhibitor promotion, exhibition invitation, live broadcast, short video screen brushing.

Book booth 2027 now and unlock unlimited business opportunities!

Mr. Xu: 13004111688

• Telephone:13004111688
• Contact:Mr. Xu
• Mobile:13004111688
• Address:No. 353 Benjing Avenue, Xiaoshan District, Hangzhou City, Zhejiang Province

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