2026 Shanghai International AI Computing and Chip Technology Exhibition

Date: December 9-11, 2026

Location: Shanghai New International Expo Center

Exhibition Preface

Currently, computing power has been officially included in the overall construction of the top-level infrastructure of the national "six networks". The national integrated computing power network and the East West computing project continue to deepen and implement, and the construction of collaborative computing power, green computing power, and independent computing power has become the core task of digital infrastructure in the "15th Five Year Plan". The computing power hubs of the eight major countries in China continue to expand, and the scale of intelligent computing power is steadily increasing. The cross regional computing power scheduling and the east-west computing power coordination system are accelerating their formation. Computing power has been upgraded to a core production factor supporting new quality productivity, and is the underlying foundation for the digital transformation of thousands of industries.

With the commercialization of artificial intelligence and large-scale industry models, AI Agent、 The demand for computing power in automatic driving, intelligent manufacturing, financial high-frequency reasoning, digital twins and other scenarios has exploded exponentially, and the demand for high-density computing power procurement from government enterprises, the Internet, manufacturing, automobile enterprises, and scientific research institutions has been fully released. The independent and controllable process of the industrial chain is accelerating, and new intelligent computing centers are being built in various regions to increase the proportion of domestic computing hardware configuration. The entire chain of domestic DCU, NPU, servers, high-speed interconnection, and liquid cooling temperature control is entering a window period of large-scale replacement, and the domestic computing ecosystem is facing a historic opportunity.

At the same time as the expansion of computing power scale, pain points such as high energy consumption, high-density heat dissipation, inefficient cross cluster scheduling, mismatched computing power supply and demand, and fragmented industry implementation solutions have become prominent. Immersion/cold plate liquid cooling, photovoltaic energy storage room, ultra-low PUE intelligent computing cluster, CPO optoelectronic co packaging, and intelligent scheduling platform for computing power have become the industry's essential needs. Green, efficient, and safe computing power have become the industry's hard standards, giving rise to trillion level hardware, software, and operational support markets.

Industry event

The 2026 Shanghai International AI Computing and Chip Technology Exhibition will be held from December 9th to 11th, 2026 at the Shanghai New International Expo Center. It will attract more than 600 enterprises from more than 20 countries and regions, including the United States, Germany, France, South Korea, India, Singapore, Malaysia, the United Arab Emirates, Japan, Russia, Taiwan, China, and so on. As one of the influential AI computing power and chip technology exhibitions in East China, through exhibition resources, we invited people at the decision-making level of companies in the national, provincial, municipal and relevant scientific research institutions, intelligent computing centers, EPC general contractors, design institutes, system integrators, finance, data centers, power, electronics, aviation, aerospace, automobile, aircraft, medical, communications, batteries, new energy, high-performance computing, edge computing, artificial intelligence, lithium battery equipment, energy storage, power generation, energy, photovoltaic equipment, semiconductor equipment, automation, hydrogen energy and other user industries to discuss the use and research and development of "AI computing power", and exchange international application technologies, improve the overall competitiveness of the industry, and promote and improve the AI computing power of China application and manufacturing level.

This conference will adhere to the exhibition purpose of "highlighting brands, exploring innovation, focusing on practical results, and strengthening services". With unique creativity, scientific and reasonable integration and communication, and excellent services, it will provide a "high level, high taste, and high quality" exhibition and communication stage for exhibitors with a new concept, and create the largest, most valuable, and most valuable event in the industry. We look forward to your participation in this exhibition!

Exhibition scope

1、 AI computing chips and semiconductor accessories:

AI training/inference chip DCU/NPU/GPU、 Specialized storage chip; High speed switching chip, Ethernet switching chip, IB network chip, optical chip, laser detection chip, silicon optical chip, optoelectronic integrated chip; Chip materials, EDA design tools, IP cores, chip testing and inspection equipment.

2、 AI server machine and ODM outsourcing:

AI server ODM/OEM outsourcing, server chassis, computing power module, GPU acceleration card, AI co processing card, complete machine integration kit; Prefabricated computing power cluster, modular intelligent computing cabinet, complete cabinet server, distributed supercomputing unit, disaster recovery computing integrated machine; Cold plate server, liquid cooling distribution unit, liquid cooling pipeline, quick connector, anti-corrosion coolant.

3、 Liquid cooled temperature control&energy-saving heat dissipation in the computer room:

Cold plate/immersion liquid cooling complete equipment CDU、 Heat exchanger, circulating pump, cooling medium; Integrated solution for noise reduction, intelligent temperature and humidity control, energy consumption monitoring, computing power waste heat recovery, and green electricity temperature control in the computer room.

4、 High speed optical communication, CPO optoelectronic interconnection:

Passive optical components, optical connectors, fiber jumpers, high-speed optical engines, coupling devices, and encapsulated ceramic bases; CPO co packaged modules, optoelectronic integrated packaging, OCS all-optical switching, silicon optical integrated devices, and computer room optoelectronic interconnection solutions; High speed special optical fibers, computing power optical cables, cabling systems, optical testing instruments.

5、 Intelligent Computing Center IDC and Computing Power Leasing Operations:

A-level intelligent computing center, AIDC data center, East West computing power park, supercomputing center, edge computing power center, modular micro module machine room, high-power computing cabinet; HVDC high-voltage direct current, UPS power supply, precision distribution, energy storage backup, photovoltaic energy storage system; GPU computing power leasing, domestic computing power hosting, cloud computing power, edge computing power scheduling; Intelligent computing center EPC general contracting, computer room engineering, dynamic environmental monitoring, and operation and maintenance outsourcing services.

6、 High speed network switching and computing power networking:

Computing power networking system, cluster interconnection, network load balancing, computing power firewall, network security audit; Network testing instruments, computing power cabling, intelligent patch panels, and computer room network visualization management platform.

7、 High speed PCB and high-end packaging carrier board:

AI server high-speed PCB, high-frequency copper-clad board, computing power backplane, multi-layer precision circuit board, domestically produced high-frequency board; ABF carrier board, IC carrier board, HBM matching carrier board, ceramic packaging substrate; Electromagnetic shielding, insulation heat dissipation board, copper foil resin, circuit board processing and testing equipment.

8、 AI specific storage and computing software ecosystem:

Enterprise grade NVMe SSD, AI solid-state drive, distributed storage, full flash storage, vector database; Deep learning framework, operator optimization, cluster scheduling system, computing power virtualization, domestic AI operating system; Big model fine-tuning, MaaS model as a service, data services, computing power security services, and other value-added computing services.

Exhibition Tips

1. Please fill out the "Exhibition Application and Contract" form carefully and fax it to the organizing committee with the official seal.

2. After applying for a booth, exhibitors are required to wire transfer the booth fee to the designated account of the conference within 3 working days. After the remittance, please fax the remittance receipt to the organizing committee for verification; If payment is not made in a timely manner within the specified time, the organizing committee will not reserve the original booth.

3. The principle of booth sequence allocation is "apply first, pay first, arrange first".

4. In order to ensure the overall image of the conference, the organizing committee reserves the final right to adjust the booths of some exhibitors.

contact information

Shanghai Xuntong Exhibition Co., Ltd

Phone:+86-21-5415 5272

Contact: Liang Jiajin 136 8165 8788 (same WeChat account)

• Telephone:136 8165 8788
• Contact:Liang Jiajin
• Mobile:136 8165 8788
• Address:No. 2345 Longyang Road, Pudong New Area, Shanghai

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870