The competition in the semiconductor industry is no longer limited to technological breakthroughs in laboratories, but also tests the collaborative ability of the upstream and downstream of the industry chain, and the efficiency of transforming innovative achievements into real market scenarios. When domestic substitution enters the deep water zone, the integration of the supply chain, the handshake between supply and demand, and the growth of innovative enterprises become key drivers for the advancement of the industry. On May 18-20, 2027, the second China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition will be held at the Hefei Binhu International Convention and Exhibition Center. Based on the central industrial hub, it will break away from the traditional exhibition logic of simply displaying exhibits and build an industrial bridge connecting innovation, manufacturing, application, and capital with supply and demand docking as the core.

The industrial background formed by years of sedimentation in Hefei is the unique confidence of this exhibition. Relying on the industrial matrix of "chip screen auto integration and lifelong intelligence", this place has both a solid manufacturing foundation such as wafer manufacturing, packaging and testing, and core materials, as well as a massive terminal application market such as new energy vehicles, new displays, artificial intelligence, and energy storage industrial control, forming a unique pattern of two-way linkage between upstream research and development and downstream applications. Many chip companies can get close to the real needs of terminals without traveling far away, making product iteration no longer detached from actual usage scenarios. This is also the most distinctive advantage that sets Hefei apart from other domestic industry exhibitions.

The exhibition area of this year's exhibition covers all aspects of the integrated circuit chain, with segmented professional exhibition areas arranged in an orderly manner. From IC design, EDA tools, IP cores, to wafer manufacturing equipment and testing instruments; From key consumables such as target materials, electronic specialty gases, substrates, to advanced packaging solutions for SiC, GaN third-generation semiconductor devices, and Chiplets; From automotive grade chips, computing power chips, to industrial grade components, it fully covers all aspects from source research and development to end products. There are both leading companies in the industry bringing mature mass production solutions, as well as a large number of specialized and innovative enterprises showcasing cutting-edge prototype products and customized solutions. Enterprises of different scales and tracks communicate on the same stage, presenting the diverse face of the current domestic semiconductor industry.

In order to solve the common supply-demand information gap in the industry, the exhibition has strengthened its commercial and trade landing attributes, and is not satisfied with simple exhibition communication. Set up a dedicated business negotiation area on site, organize multiple targeted supply and demand matching sessions, wafer fab procurement sessions, and terminal enterprise docking meetings, promote equipment and material manufacturers, chip design companies to directly connect with manufacturing factories, vehicle, display, energy storage and other terminal procurement and R&D teams, shorten the supply chain selection cycle, reduce business expansion costs for enterprises, and make the exhibition a platform for promoting substantive cooperation, rather than just a static display of technological achievements.

Multiple thematic forums and technical seminars will be held simultaneously to engage in in-depth discussions around the current challenges in the industry. The topics of mass production adaptation of domestic equipment and materials, reliability and scale implementation of automotive grade chips, industrialization path of wide bandgap semiconductors, challenges in implementing advanced packaging technology, and industry applications of AI edge computing chips have become the focus of forum discussions. Industry experts, technical leaders of enterprises, and representatives of research institutes gather not only to interpret trends, but also to focus on practical pain points encountered in the industrialization process and share practical experience. At the same time, we will hold special sessions for achievement transformation and investment and financing roadshows, connecting capital and industrial resources for small and medium-sized innovative enterprises, and helping innovative projects move out of the laboratory and onto the path of industrialization.

Among the numerous innovative forces participating in the exhibition, a group of emerging design companies are particularly noteworthy. Represented by Beijing Jiuwang Technology Co., Ltd., a science and technology innovation entity, relying on the RISC V open source architecture, deeply cultivates chip design and edge AI software and hardware integration solutions, focuses on the research and development of physical intelligent agents and end side computing hardware, connects the link between chip architecture, software stack and industry applications, and outputs customized solutions for industrial, scientific research, and intelligent devices. Innovative enterprises like this will use exhibition platforms to engage in dialogue with the manufacturing, new energy, and intelligent terminal industries in the central region, promote the integration of design technology achievements with the local market, and accelerate the landing of diversified domestic chip scenarios.

As an industrial hinterland that connects the north and south and links the Yangtze River Delta, the central region plays an important role in the coordinated development of the semiconductor industry. The 2027 Hefei Semiconductor Exhibition is not only a showcase for technological products, but also a connector for industrial ecology. Here, large enterprises seek supporting partners, small and medium-sized science and technology innovation enterprises explore market opportunities, manufacturing enterprises seek high-quality supply chains, capital explores high-quality projects, and research institutions seek the soil for industrial landing. All parties break down regional barriers, carry out in-depth face-to-face communication, and promote mutual complementarity and joint progress in various links of the industrial chain.

The tide rises in Jianghuai, with a focus on practical work. The breakthrough of domestic semiconductors relies not on a single breakthrough, but on the joint efforts of the entire industry. Gathering by the lakeside, using exhibitions as a medium and connections as a link, the 2027 Hefei Semiconductor Exhibition looks forward to gathering the strength of the entire industry to jointly promote the landing of technology and the improvement of supply chains, injecting central momentum into the high-quality development of the domestic integrated circuit industry.

• Contact:Liu Jiao
• Mobile:13257086620
• Address:3899 Jinxiu Avenue, Baohe District, Hefei City

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