Hefei is deeply cultivating the construction of the entire integrated circuit industry chain, continuously upgrading etching, deposition, and thin film processes, and entering a tough stage of domestic substitution for core components of semiconductor equipment. Wafer production and manufacturing have extremely strict standards for clean environment, ultra-high vacuum, corrosion resistance, and high precision. Precision ceramic components, special gas fittings, and vacuum valves are essential key components for equipment chambers, gas supply systems, and vacuum systems, directly determining chip yield and stable equipment operation.

The 2nd Hefei Semiconductor and Integrated Circuit Industry Expo (Wanxin Exhibition) in 2027 will be held from May 18-20 at the Binhu International Convention and Exhibition Center. The exhibition will set up a dedicated exhibition area for semiconductor equipment components, showcasing three major categories of products: semiconductor precision ceramic components, special high-purity gas pipe fittings, and ultra-high vacuum valves.

Semiconductor precision ceramic components include electrostatic suction cups, ceramic focusing rings, insulation rings, ceramic nozzles, and mechanical arm structural components. They have the characteristics of high temperature resistance, plasma corrosion resistance, low gas release, high insulation, and micrometer level high precision. They are widely used in etching machines, PVD/CVD film deposition equipment, and cleaning equipment, which can effectively reduce particle pollution and improve wafer processing stability. High purity special gas fittings are processed with ultra-high cleanliness seamless pipes, with high polishing grade on the inner wall. They are resistant to highly corrosive special process gases such as chlorine and hydrogen fluoride, with strong sealing and no impurity precipitation, ensuring stable transportation of electronic special gases and avoiding chip scrap caused by particle pollution. Ultra high vacuum valves achieve sealing and control in ultra-high vacuum environments, with zero leakage and sensitive response. They complete chamber vacuuming, process gas switching, and precise pressure regulation, meeting the high requirements of long-term uninterrupted production in semiconductor production lines.

This year's Wanxin Exhibition brings together specialized and new component enterprises from all over the country to showcase new products, new processes, and localized solutions. On site technical exchanges, precise matching of upstream and downstream supply and demand, one-on-one negotiations with manufacturers for procurement, opening up procurement channels for equipment factories, wafer factories, and packaging and testing factories, breaking the pain point of long-term dependence on imported high-end components, and helping the domestic semiconductor supply chain to be independent and controllable. The well-developed industrial ecosystem and huge market demand in Hefei will bring a large number of opportunities for order cooperation to component enterprises.

Scope of Exhibition: Covering the Core Field of Semiconductors

Ic Design and Chip Zone

EDA full process design software, IP core, embedded system software, digital/analog/mixed signal integrated circuit design, version

Design and validation services for graphics; Artificial intelligence chips (end/edge/training), general-purpose GPU, NPU, TPU

DPU、AloT、SoC、 Large model training and inference chip, heterogeneous computing processor, RISC-V processor core

High and low voltage power management chip (PMIC), industrial IoT MCU, 5G/millimeter wave RF chip, automotive grade chip

Chip (AEC-Q100 certified), secure encryption chip, storage chip (DRAM/Flash/storage control chip, high

Bandwidth memory HBM, storage stack chip, full category display driver chip (OLED/LCD/TCON/Mini)-

Micro-LED)、 Integrated storage and computing chip, AI storage and computing fusion chip, intelligent vision chip; Server CPU, Memory

Interface chips, high-speed optical modules, silicon optical integration and other AI server and data center core chip products and supporting devices.

Semiconductor Materials Zone

12 inch semiconductor silicon wafer (polished/epitaxial/SOI silicon wafer), high-end photoresist (ArF/KrF/i wire) and supporting materials

Reagents, high-purity electronic chemicals, CMP polishing solution and pads, high-purity metal targets (AI/Cu/Ti/Ta/W alloy)

Target materials, photolithography supporting chemicals, photomask templates, optoelectronic chemicals, semiconductor precursor materials, special coatings

Materials, functional thin film materials, wide bandgap compound semiconductor materials (SiC/GaN/gallium oxide substrates and epitaxial materials)

High end packaging materials (packaging substrates, lead frames, bonding wires, epoxy plastic packaging materials, etc.)

Packaging and Testing Measurement Zone

Covering Chiplet chip heterogeneous integration, 2.5D/3D stacked packaging, TSV silicon via process, Fan out fan out packaging

Installation, Flip chip packaging, COB packaging, vacuum eutectic, heterogeneous integration, WLCSP wafer level packaging

Advanced packaging technologies such as bumping bump manufacturing and SiP system level packaging; Traditional IC packaging technology and packaging testing outsourcing services

Service; Storage chip packaging, automotive grade high reliability packaging, power semiconductor module packaging; Integrated Circuit Testing Equipment and

Technology: ATE testing system, digital/analog/mixed signal testing, high and low temperature aging testing, failure analysis equipment

(SEM/EDX/FIB)、 Analysis of wafer yield control data; Sealing and testing of the entire factory and process production line, packaging equipment, and testing

Machine, testing probe station, sorting machine; Electronic and communication supporting equipment, electrical instruments and meters, environmental testing equipment

Analytical instruments and meters; Certification testing, automated instrumentation, and supporting solutions.

Application Ecological Zone of "Chip Screen Auto Fusion"

Display field: Mini/Micro LED, OLED, LCD new display driver technology, car display, flexible display

Display, ultra clear high refresh rate display, integrated core chip and supporting materials under the screen;

Automotive field: automotive grade core chips, battery management systems (BMS), automotive motor controllers, onboard power modules

Blocks, vehicle Ethernet chips, vehicle sensors, and semiconductor application solutions for the entire vehicle;

Industrial/AI/data center field: industrial control chip, edge computing intelligent module, AI computing module, server computing

Power acceleration solution, large model hardware matching, dedicated chips for servers and storage, industrial/automotive grade sensor interface chips

Chip, storage and computing integrated hardware, computing power liquid cooling temperature control system, high-speed interconnection hardware;

Terminal applications: consumer electronics, robotics, security, aerospace, energy storage terminal application solutions;

Industrial supporting facilities: industrial policy promotion, industrial funds, industrial park carriers, industry university research innovation achievements, product testing and certification

Certificate, intellectual property, and comprehensive industry supporting services

Integrated Circuit Manufacturing Zone

12 inch wafer manufacturing and outsourcing, DRAM storage wafer manufacturing, display driver (DDI) wafer manufacturing

28/40nm logic/MCU characteristic process, power device/BD/MEMS dedicated process, IDM vertical integration whole factory

Project, overall construction plan for wafer fab, process upgrade and mass production supporting solution, MPW multi project wafer wafer fabrication service

Business, silicon photonics foundry, wafer regeneration, wafer testing and verification, process reliability evaluation, and mass production yield optimization services; cover

Advanced GAA process, backside power supply process, glass packaging substrate, photonic SOI and other cutting-edge new process technologies and accessories

Set of services; Mask detection, mask repair equipment, and supporting technical solutions.

Semiconductor Equipment and Core Components Zone

Front equipment: monocrystalline furnace, silicon crystal growth equipment, photolithography equipment, etching equipment, thin film deposition equipment

(PVD/CVD/ALD)， Ion implantation equipment, semiconductor grade cleaning equipment, coating and developing equipment, precision measurement

Testing equipment, annealing/oxidation/diffusion heat treatment equipment, photomask manufacturing equipment;

Rear equipment: wafer thinning machine, wafer cutting machine, solidification machine, bonding equipment, plastic sealing equipment, cutting and forming equipment

Prepare and test sorting machines, automatic probe stations, ATE integrated circuit testing systems;

Core precision components: dry vacuum pump, RF power supply, electrostatic chuck (ESC), wafer transfer equipment

(EFM)、 High purity control valves, precision motion platforms, optical components, semiconductor specific robots, and automation accessories

Components, semiconductor precision ceramic components, cavity components, heaters, wafer carrier accessories, equipment precision consumables, non

Customized components; Complete solutions for wafer handling automation and wafer inspection automation; Semiconductor factory building super

Pure water system, clean room equipment and supporting engineering facilities; Special gas pipeline components, vacuum valves.

Third Generation Semiconductor Zone

Second and Third Generation Compound Semiconductor Materials and Devices: Silicon Carbide (SiC), Gallium Nitride (GaN), Gallium Oxide, Gold

Diamond semiconductor, gallium arsenide (GaAs), indium phosphide (InP) substrates and epitaxial materials; Various power devices, radio

Frequency microwave devices, high-speed communication devices, and wide bandgap semiconductor power modules; Optical chip, laser chip, optical detection

Devices, silicon optical integrated devices, optical modules; Focusing on new energy vehicles, photovoltaic energy storage, industrial power sources, high-end fast charging

Solution for overall application of power semiconductors and RF communication in 5G/6G communication, aerospace information, microwave radar and other fields

Case

Components Zone

Vehicle grade/industrial grade resistors, capacitors, potentiometers, power semiconductor discrete devices, high-end specialized connectors, heat dissipation

Mechanical and electrical components; Electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, industrial/automotive grade sensors

MEMS inertial, acoustic, pressure, optical sensor devices, dedicated power supplies, switches, micro motors, electronic transformers

Pressure regulator and relay; High end printed circuit boards (HDI/high-frequency/automotive grade PCBs), various specialized circuits, voltage

Electric, crystal, quartz, ceramic magnetic materials; Substrate for printed circuits, specialized materials for electronic functional processes, and electronics

Subgel (tape) products, electronic chemical materials, and components; Microwave components, communication equipment microwave materials, microwave RF

High end specialized supporting components and materials such as testing instruments, industry-specific software, and electronic tubes.

• Contact:Sun Yan
• Mobile:17621568521
• E-mail:2119857701@qq.com
• Address:3899 Jinxiu Avenue, Baohe District, Hefei City

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