As domestic semiconductors enter a period of deep transformation from "single point breakthrough" to "full chain self-improvement", Hefei, the highland of science and technology innovation in central China, is taking the industrial accumulation of ten years of deep cultivation as the cornerstone, and will complete a key transition from "industrial agglomeration" to "ecological leadership" by 2027. Unlike the traditional chip industry that relies on a single track and policy empowerment development model, Hefei relies on its unique advantage of "chip screen auto integration" industry integration, with storage chips and characteristic OEM as the dual cores, and advanced packaging, third-generation semiconductors, and AI computing chips as the new growth poles. It connects the full dimensional closed loop of research and development, manufacturing, materials, terminals, and capital, enabling the central semiconductor industry to grow from an industrial depression to a core engine and technological innovation source for domestic substitution in the country.

Looking back at the development trajectory of the industry, the rise of Hefei Semiconductor has never been a short-term trend game, but a precise long-term cultivation. With a forward-looking industrial layout, Hefei has established a dual wheel drive pattern of scarce storage and characteristic OEM in the country. Changxin Storage continues to iterate DRAM technology, steadily expand production capacity, and continuously break through the monopoly barriers of overseas storage chips; Upgrade and speed up the integrated production line, deeply cultivate the field of display driver chips, and firmly occupy the first tier of global segmented fields. The two leading companies in wafer manufacturing have taken root and fully activated the vitality of the local industrial chain, driving upstream core material and equipment enterprises such as photolithography photomasks, target materials, electronic specialty gases, and precision equipment to cluster together. In 2027, key projects such as Crystal Magnesium high-end photomask will be put into operation one after another, filling the production capacity gap in the domestic high-end process photomask field. Enterprises such as Huicheng Corporation will deeply cultivate the advanced packaging track, achieve breakthroughs in 3D DRAM packaging technology, fill the key gaps in the industry chain, and completely free Hefei Semiconductor from the dilemma of being controlled by others in core links.

The core vitality of an industry lies in the two-way pursuit of technological iteration and scenario implementation. In 2027, the semiconductor industry in Hefei will completely break away from the common industry problem of "heavy manufacturing, light application", and rely on the local trillion level new display, new energy vehicle, and artificial intelligence terminal markets to achieve deep integration between chip technology and physical scenarios. In the current era of rapid iteration of intelligent vehicles, Hefei's automotive grade semiconductors are accelerating their landing, with chip products such as in vehicle control, power management, and intelligent sensing, accurately adapting to the intelligent and electric upgrade needs of local car companies such as NIO, and building a fast landing channel of "chip research and development - vehicle specification certification - batch loading"; Under the wave of AI computing power, cutting-edge technologies such as Chiplet chip heterogeneous integration, HBM high-speed storage, and NPU computing chips are accelerating industrialization, relying on the advantages of the Hefei computing power cluster to provide hardcore hardware support for large models and artificial intelligence industries; In the field of new energy storage, third-generation semiconductor devices such as silicon carbide and gallium nitride continue to reduce costs and improve quality, and are widely used in photovoltaic energy storage, high-frequency fast charging, and industrial control scenarios, helping domestic power devices fully replace imported products

The takeoff of the hardcore industry cannot be separated from the nourishment of the integrated ecology of industry, academia, research and investment. In 2027, Hefei will continue to deepen its science and technology innovation empowerment system, relying on the microelectronics research platforms of universities such as University of Science and Technology of China and Hefei University of Technology, and linking with 17 national level chip research and development platforms in the city to promote cutting-edge laboratory technologies from the research end to the production line. Throughout the year, a massive number of scientific research patents have been transformed into achievements, and cutting-edge fields such as EDA tool independent research and development, quantum chips, and optical chips have been continuously tackled to reserve core technological momentum for the long-term development of the industry. At the same time, industrial capital and industry competitions are mutually empowered, with the Hefei International Semiconductor Industry Exhibition as the link, gathering more than 600 high-quality enterprises and more than 30000 industry practitioners from home and abroad. Abandoning the shallow display mode of traditional exhibitions, the focus is on four core areas: technology breakthrough, supply chain docking, enterprise financing, and talent cultivation. Through special forums, precise docking, and achievement roadshows, the growth chain of small and medium-sized science and technology innovation enterprises is connected, allowing start-up technology teams to have a stage, high-quality enterprises to have a market, and innovative technologies to have a landing channel.

Regional coordinated development is the distinctive background of Hefei's semiconductor industry in 2027. Based on the pattern of industrial integration in the Yangtze River Delta, Hefei actively links the semiconductor industry resources in the Yangtze River Delta and central regions, signs cross regional industrial synergy agreements, and achieves supply chain complementarity, technological exchange, and resource sharing. Relying on the scale advantage of the Chuzhou Sealing and Testing Industry Base, and linking with the core capabilities of design and manufacturing in Hefei, a provincial industrial linkage pattern of "research and development in Hefei, packaging in eastern Anhui, and full coverage of terminals" has been formed. The cluster effect of the semiconductor industry in the province continues to amplify, with high-end talent gathering exceeding 23000 people and annual patent authorization continuously increasing, laying a solid foundation for talent and scientific and technological innovation for the high-quality development of the industry.

Building a chain from scratch, from existing to strong ecology, from strong to leading the race track. In 2027, Hefei Semiconductor has already shed its youthful vigor as a rising star in the industry, reshaping the domestic semiconductor industry landscape with a fully independent and controllable industrial system, a development model of scene integration, and an innovative ecosystem empowered by science and technology innovation. In the context of the deep adjustment of the global industrial pattern and the deepening of domestic substitution, Hefei has always adhered to its original industrial aspirations, with technological innovation as the core, scenario implementation as the guide, and industrial synergy as the lever, continuously overcoming industrial shortcomings, expanding application tracks, and improving industrial ecology.

Silicon chips build the foundation, and scientific and technological innovation opens a new chapter. Standing at a new starting point of the industry in 2027, Hefei is continuously writing an advanced answer sheet for the domestic semiconductor industry with its surging scientific and technological innovation vitality, complete industrial ecology, and open collaborative attitude, injecting a continuous stream of central strength into the independent self-improvement of China's integrated circuit industry.

Contact the organizing committee Liu Jiao: 13257086620

• Address:3899 Jinxiu Avenue, Baohe District, Hefei City

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