2026 Shanghai International Optical Connectivity Industry Exhibition

Date: December 9-11, 2026

Location: Shanghai New International Expo Center

New technologies and products, creating a one-stop selection and procurement platform

Supporting units: National Supercomputing Shenzhen Center, Guangdong Mobile Guangdong East Data Center, Bohai Big Data Qianhai Intelligent Computing Center, Shenzhen Hong Kong Artificial Intelligence Computing Center, Shenzhen Open Intelligent Computing Center

Organizer: Bohan Exhibition (Shanghai) Co., Ltd., Delphi Exhibition (Shanghai) Co., Ltd

Thanks to the National Supercomputing Shenzhen Center

Seize the new opportunities in the optical communication+AI computing industry!

The exponential growth of data throughput during the training process of AI large models has led to increasingly high requirements for the speed of optical interconnection, signal integrity, and power consumption ratio. Driven by the wave of this industry, the innovation vitality in the field of optical interconnection continues to burst, and various optical interconnection solutions adapted to AI computing scenarios continue to emerge, directly promoting the dual dividends of "market demand" and "technological change" in the optical communication industry, becoming one of the core tracks of global technology industry layout.

At present, the optical interconnection industry has entered a new stage of diversified development, from optical interconnection and copper connection to new technological routes such as OIO, CPO/CPC, NPO, LPO, etc. Different technological paths form complementary layouts for the differentiated scenario requirements of AI computing power; At the same time, in terms of transmission performance and device accuracy, the industry's exploration has never stopped - advanced integration technologies such as silicon optical heterojunction integration and thin film lithium niobate heterojunction integration are accelerating their landing, optical devices such as EML and VCSEL are constantly breaking through, and single channel transmission rates continue to move towards higher levels. High precision, high density, and low loss have become the core pursuits of optical device research and application, fully supporting the efficient operation of AI computing infrastructure.

Since its establishment, Shanghai Optical Connectivity Exhibition has become a leading exhibition in the field of optical communication in China and one of the few industry events for AI computing infrastructure in Asia. The previous exhibition had a display area of 20000 square meters, setting a record for the largest in history, with over 30000 professional visitors. Attracted international pavilions, institutions, and units from 13 countries and regions including China, the United States, Japan, Canada, Finland, France, Germany, Italy, South Korea, and Sweden to participate in the exhibition. The internationalization ratio exceeded 18%, and the exhibition achieved the goal of win-win for all parties, achieving satisfactory results.

The 2026 Shanghai Optical Connection Industry Exhibition will be held at the Shanghai New International Expo Center from December 9-11, 2026. More than 700 optical connection industry chain enterprises will participate, and the exhibition scale will reach 26000 square meters, covering the entire optical communication industry chain (chips, devices, modules, equipment, terminals and applications). It will comprehensively display cutting-edge technologies and products from optical chips, optical modules, optical materials, FAUs to optical production and testing, connect the upstream and downstream of the optical communication industry, directly target core technology trends such as NPO/XPO/CPO/OCS in the era of AI computing power, and explore the future of the industry together!

Exhibition data:

20+countries and regions

Over 30000 professional visitors

700+high-quality exhibitors

20000+square meters of exhibition area

30+exciting events

Simultaneous activities:

The 7th Shanghai Data Center Liquid Cooling Industry Exhibition (CIME 2026)

2026 China Optical Connectivity Industry Development Forum

Core highlights of the exhibition:

● Focus on the three core scenarios of AI computing power interconnection

Scale up (vertical expansion), Scale out (horizontal expansion), Scale cross (cross domain interconnection), directly targeting the core needs of the industry

● Covering multiple chip solutions

Fully showcase EML, VCSEL, Sipho, TFLN, and coherent chip technologies, unlocking the core support for computing power interconnection

Multi architecture optical interconnect technology

CPO, NPO, LPO, DPO (pluggable), explore the application value and development trends of different technological paths

● Implementation of cutting-edge technologies

Unlocking breakthroughs in the application of new types of optical fibers (multi-core fibers, hollow chip fibers) in computing power interconnection

● Fully automated production and manufacturing upgrade

From automatic grinding, assembly, cutting, and cleaning of MPO to FA, to automatic coupling, mounting, assembly, and testing of optical engines and modules, the new production capacity presents intelligent manufacturing capabilities

● Gather the ecological power of all-optical interconnection

700 exhibiting companies gather to build an industry platform for technical exchange, resource docking, and win-win cooperation

Exhibition scope:

● Optical chip/electrical chip

● Optical transceiver components/optical devices

● Optical module/optical engine

Fiber optic cable/fiber optic connector

● Testing instruments/production equipment

● Optical communication raw materials

● Data center/5G/AI computing power solution provider

Organizing Committee Secretariat:

Contact person: Mr. Wang 132 6169 9659 WeChat Same Number

Phone: 021-5296 2655

Reminder: The earlier you register and confirm, the more advantageous your position will be!

• Telephone:132 6169 9659
• Contact:Mr. Wang
• Mobile:132 6169 9659
• Address:No. 2345 Longyang Road, Pudong New Area, Shanghai

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