A chip is the starting point of the digital industry; A fertile land for the industry, building a highland for the development of domestic semiconductors. Relying on a sound industrial layout, strong scientific research capabilities, and mature supporting chains, the integrated circuit industry in Hefei has steadily grown from the "core" starting point of exploration to a highly competitive industrial "core" highland in central China. The 2027 Hefei Wanxin Exhibition kicked off as scheduled, gathering high-quality resources from the entire industry chain, focusing on independent technological breakthroughs, and promoting industry ecological win-win cooperation, to create an annual and highly significant integrated circuit professional event.

Looking back at the path of development, Hefei Integrated Circuit started from scratch, identified the right development track, and steadily deepened its cultivation. Relying on the industrial layout of "chip screen integration and lifelong intelligence", we gather upstream and downstream enterprises in wafer manufacturing, IC design, packaging and testing, equipment materials, and third-generation semiconductors to build a complete industrial system that connects research and development, mass production, and application. The scientific research forces of universities such as University of Science and Technology of China and Hefei University of Technology continue to empower, and leading enterprises and specialized and new supporting manufacturers work together to achieve localization of many core equipment, key materials, and high-end chips that once relied on imports, completing the leap from industrial germination to regional chip cities, and firmly establishing the core development highland of integrated circuits in China. This year's Wanxin Exhibition is a concentrated showcase of Hefei's years of industrial accumulation.

Based on the current situation, the exhibition focuses on technological breakthroughs as the core theme, presenting the independent innovation achievements of domestic semiconductors in all aspects. The exhibition hall covers sub sectors of the entire industry chain, including computing chips, automotive grade ICs, and storage design, showcasing the domestic chip design level; Advanced processes, Chiplet chips, and 2.5D packaging technology highlight breakthroughs in manufacturing processes; Core supporting equipment such as lithography equipment, electronic specialty gases, silicon carbide substrates, EDA tools, etc. are showcased, facing the bottlenecks and difficulties in the industry chain, and intuitively demonstrating the latest progress in overcoming difficulties in the industry. Major enterprises showcase cutting-edge new products and innovative processes on the same stage, focusing on the domestic substitution track, sharing their experience in implementing self-developed technologies, and comprehensively recording the solid steps of the industry to break through technological barriers and achieve independent breakthroughs.

Beyond product display, Wanxin Exhibition takes ecological win-win as its development core, and opens up channels for multi-party exchange of industry, academia, research, and capital. The exhibition is accompanied by multiple high-end industry forums, technology docking meetings, and school enterprise cooperation sessions, inviting academicians and experts, enterprise technical leaders, investment institutions, and university research teams to gather together for in-depth discussions on popular directions such as advanced manufacturing, wide bandgap semiconductors, automotive chips, and AI computing power. On site construction of a dedicated platform for supply and demand docking, project cooperation, and achievement transformation, connecting upstream materials and equipment, midstream chip manufacturing, and downstream terminal applications, promoting regional industrial linkage and cross enterprise collaboration, breaking information silos, and achieving resource interconnection and complementary advantages.

At the same time, the exhibition is linked to the semiconductor industry cluster in the Yangtze River Delta, and to various characteristic industrial sectors within the province, promoting efficient flow of technology, talent, and capital. Provide display and cooperation channels for small and medium-sized science and technology innovation enterprises, build a bridge for mass production and transformation of scientific research achievements, unite industry forces with the power of the platform, bid farewell to the development model of going it alone, and build an open, collaborative, mutually beneficial and symbiotic new industrial ecology.

The global semiconductor landscape continues to change, and independent innovation and industrial synergy have become the trend of industry development. From the initial exploration of the "core" starting point, to the current "core" highland of industrial agglomeration and technological leadership; From the technological breakthrough of a single enterprise to the ecological win-win of the whole chain working together, Hefei has always been at the forefront of the development of domestic integrated circuits.

2027 Hefei Wanxin Exhibition, carrying the industry's past accumulation, heading towards a new future in the industry. We cordially invite industry experts, research scholars, and colleagues from enterprises to gather in Hefei to witness the breakthroughs in domestic chip technology, discuss the path of coordinated industrial development, and work together to build a new semiconductor industry ecosystem that is independent, controllable, and mutually beneficial.

Organizing Committee Sun Yan, 176 * * 2156 * * 8521, cordially invites!

Scope of Exhibition: Covering the Core Field of Semiconductors

Ic Design and Chip Zone

EDA full process design software, IP core, embedded system software, digital/analog/mixed signal integrated circuit design, version

Design and validation services for graphics; Artificial intelligence chips (end side/edge/training), general-purpose GPUs

NPU、TPU、DPU、AI SoC、 Large model training and inference chip, heterogeneous computing processor, high and low voltage power supply

Management chip (PMIC), industrial IoT MCU, 5G/millimeter wave RF chip, automotive grade chip (AEC)-

Q100 certification), secure encryption chip, storage chip (DRAM/Flash/storage control chip, high bandwidth memory)

HBM、 Storage stacked chips, full category display driver chips (OLED/LCD/TCON/Mini Micro)

LED)、 Integrated storage and computing chip, AI storage and computing fusion chip, intelligent vision chip; Server CPU, memory interface chip

Core chips and supporting components for AI servers and data centers, including chips, high-speed optical modules, and silicon optical integration.

Semiconductor Materials Zone

12 inch semiconductor silicon wafer (polished/epitaxial/SOI silicon wafer), high-end photoresist (ArF/KrF/wire) and supporting testing

Agent, high-purity electronic special gas, CMP polishing solution and polishing pad, high-purity metal target material (AI/Cu/Ti/Ta/W alloy target)

Materials, photolithography supporting chemicals, photomask plates, wet electronic chemicals, semiconductor precursor materials, special coating materials

Materials, functional thin film materials, wide bandgap compound semiconductor materials (SiC/GaN/gallium oxide substrates and epitaxial materials)

High end packaging materials (packaging substrate, lead frame, bonding wire, epoxy plastic packaging material, etc.)

Advanced Packaging and Testing Zone

Chiplet chip heterogeneous integration technology, 2.5D/3D stacked packaging, TSV silicon via process, Fan out fan out sealing

Assembly, WLCSP wafer level packaging, Bumping bump manufacturing, SiP system level packaging: dedicated packaging for storage chips

Test and vehicle grade high reliability packaging, power semiconductor module packaging; Integrated Circuit Testing Equipment and Technology: ATE Fully Automatic

Testing system, digital/analog/mixed signal testing, high-low temperature personalized testing system, failure analysis equipment

(SEM/EDX/FIB)、 Wafer yield control and data analysis system

Application Ecological Zone of "Chip Screen Auto Fusion"

Display field: Mini/Micro LED, OLED, LCD new display driver technology, automotive display flexible display

Display with ultra clear high refresh rate, showcasing integrated core chips and supporting materials;

Automotive field: automotive grade core chips, battery management systems (BMS), automotive motor controllers, onboard power modules

Block;

Industrial/AI/data center field: industrial control chip, edge computing intelligent module, AI computing module, server computing

Power acceleration solution, large model hardware matching, dedicated chips for servers and storage, industrial/automotive grade sensor interface chips

Film:

Industrial supporting facilities: industrial policy promotion, industrial funds, industrial park carriers, industry university research innovation achievements, product testing and certification

Certificate, intellectual property, and comprehensive industry supporting services.

Integrated Circuit Manufacturing Zone

12 inch wafer manufacturing and outsourcing, DRAM storage wafer manufacturing, display driver (DI) wafer manufacturing

Manufacturing, 28/40nm logic/MCU characteristic process, power device/BD/MEMS dedicated process, IDM vertical integration

Whole plant project, overall construction plan for circular wafer factory, process upgrade and mass production supporting solution, wafer regeneration, wafer testing

Verification, process reliability assessment, and mass production yield optimization services; Covering advanced GAA processes, backside power supply processes, glass

Cutting edge new process technologies and supporting services such as glass packaging substrates and photonic SOI: mask detection and mask repair equipment

And supporting technical solutions.

Semiconductor Equipment and Core Components Zone

Front equipment: lithography equipment, etching equipment, thin film deposition equipment (PVD/CVD/ALD), ion implantation equipment

Preparation, semiconductor grade cleaning equipment, coating and developing equipment, precision measurement and testing equipment, annealing/oxidation/diffusion heat treatment equipment

Prepare:

Rear equipment: round thinning machine, round cutting machine, solidification machine, bonding equipment, plastic sealing equipment, cutting and forming equipment

Preparation and testing of sorting machines, automatic probe stations, ATE integrated circuit testing systems:

Core precision components: dry vacuum pump, RF power supply, electrostatic chuck (ESC), wafer transfer equipment (EFE)

M)、 High purity control valves, precision motion platforms, optical components, semiconductor specific robots, and automation supporting departments

Components, semiconductor precision ceramic parts, cavity components, heaters, wafer carrier accessories, equipment precision consumables, non-standard

Customized components; Complete solutions for wafer handling automation and wafer inspection automation; Ultra pure semiconductor factory building

Water system, clean room equipment, and supporting engineering facilities.

Third Generation Semiconductor Zone

Second and Third Generation Compound Semiconductor Materials and Devices: Silicon Carbide (SiC), Gallium Nitride (GaN), Gallium Oxide, Arsenic

Gallium doped (GaAs), indium phosphide (InP) substrates and epitaxial materials, various power devices, RF microwave devices, high

Fast communication devices and wide bandgap semiconductor power modules; Focus on new energy vehicles, photovoltaic energy storage, industrial power sources, and high-end

Integrated application solutions for power semiconductors and RF communication in fields such as fast charging, 5G/6G communication, aerospace information, microwave radar, etc

Solution.

Components Zone

Vehicle grade/industrial grade resistors, capacitors, potentiometers, power semiconductor discrete devices, high-end specialized connectors, heat dissipation

Instruments and electromechanical components: electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, industrial/automotive grade sensors

Devices, dedicated power supplies, switches, micro motors, electronic transformers, relays; High end printed circuit board (HDI/high-frequency)

High speed/automotive grade PCB, various specialized circuits, piezoelectric, crystal, quartz, ceramic magnetic materials; For printed circuits

Substrate, electronic functional process specific materials, electronic adhesive (tape) products, electronic chemical materials and components: microwave

High end specialized components, communication equipment microwave materials, microwave RF testing instruments, industry-specific software, electronic tubes, etc

Supporting components and materials

• Company:Beijing Zhongwei International Exhibition Co., Ltd
• Contact:Sun Yan
• Mobile:17621568521
• E-mail:2119857701@qq.com
• Address:3899 Jinxiu Avenue, Baohe District, Hefei City

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