At present, the global semiconductor industry is bidding farewell to the competition of single technology and entering a deep integration period of technological iteration, scenario implementation, and ecological collaboration. The path for domestic semiconductors to break through is no longer simply about equipment replacement and chip mass production, but rather a closed-loop upgrade of the entire industry chain and cross disciplinary scenario symbiosis. On May 18-20, 2027, the second China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition (CICE 2027 Wanxin Exhibition) will be held at the Hefei Binhu International Convention and Exhibition Center. Breaking away from the traditional exhibition mode of "static display and shallow negotiation", the exhibition will focus on "winning the chip era and co creating the future of chips" and rely on Hefei's unique industrial ecology to create the first integrated chip industry platform in China that combines "technology research and development+scene application+commercial landing+capital empowerment", bringing a revolutionary industrial event to the industry.

Unlike the Beijing, Shanghai, Guangzhou, and Shenzhen Semiconductor Exhibition, which focuses on global trade and single industry chain display, the core competitiveness of the 2027 Hefei Wanxin Exhibition lies in its unique advantages of deep binding of exhibition production and nearby scene landing. As a true "IC Capital of China", Hefei has been deeply involved in the integrated circuit industry for many years, gathering more than 450 upstream and downstream enterprises, forming a hundred billion level industrial cluster, and building a complete industrial closed loop covering design, manufacturing, packaging and testing, equipment, and materials. What is even more advantageous is the mature local "chip screen automotive integration, lifelong intelligence" trillion yuan terminal industry, which has completely bid farewell to the development pain points of "no scene for research and development, no market for mass production" in the semiconductor industry.

This exhibition accurately targets the pain points and trends of the industry, breaks down the information barriers between upstream and downstream, and creates a dedicated area for the supply and demand docking of chip screen automotive products. New energy vehicle companies such as NIO and Chery, new display leaders such as BOE, and AI terminal enterprises such as iFlytek and local intelligent computing centers are stationed at designated sites to directly engage with upstream chip, equipment, and material manufacturers for precise procurement and coordination. From automotive grade MCUs and SiC power devices to AI computing power NPUs and HBM storage chips, from photolithography and etching core equipment to special semiconductor materials, all exhibited technologies and products can directly face real market demand, achieving "exhibition docking is project docking, technology display is landing opportunity", completely solving the problem of industry supply-demand mismatch.

The 30000 square meter immersive super large exhibition area has been fully upgraded, segmented into eleven major professional tracks, and accurately covers the current three golden trend areas. In the AI computing semiconductor field, we will showcase high-end computing chips adapted to large models, advanced packaging Chiplet technology, and 2.5D/3D stacking processes, unlocking the innovative logic of AI underlying hardware; In the field of automotive semiconductor, we focus on in vehicle power chips, safety control chips, and automotive electronic solutions, fully adapting to the intelligent and high-end upgrading needs of new energy vehicles; In the third-generation semiconductor field, SiC and GaN wide bandgap device mass production technology, as well as new energy-saving power devices, are being launched, precisely empowering emerging industries such as new energy, energy storage, and photovoltaics. At the same time, the full chain exhibition areas of EDA design, wafer manufacturing, advanced packaging and testing, and raw and auxiliary materials were simultaneously unveiled, presenting a comprehensive breakthrough of domestic semiconductors from source research and development to terminal applications.

A top industry event is not just about showcasing products, but also about intellectual collision and industry empowerment. In 2027, Wanxin Exhibition will simultaneously support more than 20 high-level industry summits and special docking activities, building a multi-level and all-round industry exchange system. The Automotive Semiconductor Compliance and Mass Production Summit Forum focuses on the standard barriers and production challenges of domestic substitution for automotive chips; Computing chip innovation application salon, deeply dismantling the new trend of hardware iteration in the AI era; Special session on the transformation of industry university research achievements, linking research teams from universities such as University of Science and Technology of China and Hefei University of Technology, and bridging the last mile from cutting-edge laboratory technologies to industrial implementation; The industrial investment and financing roadshow and park investment matching meeting will be held simultaneously, injecting capital vitality into hard technology projects and building cooperation bridges for industrial agglomeration.

From single point technological breakthroughs to full chain ecological co construction, from single product exhibitions to industrial resource aggregation, the 2027 Hefei Semiconductor Exhibition has redefined the value core of industrial exhibitions in the new era. There is no homogeneous exhibit stacking here, only technology landing that meets the urgent needs of the industry, precise and efficient supply and demand matching, and forward-looking industry insights.

The wind blows through Jianghuai, and the core opens up a new journey. In May 2027, by the shore of the lake, this chip industry event based in central China, radiating across the country, and connecting the world will gather the innovative forces of the entire industry, witness the new leap of domestic semiconductors from "independent and controllable" to "innovation led", and write a new chapter in the high-quality development of China's integrated circuit industry

• Address:3899 Jinxiu Avenue, Baohe District, Hefei City

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