When silica sand is refined into nano veins and computing power waves open up a new era in the industry, the second China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition (CICE Wanxin Exhibition) will be held at the Binhu International Convention and Exhibition Center in Hefei from May 18-20, 2027. With a 30000 square meter exhibition booth covering the entire industry chain, more than 600 upstream and downstream enterprises, and 30000 global professional visitors, a dialogue of the times belonging to domestic semiconductors will be held in the "IC Capital of China".

The outside world always says that Hefei is "betting on chips", but few people understand the industrial logic that this city has been deeply cultivating for ten years: from Changxin Storage to achieve independent mass production of DRAM storage, breaking the overseas monopoly; Jinghe Integrated has become the leading global manufacturer of display driver chips; More than 450 integrated circuit companies have rooted themselves in Jianghuai, forming a closed-loop ecosystem of design, wafer manufacturing, advanced packaging and testing, equipment materials, third-generation semiconductors, and terminal applications. The annual output value has exceeded 150 billion yuan, building a unique "chip screen automotive" industry rainforest in China. This fertile land, which is home to the Microelectronics Laboratory of the University of Science and Technology of China, complete water and electricity facilities, and the hinterland of the Yangtze River Delta, naturally becomes the core battlefield for domestic chip breakthroughs, and also gives the 2027 Wanxin Exhibition a unique confidence that sets it apart from other domestic exhibitions - it is not simply a product exhibition and sales, but a fully coordinated industrial resonance field.

This exhibition has completely broken down the information barriers of the industrial chain, with six characteristic exhibition areas appearing simultaneously: the IC design and AI computing chip zone focuses on showcasing large model computing power, automotive grade control, and industrial sensing self-developed chips; The wafer manufacturing exhibition area showcases mature 28nm process expansion and characteristic process mass production solutions; The Semiconductor Equipment and Materials Zone gathers breakthroughs in domestic lithography equipment, target materials, and electronic specialty gases; The advanced packaging zone focuses on cutting-edge technologies such as Chiplet chips, Flip Chips, and 2.5D packaging; The third generation semiconductor zone focuses on new energy power devices such as silicon carbide and silicon nitride; The exclusive "Chip Screen Automotive Integration" application exhibition area connects the procurement links of display, new energy vehicles, energy storage, and industrial control terminals, achieving one-stop docking of "upstream materials midstream manufacturing downstream terminals". Unlike traditional exhibitions that only focus on product display, the 2027 Hefei Semiconductor Exhibition creates an integrated exchange system for industry, academia, research, and investment: 100 industry forums cover core topics such as domestic substitution, compliance with automotive regulations and chips, industrialization of wide bandgap semiconductors, and localization of EDA tools; The research teams of University of Science and Technology of China and Hefei University of Technology released cutting-edge laboratory patents on site; The Industrial Capital Matchmaking Conference provides financing channels for small and medium-sized chip enterprises, as well as specialized and innovative manufacturers; The Yangtze River Delta and Central Semiconductor Industry Alliance signed a collaborative cooperation agreement on site to open up cross regional supply chain supporting channels. Behind the exhibition is a key turning point for the domestic semiconductor industry to move from "single point breakthrough" to "full chain autonomy".

The explosion of AI has generated a massive demand for computing chips, new energy vehicles are driving the increase in power chips, industrial manufacturing upgrades are forcing mature process capacity expansion, and global supply chain restructuring is accelerating the landing of local supporting facilities. Hefei, with a complete industrial cluster as its foundation and Wanxin Exhibition as the central core communication platform, undertakes the era proposition of industrial transformation: here, equipment manufacturers can find wafer fab landing orders, design companies can connect with packaging and testing production capacity, material companies match terminal needs, and scientific research achievements can quickly complete pilot transformation. Silicon based micro light illuminates the industrial journey. The 2027 Binhu Convention is not just an industry event, but also a microcosm of domestically produced chips being independently controllable. Chip industry professionals from around the world gather in Wanjiang, using technology as a bridge, industry as the foundation, and collaboration as the core, to jointly write a new chapter in China's integrated circuits.

• Address:3899 Jinxiu Avenue, Baohe District, Hefei City

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