- Industry: Communications / Electronics
- Cycle: Once a year
- Time: 2026/10/27 - 10/29 (Tues To Thur Total 3 Days) Error Correction
- Address: Shenzhen City Shenzhen International Convention and Exhibition Center (New Building) ChinaGuangdong ProvinceShenzhen CityBao'an District No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen
- Sponsor:China Electronic Circuit Industry Association (CPCA)
- Organizer:China Electronic Circuit Industry Association (CPCA)
- Contact:Cheng Xiao
- Mobile:18221843043
- E-mail:18221843043@163.com
- Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen
INTRODUCTION
2026 Electronic Semiconductor Industry Innovation and Development Conference
International Electronic Circuit (Greater Bay Area) ExhibitionCPCA Show Plus
Exhibition time: October 27-29, 2026
Exhibition location: Shenzhen International Convention and Exhibition Center (Bao'an)
Host: China Electronic Circuit Industry Association (CPCA)
Supporting units: China Semiconductor Industry Association, Guangdong Society of Aeronautics and Astronautics
The Electronic Semiconductor Industry Innovation and Development Conference and International Electronic Circuit (Greater Bay Area) Exhibition (hereinafter referred to as "CPCA Show Plus") is a technology driven event hosted by the China Electronic Circuit Industry Association (CPCA) and specially supported by the China Semiconductor Industry Association and the Guangdong Aerospace Society. Since the successful first event in 2024, we have continuously conducted research on industry changes and needs based on industry development. Through the continuous innovation model of "conference+exhibition+X", we have upgraded and stimulated the innovation ability of the industry, and fully promoted the upgrading and development of the entire industry chain.
The conference focuses on showcasing the latest products and technological achievements in the fields of printed circuit boards, semiconductors, packaging substrates and ceramic substrates, electronic circuit supply chain, intelligent manufacturing, and sustainable development. It deeply explores the cutting-edge applications of electronic circuits and semiconductors in various fields such as automotive electronics, aerospace, new energy, and consumer electronics, and helps to extend and upgrade the industrial chain.
Scope of exhibits:
Printed Circuit Board: Technologies, Equipment, and Products Related to Printed Circuit Board Manufacturing Semiconductor, Packaging Substrate, and Ceramic Substrate: Manufacturing Technologies and Products for Semiconductor, Packaging Substrate, and Ceramic Substrate;
Electronic assembly: electronic assembly equipment, raw materials, electronic manufacturing, and manufacturing services;
Electronic circuit supply chain: equipment, raw materials, electronic chemicals, packaging and testing equipment materials;
Future factories and intelligent manufacturing: intelligent factory solutions, intelligent manufacturing materials, intelligent manufacturing services and innovative technologies, industrial Internet, industrial robots;
Sustainable development: environmental protection, water treatment, clean room technology and equipment, ESG assessment agencies;
Others: media, industry associations, academic research institutions, consulting service agencies, industry related universities, investment institutions.
Some participating companies:
PCB manufacturing: Shennan, Jinbaize, Jingwang, Xingsen, Jialichuang, Bomin, Chaoyi, Kexiang, Meiwei, Shantou Ultrasonic, Yidun, Longteng, Benqiang, Jingchengda
PCB equipment: Dazu, Yunteng, Huagong, Shengxiong, Universe, Boke, Jinfubao, Xinjiwei, Nidec, Taikesite, Tianzhun, Huagong, Jiejun, Keqiao
Chemicals: Anmete, Boquan, Beijia, Chuangzhi Xinlian, Songbai Science and Technology, Tiancheng, Tianxi, Mingtian, Dongchao, Haitian, Anbang
Raw and auxiliary materials: Jinzhou, Dingtai High tech, Huilian, Jiangnan, Dingqin, Huaren Sanhe, Yanmo, Guangxin Photographic, Longdian Huaxin, Qianhai Dongyang
Exhibition data for 2025:
The exhibition area has reached 37500 square meters, an increase of 25% compared to 2024;
358 exhibiting companies, a year-on-year increase of 21%;
Attracted 38971 professional visitors from 21 countries/regions at home and abroad, with a year-on-year increase of 10.8% in the number of visitors;
We have created 7 themed exhibition areas, held over 20 supporting activities, and gathered more than 100 industry think tanks to bring a feast of ideological collision to the industry.
CPCA 2026 simultaneous activities:
2026 Autumn International PCB Technology/Information Forum
The launch ceremony of the new season of the Global A+Hardware Innovation Conference and the "Spark" Global Hardware Innovation Competition
2026 Technology Frontier OPEN TALK
Tailored Intelligent Ecological Development Forum - PCB Core Carrier Innovation and Application Forum
Forum on the Development of Commercial Aerospace and Electronic Circuit Scale Manufacturing Technology
CPCA Group Standard Development and Effectiveness Release Conference
The 2nd Greater Bay Area Public Welfare Health Run "Rhythmic Bay Area, Starting to Run"
2026 PCB Investment Annual Meeting
Copper Cladding Technology and Application Forum
Core board collaboration · Advanced packaging substrate technology and application development forum
Here, we not only showcase the latest products and technological achievements in the fields of printed circuit boards, semiconductors, packaging substrates, ceramic substrates, electronic circuit supply chain, intelligent manufacturing, sustainable development, etc., but also deeply explore the cutting-edge applications of industries in AI, automotive electronics, aerospace, new energy, consumer electronics, and other fields, helping to extend and upgrade the industrial chain, creating an industrial chain ecosystem that integrates cutting-edge technology display, deep industry dialogue, global business opportunity linkage, and future trend co creation, and building multiple industry innovation and supply and demand docking platforms.
Scope
Printed Circuit Board: Technologies, Equipment, and Products Related to Printed Circuit Board Manufacturing Semiconductor, Packaging Substrate, and Ceramic Substrate: Manufacturing Technologies and Products for Semiconductor, Packaging Substrate, and Ceramic Substrate;
Electronic assembly: electronic assembly equipment, raw materials, electronic manufacturing, and manufacturing services;
Electronic circuit supply chain: equipment, raw materials, electronic chemicals, packaging and testing equipment materials;
Future factories and intelligent manufacturing: intelligent factory solutions, intelligent manufacturing materials, intelligent manufacturing services and innovative technologies, industrial Internet, industrial robots;
Sustainable development: environmental protection, water treatment, clean room technology and equipment, ESG assessment agencies;
Others: media, industry associations, academic research institutions, consulting service agencies, industry related universities, investment institutions.
Costs & Precautions
Contact
- Contact:Cheng Xiao
- Mobile:18221843043
- E-mail:18221843043@163.com
- Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen
Disclaimer
The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870



