With the rapid rise of the central integrated circuit industry,2027 Anhui Semiconductor Exhibition (Hefei Semiconductor Exhibition)The overall specifications, industry influence, and audience quality have been comprehensively upgraded to meet the high-end display needs of leading enterprises, brand manufacturers, and listed companiesHefei Semiconductor ExhibitionWe will focus on opening large-scale special exhibition booths in multiple core areas, and provide priority reserved channels for top enterprises in the entire industry chain to help them establish benchmark brand images at central core industry exhibitions.

Large special booth as2027 Wanxin ExhibitionThe golden display resources are concentrated in the main channel of the exhibition hall, next to the main venue of the forum, and directly facing the core area at the entrance. It is the core exhibition area with the highest foot traffic, exposure, and longest audience stay. Compared to standard booths, the large special booth at the Hefei Semiconductor Exhibition has no wall restrictions, is spacious, and highly adaptable. Enterprises can freely customize high-end booth designs, brand image walls, LED display areas, new product launch zones, private business negotiation areas, and rest and reception spaces according to brand tone.

At the level of brand display, large special booths are the showcase for top enterprisesHefei Semiconductor ExhibitionThe preferred resource. The large display area can fully showcase the entire range of products, core technologies, overall production capacity, and solutions of the enterprise, suitable for brand enterprises such as semiconductor equipment, core materials, packaging and testing leaders, chip design, power devices, etc. to create an "annual brand image exhibition booth". High end special equipment construction has strong visual impact and high recognition, which can quickly attract industry experts, procurement decision-makers, investors, and park investment teams to stop and visit, greatly enhancing the brand's visibility and industry discourse power in the central semiconductor market.

At the level of business integration,2027 Wanxin ExhibitionThe large booth has flexible functional zoning and can independently set up product demonstration area, technical exchange area, business negotiation area, and VIP reception area, achieving one-stop landing for display, demonstration, negotiation, and signing. Faced with a massive group of terminal procurement groups such as new energy, new displays, industrial control energy storage, and automotive electronics, large booths can handle high-density foot traffic, calmly carry out one-on-one deep docking, and effectively improve intention conversion rate and accurate transaction rate.

rely onHefei Semiconductor ExhibitionThe advantage of clustering the entire industry chain, and the core large-scale booths also have a strong circle effect. Top enterprises are concentrated to settle in, forming industry benchmark exhibition areas, attracting more high-quality buyers and industry teams to visit in groups, creating a strong linkage and resource exchange exhibition atmosphere, and further amplifying the value of participation. For enterprises planning to deeply cultivate the central market, layout regional channels, and enhance industry brand status, locking in2027 Wanxin ExhibitionThe core large booth is a key layout for seizing the dividends of the semiconductor industry in central China in 2027.

currently2027 Wanxin ExhibitionThe popular large-scale special booth has entered the priority booking stage, and the core location resources are limited, first come, first served. Many industry leaders have already secured core display seats in advance, preparing for the Hefei Central Chip Industry Expo in May next year.

Ic Design and Chip Zone

EDA full process design software, IP core, embedded system software, digital/analog/mixed signal integrated circuit design, layout design and verification services; Artificial intelligence chips (end/edge/training), general-purpose GPUs, NPUs, TPUs, DPUs, AISoC, large model training and inference chips, heterogeneous computing processors, high and low voltage power management chips (PMIC), industrial IoT MCUs, 5G/millimeter wave RF chips, automotive grade chips (AEC-Q100 certified), secure encryption chips, storage chips (DRAM/Flash/storage control chips, high bandwidth memory HBM, storage stack chips), full category display driver chips (OLED/LCD/TCON/Mini MicroLED), integrated storage and computing chips, AI storage and computing fusion chips, intelligent vision chips; Server CPU, memory interface chip, high-speed optical module, silicon optical integration and other AI server and data center core chips and supporting components.

Semiconductor Materials Zone

12 inch semiconductor silicon wafer (polished/epitaxial/SOI silicon wafer), high-end photoresist (ArF/KrF/i wire) and supporting reagents, high-purity electronic special gas, CMP polishing solution and polishing pad, high-purity metal target material (AI/Cu/Ti/Ta/W alloy target material), photolithography supporting chemicals, photomask plate, wet electronic chemicals, semiconductor precursor materials, special coating materials, functional thin film materials, wide bandgap compound semiconductor materials (SiC/GaN/gallium oxide substrate and epitaxial materials), high-end packaging materials (packaging substrate, lead frame, bonding wire, epoxy encapsulation material, etc.).

Advanced Packaging and Testing Zone

Chiplet chip heterogeneous integration technology, 2.5D/3D stacked packaging, TSV silicon via process, Fan out fan out packaging, WLCSP wafer level packaging, Bumping bump manufacturing, SiP system level packaging; Specialized packaging and testing for storage chips, automotive grade high reliability packaging, and power semiconductor module packaging; Integrated circuit testing equipment and technology: ATE fully automated testing system, digital/analog/mixed signal testing, high and low temperature aging testing system, failure analysis equipment (SEM/EDX/FIB), wafer yield control and data analysis system.

Integrated Circuit Manufacturing Zone

12 inch wafer manufacturing and outsourcing, DRAM storage wafer manufacturing, display driver (DD1) wafer manufacturing, 28/40nm logic/MCU characteristic process, power device/BD/MEMS dedicated process, IDM vertical integration whole plant project, overall construction plan of wafer plant, process upgrade and mass production supporting solution, wafer regeneration, wafer testing and verification, process reliability evaluation, and mass production yield optimization services; Covering advanced GAA processes, backside power supply processes, glass packaging substrates, photonic SOI and other cutting-edge new process technologies and supporting services; Mask detection, mask repair equipment, and supporting technical solutions.

Semiconductor Equipment and Core Components Zone

Front equipment: lithography equipment, etching equipment, thin film deposition equipment (PVD/CVD/ALD), ion implantation equipment, semiconductor grade cleaning equipment, coating and developing equipment, precision measurement and testing equipment, annealing/oxidation/diffusion heat treatment equipment

Rear equipment: wafer thinning machine, wafer cutting machine, solidification machine, bonding equipment, plastic packaging equipment, rib cutting and forming equipment, testing sorting machine, automatic probe station, ATE integrated circuit testing system; Core precision components: dry vacuum pump, RF power supply, electrostatic chuck (ESC), wafer transfer equipment (EFEM), high-purity control valve, precision motion platform, optical components, semiconductor specific robots and automation supporting components, semiconductor precision ceramic components, cavity components, heaters, wafer carrying accessories, equipment precision consumables, non-standard customized components; Complete solutions for wafer handling automation and wafer inspection automation; Ultra pure water system, clean room equipment, and supporting engineering facilities in semiconductor factory buildings.

Third Generation Semiconductor Zone

Second and third generation compound semiconductor materials and devices: silicon carbide (SiC), gallium nitride (GaN), gallium oxide, gallium arsenide (GaAs), indium phosphide (InP) substrates and epitaxial materials, various power devices, RF microwave devices, high-speed communication devices, and wide bandgap semiconductor power modules; Focusing on the overall application solutions of power semiconductors and RF communication in the fields of new energy vehicles, photovoltaic energy storage, industrial power supply, high-end fast charging, 5G/6G communication, aerospace information, microwave radar, etc.

Components Zone

Vehicle grade/industrial grade resistors, capacitors, potentiometers, power semiconductor discrete devices, high-end specialized connectors, heat sinks, electromechanical components; Electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, industrial/automotive grade sensors, dedicated power supplies, switches, micro motors, electronic transformers, relays; High end printed circuit boards (HDI/high-frequency/automotive grade PCBs), various specialized circuits, piezoelectric, crystalline, quartz, ceramic magnetic materials; Printed circuit substrates, specialized materials for electronic functional processes, electronic adhesive (tape) products, electronic chemical materials and components; High end specialized supporting components and materials such as microwave components, communication equipment microwave materials, microwave RF detection instruments, industry-specific software, and electronic tubes.

Application Ecological Zone of "Chip Screen Auto Fusion"

Display field: Mini/Micro LED, OLED, LCD new display driver technology, car displays, flexible displays, ultra clear high refresh rate displays, integrated core chips and supporting materials under the screen;

In the automotive field: automotive grade core chips, battery management systems (BMS), automotive motor controllers, and onboard power modules;

Industry/A1/data center field: industrial control chip, edge computing intelligent module, Al computing module, server computing acceleration scheme, large model hardware supporting, server and storage dedicated chip, industrial/vehicle gauge level sensor interface chip;

Industrial Supporting Services: Industrial policy promotion, industrial funds, industrial park carriers, industry university research innovation achievements, product testing and certification, intellectual property rights, and comprehensive industry supporting services.

• Telephone:17512151651
• Contact:Wang Hua, Organizing Committee of Wanxin Exhibition
• Mobile:17512151651
• E-mail:1246862371@qq.com
• Address:3899 Jinxiu Avenue, Baohe District, Hefei City

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870