2026 Wuhan Third Generation Peninsula Body and Flexible Electronics Exhibition

Time: September 22-24 Location: Wuhan International Expo Center

Xindong Jiangcheng · Rouchuang Future empowers new industrial tracks with semiconductors as the core and flexible electronics as the wings

Exhibition Introduction:

Entering 2026, with the deep development of downstream fields such as new energy vehicles, artificial intelligence, and energy storage, the third-generation semiconductor industry is entering a critical stage of scale expansion and intensified competition. Hubei Province has made the semiconductor and flexible electronics industries a key focus of digital economy development. Wuhan has a trillion yuan industrial cluster called "Optical Core Screen End Network", which gathers leading enterprises such as Changjiang Storage, Huaxing Optoelectronics, FiberHome Communications, and Changfei Fiber, forming a complete electronic information industry chain from materials, devices to terminal applications. Third generation semiconductors and flexible electronics are the core supporting components, and market demand is growing at an average annual rate of over 25%.

The 2026 Wuhan Third Generation Semiconductor and Flexible Electronics Industry Exhibition will be held at the Wuhan International Expo Center from September 22 to 24, 2026. At the same time, the 2026 26th China Machinery Expo and Wuhan Industry Expo will be held. The expo focuses on the two core areas of third-generation semiconductor materials, devices, modules, as well as flexible electronic materials, processes, and terminal products, accurately connecting with the application needs of hundreds of billions of industries such as new energy vehicles, consumer electronics, Internet of Things, intelligent manufacturing, medical health, and photovoltaic energy storage in Central China, building precise docking bridges, helping enterprises showcase core products, expand the Central China market, link high-quality resources, seize industry trends, and promote the large-scale, high-end, and integrated development of the third-generation semiconductor and flexible electronics industries.

Exhibition scope:

Third generation semiconductor materialsSilicon carbide (SiC) material (substrate, epitaxial wafer) · Gallium nitride (GaN) material (substrate, epitaxial wafer) · Gallium oxide (GaO) · Diamond · Aluminum nitride (AlN)

Third generation semiconductor devices and modulesSiC devices (bipolar transistors, MOSFETs, IGBTs), GaN devices (HEMTs, MMICs), third-generation semiconductor power modules, RF modules, optoelectronic devices, testing equipment and technology, semiconductor device packaging, device reliability testing plan

Flexible electronic materialsFlexible substrate materials (polyimide PI, polyethylene terephthalate PET, flexible glass), flexible conductive materials (conductive films, conductive pastes, graphene), flexible packaging materials, flexible sensing materials, material preparation processes and equipment, flexible material detectors

Flexible electronic terminals and applicationsFlexible OLED screens, flexible wearable devices (smart watches, smart bracelets, flexible machines), flexible sensors, flexible batteries, flexible photovoltaic modules, flexible electronics in consumer electronics, medical health, new energy vehicles, IoT and other fields.

Production equipment and testing instrumentsThird generation semiconductor epitaxial equipment, thin film deposition equipment, flexible electronic printing equipment, etching equipment, packaging equipment, bonding equipment, cutting equipment, semiconductor and flexible electronic testing instruments, electrical performance testing, reliability testing, material performance testing, automated production lines, intelligent solutions

Flexible electronic terminals and applicationsFlexible OLED screens, flexible wearable devices (smartwatches, smart bracelets, flexible headphones), flexible sensors, flexible batteries, flexible photovoltaic modules, and flexible electronics applications in consumer electronics, medical health, new energy vehicles, and the Internet of Things

Research achievements and technology transformationThird generation semiconductors in universities and research institutes, research and development achievements in flexible electronic technology, patented technology, new materials, devices, process research and development achievements, exhibition of industry university research cooperation projects, technology transfer services, and incubation projects for scientific research achievements

Supporting Services and Investment Exhibition AreaThird generation semiconductors in universities and research institutes, research and development achievements in flexible electronic technology, patented technology, new materials, devices, process research and development achievements, exhibition of industry university research cooperation projects, technology transfer services, and incubation projects for scientific research achievements

Third generation semiconductor materialsSilicon carbide (SiC) material (substrate, epitaxial wafer) · Gallium nitride (GaN) material (substrate, epitaxial wafer) · Gallium oxide (GaO) · Diamond · Aluminum nitride (AlN)

Third generation semiconductor devices and modulesSiC devices (bipolar transistors, MOSFETs, IGBTs), GaN devices (HEMTs, MMICs), third-generation semiconductor power modules, RF modules, optoelectronic devices, testing equipment and technology, semiconductor device packaging, device reliability testing plan

Flexible electronic materialsFlexible substrate materials (polyimide PI, polyethylene terephthalate PET, flexible glass), flexible conductive materials (conductive films, conductive pastes, graphene), flexible packaging materials, flexible sensing materials, material preparation processes and equipment, flexible material detectors

Flexible electronic terminals and applicationsFlexible OLED screens, flexible wearable devices (smart watches, smart bracelets, flexible machines), flexible sensors, flexible batteries, flexible photovoltaic modules, flexible electronics in consumer electronics, medical health, new energy vehicles, IoT and other fields.

Production equipment and testing instrumentsThird generation semiconductor epitaxial equipment, thin film deposition equipment, flexible electronic printing equipment, etching equipment, packaging equipment, bonding equipment, cutting equipment, semiconductor and flexible electronic testing instruments, electrical performance testing, reliability testing, material performance testing, automated production lines, intelligent solutions

Flexible electronic terminals and applicationsFlexible OLED screens, flexible wearable devices (smartwatches, smart bracelets, flexible headphones), flexible sensors, flexible batteries, flexible photovoltaic modules, and flexible electronics applications in consumer electronics, medical health, new energy vehicles, and the Internet of Things

Research achievements and technology transformationThird generation semiconductors in universities and research institutes, research and development achievements in flexible electronic technology, patented technology, new materials, devices, process research and development achievements, exhibition of industry university research cooperation projects, technology transfer services, and incubation projects for scientific research achievements

Supporting Services and Investment Exhibition AreaThird generation semiconductors in universities and research institutes, research and development achievements in flexible electronic technology, patented technology, new materials, devices, process research and development achievements, exhibition of industry university research cooperation projects, technology transfer services, and incubation projects for scientific research achievements

• Company:Beijing Asia Pacific Ruisi Exhibition
• Telephone:17613391575
• Contact:Li ?
• Mobile:17613391575
• E-mail:2839239427@qq.com
• Address:Wuhan International Expo Center

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