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2026 Shanghai International AI Computing Data Center Industry Expo (Autumn)
Industry: Communications / Electronics
Time: 2026/11/10 - 11/12 (Tues To Thur Total 3 Days)    Error Correction
Address: Shanghai Shanghai New International Expo Center (SNIEC) ChinaShanghaiPudong New Area No. 2345 Longyang Road, Pudong New Area, Shanghai
Sponsor:2026 Shanghai International AI Computing Data Center Industry Expo (Autumn)
Organizer:Shanghai Saimao Exhibition Co., Ltd
120Days To Go
  • Company:Shanghai Saimao Exhibition Co., Ltd
  • Telephone:021-61243975
  • Contact:Mr. Yang
  • Mobile:13585756185
  • E-mail:shskygq@163.com
  • Address:Building A, Kaixin Business, No. 1325 Hengnan Road, Shanghai

INTRODUCTION

2026 Shanghai International AI Computing Data Center Industry Expo (Autumn) - www.globalomp.com

2026 Shanghai International AI Computing Data Center Industry Expo (Autumn) - www.globalomp.com

2026 Shanghai International AI Computing Data Center Industry Expo (Autumn)

Advantage: 35000 square meters, nearly 500 data electronics industry customers participating on the same stage, directly targeting precise customers

Location: Shanghai New International Expo Center

Date: November 10-12, 2026

Exhibition Introduction

In order to promote the leapfrog development of the electronic information industry in East China and facilitate the innovative application of advanced technologies in the region, the 2026 Shanghai International AI Data Center Industry Expo will be held from November 18-20, 2026 at the Shanghai New International Expo Center. As one of the most important gathering places for intelligent computing centers in China, Shanghai's AI computing power data centers are experiencing explosive growth and structural reshaping. Shanghai is making every effort to build a globally leading intelligent computing hub. According to the plan, by 2027, the scale of Shanghai's intelligent computing cloud industry aims to exceed 200 billion yuan, and the scale of intelligent computing aims to reach 200 EFLOPS, of which the proportion of independently controllable computing power will exceed 70%. As of early 2026, the scale of intelligent computing in Shanghai has exceeded 120000 P, and the city level intelligent computing dispatch platform has managed nearly 20000 P of computing power. The application of computing power is accelerating to empower the "5+6" key industries. In 2026, we look forward to meeting you in Shanghai and working together to explore new opportunities in the AI computing industry!


Enormous Market Demand

With the acceleration of a new round of technological and industrial revolution, the electronics industry is constantly developing and integrating with new generation information technologies such as 5G, big data, and artificial intelligence, leading to the continuous expansion of downstream market demand. AI computing power data centers are becoming the core engine of the digital economy. By 2026, the market size of AIDC in China is expected to reach 177.8 billion yuan, and is expected to approach 400 billion yuan by 2030. The global market size of AI data centers is expected to reach $1.6 trillion by 2030. This growth is mainly driven by the digital transformation of large model manufacturers, cloud service providers, and traditional industries. With the commercialization of generative AI, the demand for intelligent computing power is growing exponentially, and by 2026, China's intelligent computing demand is expected to account for 71% of the new demand for data centers. The prospect of Shanghai AI computing power data center is extremely broad, and its essence is to seize the infrastructure sovereignty of the AI era. In the coming years, Shanghai will continue to moderately advance the construction of intelligent computing infrastructure, accelerate the large-scale deployment of Shanghai produced chips, and promote the computing power industry as a new engine for high-quality economic development in Shanghai by building an open and shared intelligent computing ecosystem.

Scope

★ AI computing power/algorithm: infrastructure server/storage, network equipment, optical communication/optical transmission, AI chip/DPU/CPU/GPU, storage chip, edge computing chip, edge computing, supercomputing center/intelligent computing center/edge data center, cloud services, Internet of Things, computing security, software applications;
★ Data center infrastructure: data center infrastructure solutions, edge data center solutions, micro module data centers, air conditioning, cooling, and fresh air systems, power supply and distribution systems, comprehensive cabling systems, computer room building and decoration materials, large screen display systems, fire protection systems, security systems;
★ Liquid cooled raw materials: including coolant, refrigerant, fluorinated liquid, silicone oil, mineral oil carbon dioxide/hydrogen, aqueous solution, etc;
★ Liquid cooling devices: cold plate liquid cooling products, metal cold plates, heating equipment and components, submerged liquid cooling products for liquid circulation equipment, heat dissipation devices, radiators, heat pipe fans, coolant, pumps, compressors, driving ring power components, temperature control components, thermostats/thermostats, temperature sensors, evaporators, condensers, expansion pots/coolant tanks, etc;
★ Pipelines and connectors: rubber hoses, metal pipes, corrugated pipes, insulation pipes, water pipes/joints, cooling pipelines and connecting components, etc;
★ Auxiliary cooling devices: cooling fans, cooling materials, enhanced heat sinks, ambient air exchange devices;
★ Core technologies and equipment for liquid cooling: including cold plate liquid cooling (including fully liquid cooled plate servers), immersion liquid cooling (single-phase/two-phase), and spray liquid cooling; Cold module decoupling design, ★ intelligent temperature control system, fluid distribution technology: key components such as coolant (fluorine liquid, mineral oil, etc.), cold plate, pump, valve, quick connector, heat exchanger: leakage detection equipment, intelligent sensors, phase change materials (PCM);


Costs & Precautions

Please contact the exhibition organizer before participating in the exhibition to confirm.

2026 Shanghai International AI Computing Data Center Industry Expo (Autumn) - www.globalomp.com

2026 Shanghai International AI Computing Data Center Industry Expo (Autumn) - www.globalomp.com

Contact

  • Company:Shanghai Saimao Exhibition Co., Ltd
  • Telephone:021-61243975
  • Contact:Mr. Yang
  • Mobile:13585756185
  • E-mail:shskygq@163.com
  • Address:Building A, Kaixin Business, No. 1325 Hengnan Road, Shanghai

Disclaimer

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870

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