Based in Hefei, known as the "IC Capital of China", we aim to build a core platform for the central chip industry

As one of the nine major integrated circuit industry gathering bases in China and the core pivot of integrated circuits in the Yangtze River Delta region, Hefei has been deeply cultivated for more than ten years to create a full chain industrial ecology of chip screen automotive integration and lifelong intelligence. The city has gathered over 450 integrated circuit enterprises, with a total industrial output value exceeding 150 billion yuan; Changxin Storage and Jinghe Integration, two leading wafer manufacturers, lead the storage and display driver tracks. They have the highest storage chip production capacity in China and a leading global scale of display driver chip outsourcing. They are fully equipped with benchmark enterprises in equipment, materials, and design such as Xinqi Microelectronics, Fulide, and Hengshuo Semiconductor. They have built a complete industrial cluster that integrates EDA, chip design, 12 inch wafer manufacturing, packaging testing, and equipment raw materials, which is rare in China.

Relying on the reserve of scientific research talents from the University of Science and Technology of China and the Chinese Academy of Sciences, abundant industrial hydropower resources, and regional industrial policy advantages, Hefei links with provincial industrial clusters such as Bengbu MEMS, Wuhu automotive grade compound semiconductors, and Tongling packaging materials, radiating to the Yangtze River Delta and connecting to the national terminal market, providing a unique industrial fertile ground, procurement demand, and cooperation opportunities for the 2027 Anhui Semiconductor Industry Exhibition.

11 major professional exhibition areas covering the entire semiconductor industry chain upstream and downstream

This exhibition will be fully expanded and upgraded, with specialized exhibition areas to achieve seamless coverage of industries, showcasing cutting-edge domestic substitution achievements and global cutting-edge technologies

IC chip design zone: AI chips, storage chips, automotive grade chips, power semiconductors, EDA tools, IP cores

Wafer Manufacturing Zone: 12/8-inch wafer production line, featured processes, mature process outsourcing solutions

Semiconductor Equipment Zone: Lithography, Etching, Thin Film Deposition, Detection and Measurement, Cleaning, Purification Equipment

Key raw and auxiliary materials zone: silicon wafers, photoresist, specialty gases, target materials, electronic chemicals, packaging substrates

Packaging Testing Zone: Advanced Packaging Chiplets, Testing Equipment, Packaging Consumables, Reliability Testing

Third generation semiconductor zone: SiC, GaN, gallium arsenide substrates, devices, module solutions

Power Semiconductor Zone: Special Power Devices for New Energy Vehicles and Photovoltaic Energy Storage

Chip Screen Automotive Application Zone: New Display, Vehicle Electronics, Intelligent Home Appliance Terminal Chip Solutions

AI Computing and Storage Integration Zone: Data Center, Large Computing Chips, Storage Modules

Precision matching and automation zone: cleanroom, vacuum, precision transmission, testing instruments

Industrial Service Zone: Investment and Financing Institutions, Industrial Parks, Industry Associations, Intellectual Property, Testing and Certification

Full name: The 2nd China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition (CICE2027 · Wanxin Exhibition) Time: May 18-20, 2027 Location: Hefei Binhu International Convention and Exhibition Center Core theme: Winning the Chip Era, Creating a Chip Future Scale: The total exhibition area is 30000 square meters, gathering more than 600 leading semiconductor enterprises at home and abroad, inviting more than 30000 global professional visitors to attend the exhibition and negotiate cooperation Contact Liu Jiao 13257086620

• Address:3899 Jinxiu Avenue, Baohe District, Hefei City

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