Currently, General Artificial Intelligence (AGI) is transitioning from technological exploration to large-scale applications, breaking through the limitations of a single scenario and reconstructing industrial production models and value chains; AI computing power, as the core infrastructure supporting technological breakthroughs and scenario implementation, has become a key indicator for measuring the core competitiveness of the digital economy with the continuous iteration of chips, algorithms, and architectures. A comprehensive transformation covering technology, industry, and ecology is sweeping across the globe.
Under this industry trend, Shanghai has become a source of innovation for China's AI industry, a gathering ground for computing infrastructure, and a hub for global industrial resources, thanks to its unique location advantages, perfect innovation ecology, and heavy policy support. This place gathers top enterprises such as Huawei, Alibaba, Baidu, and SenseTime, as well as core industry carriers such as Zhangjiang Science City and Lingang New Area. It has also introduced a series of policy dividends, including a 4-year 1 billion computing power support and a maximum 5 million entrepreneurship subsidy, injecting strong momentum into the high-quality development of the industry.
The 2026 Shanghai International AI Computing and Chip Technology Expo was born in response to the trend, with the core concept of "focusing on the entire industry chain, linking core scenarios, and empowering ecological collaboration". It links the Yingfo International Automotive Innovation Week and the Shanghai Tailored Robot Conference to build a high-end platform for technology display, supply and demand docking, and industry university research collaboration. Here, leading companies in the industrial chain will gather at the Shanghai New International Expo Center to showcase innovative achievements in the entire chain, from chip design, manufacturing and packaging to computing infrastructure and industry solutions; Professional audiences and procurement decision-makers will precisely connect to explore breakthrough paths in core areas such as automotive grade chips, robot specific computing power, and green computing power.
We firmly believe that this industry event, which brings together technology, capital, talent, and scenarios, will eventually break down technological barriers, activate industry potential, help enterprises seize the core track of intelligent terminal computing power, and jointly write a new chapter in empowering thousands of industries with AI computing power and chip industry. We cordially invite global industry chain partners to attend this grand event, with chips as the foundation and computing as the wings, to join hands and win new opportunities in the trillion dollar market!
Four highlights of exhibitions - Building industry flagship exhibitions with strong capabilities
industry hotspot
Computing power and chips have become the core engine for intelligent upgrading. Artificial intelligence technology is accelerating its penetration into various industries, and intelligent cars and embodied robots, as the core carriers of AI landing, are experiencing explosive growth in demand for high computing power, low power consumption, and high reliability chips. The large-scale implementation of embodied intelligence faces core challenges such as computing power bottlenecks and data scarcity, while the upgrading of autonomous driving and intelligent cockpit in intelligent vehicles also puts higher demands on automotive grade chips, and there is an urgent need for industry supply and demand matching.
join forces between giants
Multiple exhibitions will be held simultaneously to connect the upstream and downstream of the industry chain. In 2026, the exhibition will collaborate with relevant industry organizations to host the embodied intelligent robot industry conference, automotive innovation technology week, Shanghai artificial intelligence exhibition, flying car eVTOL exhibition, and Shanghai intelligent automotive technology exhibition, which will be held simultaneously and locally. Multi exhibition linkage, creating an industry event that runs through the upstream and downstream of the AI and chip industry chain.
Exhibition value
Core advantages assist enterprises in breaking through barriers and creating cutting-edge technology release platforms, encouraging them to showcase innovative products and design solutions that have not yet been mass-produced, and becoming a "barometer" for leading industry technology trends. Bringing together enterprises in the entire industry chain of chip design, manufacturing, packaging and testing, computing power services, and terminal applications, building a collaborative innovation platform for industry university research and application, helping enterprises build stable supply chains, and seize the high ground of industrial ecology.
Simultaneous empowerment
Multi exhibition linkage achieves precise traffic aggregation, exhibition traffic interconnection, and ecological complementarity. The concurrent exhibition will gather core buyers such as global automotive OEMs, autonomous driving solution providers, robot research and development enterprises, intelligent hardware manufacturers, as well as top experts in the field of industry university research, to build a precise "point-to-point" docking scenario for AI computing power and chip enterprises, efficiently link downstream application markets, break down barriers between technology and applications, and accelerate product commercialization.
Core advantages of the exhibition
Efficient audience organization, assisting in precise supply-demand matching
1. Global resource assistance: Sharing global resources from major AI and chip producing countries such as Germany, the United States, Japan, South Korea, the United Kingdom, France, Italy, etc
2. Large database: Over 1000000 global professional buyer databases from 72 countries and regions
3. Professional buyer group building: 220+professional buyer groups, 6 themed tour routes, accurately attracting high-quality audiences with clear business needs and purchasing intentions
4. Multi party linkage invitation: Join hands with more than 60 industry associations and cooperative units, and jointly organize professional audiences with domestic and foreign associations/industry institutions/user enterprises
5. Precise docking service: Deeply explore the purchasing needs of pre registered buyers and audiences before the exhibition. In 2026, we will continue to create procurement and supply docking events, with over 50 VIP buyer business docking events held on-site. We will also set up a "VIP buyer negotiation area" to invite buyers and purchasing decision-makers with clear purchasing intentions to book 1v1 business negotiation meetings with exhibitors
Omnichannel promotion empowerment, massive exposure to enhance attention
1. Overall exposure: 8.57 million cumulative online exposure, surrounded by advantages on new media/short video platforms, and presented with overlapping promotional effects
2. New media matrix: Baidu, Circle of Friends, video number, Tiktok, Toutiao, Toutiao today, and Souyi; 60000 WeChat official account fans, build our media power, and transmit exhibition information in high frequency and multi-dimensional
3. Precise invitations: 80000 direct phone calls, 1 million text message invitations; 40 EDM emails sent to 300000 global users, efficient private domain promotion
4. Media cooperation: 80 cooperative media, gathering news/industry/mass media, industry vertical media, and fusing to create a huge dissemination volume
Why participate in the exhibition?
1. An unmissable industry event: The exhibition gathers outstanding domestic and foreign industry enterprises to showcase the complete industry chain - from complete machines to component suppliers, covering the entire upstream, midstream, and downstream industry chain. Focus on all important target audiences and provide a good communication opportunity and business environment for both parties.
2. Professional and powerful audience: covering the core industry end (upstream and downstream enterprise decision-making/procurement/technical positions in the industry chain), computing power demand end (computing power procurement/landing core subjects), scientific research/institution/capital end (professional resources+cooperation/investment needs), and supporting service end (industry collaboration/landing support).
3. High quality concurrent activities: Academic conferences and forums present the latest international research achievements and technologies, achieving the linkage and integration of industry, academia, and research.
4. Powerful integrated marketing platform and services: providing exhibitors with comprehensive integrated marketing before, during, and after the exhibition, realizing value-added benefits for exhibitors and buyers.
5. Accurately address customer pain points: Through pre exhibition mining, on-site exclusive docking areas, 1v1 negotiations, and other forms, achieve precise supply-demand docking, help buyers efficiently negotiate with high-quality suppliers at home and abroad, and facilitate potential orders and cooperation.

AI chips and core components
GPU、NPU、TPU、ASIC、FPGA、 Car AI chip, edge computing chip, memory computing integrated chip, computing acceleration chip, chip design, IP core, EDA tools, semiconductor equipment and materials
Robot (brain layer)
Embodied intelligent large model, robot operating system (ROS/ROS2), motion control algorithm, path planning SLAM、 Autonomous navigation, multi machine collaborative simulation platform, digital twin MLOps、 Model training/fine-tuning/deployment tools, integrated solution of large model+robot, AIAgent robot
AI servers and intelligent hardware
AI server, GPU server, high-density server, machine cabinet server, edge computing node, industrial control host, server motherboard, CPU, HBM memory, SSD storage, industrial motherboard, embedded computing platform
Intelligent Computing Center and IDC Data Center
Intelligent computing center, supercomputing center, cloud computing platform, DC data center construction and solutions, computing power leasing, computing power scheduling, computing power network, operator computing power services, third-party data centers
Power supply and computer room infrastructure
UPS、 High voltage DC power supply, modular power supply, battery, energy storage system, power supply and distribution system, intelligent cabinet, micro module, cold aisle, wiring system, computer room monitoring, fire protection, lightning protection, environmental monitoring
High speed interconnection and optical communication
Optical modules, optical components, fiber optic cables, switches, routers, data communication equipment, high-speed cables, high-speed connectors, PCle/CXL technology, network security, data security products
Robot Control and Computing
Robot controller, motion control card PLC、 Edge computing unit, AI chip (NPU/GPU/ASIC), computing module, embedded system, battery/power management, communication module (5G/4G/Wi Fi/Bluetooth)
AI+industry integration application
AI+intelligent manufacturing, industrial Internet, digital factory, AI+automatic driving, vehicle road collaboration, AI+finance, AI+medical, AI+smart city, AI+robot, machine vision, intelligent detection
Liquid cooling and temperature control heat dissipation technology
Temperature control equipment, heat dissipation materials, fans/radiators

Please contact the exhibition organizer before participating in the exhibition to confirm.

• Telephone:021-5680 1551
• Contact:Zhang Jianwen
• E-mail:lingjie_expo@sina.com
• Address:801, Building 3, Baoshan District, Shanghai (Shanghai Building Science and Technology Industrial Park)

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