With the continuous increase in demand for generative artificial intelligence, computing infrastructure, and high-performance computing, the global electronics industry is ushering in a new cycle of structural growth led by AI. According to the prediction of Zhongyan Puhua, the global PCB market size is expected to reach 96.8 billion US dollars by 2025, with an average annual compound growth rate of about 5.8%, and a significant increase in growth momentum.

At the technical level, high-end PCBs such as high-density interconnect (HDI), IC carrier boards, advanced packaging substrates, class carrier boards (SLP), and high-speed high-frequency materials are becoming the core requirements for AI application scenarios. At the same time, AI is deeply empowering the manufacturing process - intelligent quality inspection, predictive maintenance, and intelligent scheduling technologies are significantly improving production efficiency and yield.

Under this dual driving force, AI not only brings quantitative growth to the PCB industry, but also drives it to leap towards high added value and high-tech content. The 2026 International Electronic Circuit (Shenzhen) Exhibition (HKCAShow) will deeply focus on this trend, with the theme of "AI driven technology" to help industry-leading enterprises capture strategic opportunities driven by AI.

Application of PCB products
Automotive communication products
Computers and computer related products
consumer electronics
Military/Aviation
Industrial/Medical/Application Software
Other circuit boards
Connector PCB
High density interconnect printed circuit board
IC packaging carrier board (BGA/CSP/flip chip, etc.)
Rigid single-sided circuit board
Rigid double-sided and multi sided circuit boards
rigid-flex board
Flexible printed circuit board
Other circuit boards/intelligent automation equipment

Circuit board CAD/CAM system
Preparation process before production
Internal and external imaging and circuit design processes
laminating process
Numerical Control Mechanical Drilling Process
CNC high-density laser drilling process
Electrolytic/chemical plating process
Automated operation/robot system
shape processing
AOI/AVI/Circuit Board Related Inspection Processes
Surface treatment/post-treatment process
Anti welding printing process
Electrical testing program
Reliability Engineering Testing Program
Environmental Protection Engineering and Procedures
packaging process
other
Environmental protection and clean technology and equipment

Environmentally friendly and clean production technology and equipment
Water treatment/recycling technology and equipment
Clean room technology and equipment
Waste recycling system
Cleaning system/equipment
Smoke control/emission system
Raw materials/chemicals for circuit boards

Thin film circuit design and related chemicals
Resin system/laminated board
Fiberglass cloth/clothing/carbon fiber
copper foil
CNC mechanical drill bit
Dry film/photo liquid corrosion inhibitor and other related chemical products
Chemical substances used for electroplating and electrolysis, such as copper/tin/gold plating
Chemical substances for surface treatment
Screen printing and photosensitive solder mask film
ink
Copper or other anodes
other
Electronic assembly process

Design, consulting, and testing services
Contract manufacturing services
REACH/RoHS Compliance Services
CAD/CAE/CAM system
Components, connectors, and fasteners
Template printing equipment
Component preparation and placement equipment
assembly equipment
Point coating equipment
reflow soldering equipment
cleaning equipment
Hand welding process and related chemicals and equipment
Welding related chemicals and equipment
Wire bonding equipment
Testing, measuring, and inspection equipment
Rework/repair equipment
Drilling, gong board and processing equipment
other
Smart Manufacturing

AI industrial big model
AI software/technology application
Robots (industrial/embodied/humanoid/collaborative robots)
PCB Smart Production Solution
Intelligent logistics warehousing system/solution
Industrial Internet of Things Technology
Production management software (ERP/MES/CRM/SCM/QMS/WMS, etc.)
Intelligent core devices (sensors, servo motors, drivers, reducers, intelligent measuring instruments, industrial control systems, etc.)
Other intelligent processing equipment
Sealing and testing technology

IC packaging technology
IC testing technology
Semiconductor Packaging Technology
Semiconductor testing technology
Advanced packaging technology
Precision accessories and components

controller
connector
switch
laser
optical lens
Pump valve fittings
Mechanical Parts
other

Please contact the exhibition organizer before participating in the exhibition to confirm.

• Telephone:0755-86240033
• Fax:0755-86240022
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen
• Zipcode:510055

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