- Industry: Communications / Electronics
- Time: 2026/08/26 - 08/28 (Wed To Fri Total 3 Days) Error Correction
- Address: Guangdong Shenzhen International Convention and Exhibition Center (New Building) ChinaGuangdong ProvinceShenzhenBao'an District No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen
- Sponsor:Shanghai Shunqi Exhibition Service Co., Ltd
- Organizer:Shanghai Shunqi Exhibition Service Co., Ltd
- Telephone:159 2171 7039
- Contact:Li Jun
- Mobile:159 2171 7039
- Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen
INTRODUCTION
2026 Shenzhen Data Center Liquid Cooling Exhibition and 2026 Shenzhen AI Computing Industry Exhibition
2026 Shenzhen International Data Center Liquid Cooling Technology Exhibition
2026 Shenzhen International AI Computing Industry Conference and Exhibition
Date: August 26-28, 2026 Location: Shenzhen International Convention and Exhibition Center
Regarding the exhibition:
With the rapid development of the digital economy, computing power has become the core engine driving economic growth and social progress. The rapid development of new technologies such as big data, artificial intelligence, cloud computing, smart cars, drones, data centers, power, electronics, aviation, aerospace vehicles, airplanes, medical, communication, batteries, new energy, high-performance computing, lithium battery equipment, energy storage, photovoltaic equipment, semiconductor equipment, automation, hydrogen energy, etc. has driven the sustained and rapid growth of demand for the AI computing industry, adding new impetus to the global AI computing industry. As the center of the global electronics manufacturing industry and a major consumer electronics market, China's AI computing power industry has also grown rapidly in recent years, and China has become a globally active AI computing power industry market. In addition, with the strong support of the Chinese government for the AI computing industry, the development of China's AI computing industry is accelerating.
The wave of artificial intelligence is sweeping the world, and computing power has become the core engine driving the digital economy! In order to seize the strategic opportunity of the explosion of AI big models and the upgrading of the intelligent computing industry, the "2026 Shenzhen International Data Center Liquid Cooling Technology Exhibition and 2026 Shenzhen International AI Computing Industry Conference and Exhibition" will be grandly held from August 26-28, 2026 at the Shenzhen International Convention and Exhibition Center (Bao'an New Hall). This exhibition relies on the advantages of Chengdu to create a top-level platform for showcasing, exchanging, cooperating, and purchasing the entire global AI computing power industry chain. We sincerely invite you to join us, explore new trends in computing power, and explore new blue oceans in the industry. The core direction of this expo is "high computing power, large models, new ecology, and deep applications", which fully conforms to the industrial trend of exponential growth in AI computing power demand, large-scale construction of intelligent computing centers, and green and low-carbon development. The total exhibition area planned for the exhibition is 40000 square meters, and it is expected to gather over 800 of the world's top computing companies to participate, attracting 30000 professional visitors. The exhibition covers the entire industry chain of AI computing power, from underlying hardware and core technologies to upper level applications and supporting services, focusing on hot areas such as intelligent computing chips, AI servers, intelligent computing centers, liquid cooling and heat dissipation, large model training, computing power networks, and industry solutions. By showcasing cutting-edge technologies, conducting high-end forum discussions, accurately matching supply and demand, and promoting new product launches, we aim to establish a collaborative ecosystem of government enterprise research, production, supply, and marketing to help enterprises seize opportunities in the trillion level computing power market and promote the transformation of AI computing technology achievements and industrial landing.
Organizational structure:
Organizational unit:
Shanghai Shunqi Exhibition Service Co., Ltd
Venue: Shenzhen International Convention and Exhibition Center
Date: August 26-28, 2026
Exhibition advantages:
The exhibition is held in Shenzhen, a globally important manufacturing base in the Guangdong Hong Kong Macao Greater Bay Area. As the central city of the Guangdong Hong Kong Macao Greater Bay Area, Shenzhen has unique geographical advantages and a strong manufacturing foundation. It is also one of the most important convention and exhibition center cities in China, with a total annual exhibition area and rental rate ranking among the top in the country. It has become an international innovative city full of charm, power, vitality, and innovation.
★ Brand Advantage - Professional platforms and giants gather for professional exhibitions in the South China region. The exhibition will fully utilize the strong resources accumulated in the global network, fully organize industry leading enterprises to participate, and actively obtain widespread support from all sectors of society.
★ First class Exhibition Halls and First class Services - The Shenzhen World Exhibition&Convention Center, a new world-class super large exhibition complex, is a major project invested and constructed by the Shenzhen Municipal Government. It is a super large exhibition complex that integrates exhibitions, conferences, events (competitions, performances, etc.), catering, and services.
★ Professional audience and high-quality buyers - carefully organized massive invitations. This exhibition has set up an audience organization department and gradually improved the professional audience database, providing negotiation and docking services for 30000 visitors from more than 80 countries and regions around the world, attracting more professional visitors to come and purchase.
★ Comprehensive and three-dimensional publicity and promotion - help exhibitors to realize the value of participation in the exhibition. Before the exhibition, hundreds of online and offline media, such as Baidu, 360, Tiktok, WeChat friends circle, etc., carried out large-scale early publicity and promotion of the exhibition. During the exhibition, various major portal websites, radio stations, and television stations carried out detailed on-site special reports on the exhibition, focusing on comprehensive and multi-dimensional publicity and coverage of the exhibition's hot enterprises, to maximize the exposure of the exhibitors' brands, and to help exhibitors obtain more and broader cooperation opportunities.
Audience invitation:
Industry professionals in big data, artificial intelligence, consumer electronics, digital, cloud computing, smart cars, drones, data centers, power, electronics, appliances, aviation, aerospace, automotive, aircraft, medical, communication, communication equipment, batteries, new energy, high-performance computing, computers, lithium battery equipment, energy storage, photovoltaic equipment, semiconductor equipment, automation, frequency converters, hydrogen energy, and other related fields.
◆ Responsible departments: Ministry of Industry and Information Technology of China, departments of industry and information technology of various provinces, and bureaus of industry and information technology of various cities (autonomous regions, municipalities directly under the central government), counties (county-level cities), etc
The relevant person in charge of the liquid cooling department in the data center.
◆ Park: Demonstration Zone, Industrial Park, Science and Technology Park, Entrepreneurship Park, etc.
Research institutions and associations: research institutes, industry associations, societies, alliances, etc.
◆ Channel partners: technology and equipment research and development production enterprises, distributors, agents, service providers, traders, etc.
Industrial chain enterprises: financial companies, investment companies, technology development companies, e-commerce platforms and other industry related enterprises involved in the field of AI computing power data center liquid cooling.
Industry personnel involved: AI computing power data center liquid cooling related industry experts, scholars, staff, university students, and individuals interested in the industry.
◆ Computing power networks, intelligent computing clusters, telecommunications, mobile, China Unicom, green energy conservation, liquid cooling applications, power supply and distribution, modules, etc.
Exhibition scope:
◆ AI computing power core hardware
AI chips: GPU, ASlC, FPGA, NPU, DPU, CPU and other intelligent computing chips, training chips, inference chips;
AI servers: high-density Al servers, GPU servers, liquid cooled servers, intelligent computing clusters, supercomputing servers;
Storage devices: high-speed distributed storage, NVMe storage, Al dedicated storage, data backup and disaster recovery system;
Network equipment: 800G/1.6T optical modules, high-speed switches, routers SDN/NFV、 Computing power network equipment;
Intelligent computing center and infrastructure
Integrated solution for intelligent computing center, modular intelligent computing center, edge intelligent computing nodes, supercomputing center;
Liquid cooling system (cold plate, immersion, spray), indirect evaporative cooling, high-efficiency air conditioning, intelligent heat dissipation solution, precision power distribution UPS、 Energy storage system, photovoltaic, microgrid, intelligent busbar, fire and security system;
Large scale models and computational software
General large model, industry large model, multimodal model, model training and fine-tuning platform;
Computing power management platform, DClM system, intelligent operation and maintenance, AI assisted operation and maintenance, computing power scheduling and optimization software operating system, database, AI development framework, algorithm model, virtualization and cloud computing software;
◆ Computing Power Network and Security
Computing network integration, edge computing, 5G/6G computing network, high-speed data transmission, cloud network edge collaboration;
Data security, network security, computing power security, privacy computing, encryption and protection, disaster recovery and business continuity;
Industry computing power application solutions
Intelligent manufacturing, smart healthcare, fintech, autonomous driving, smart cities, digital government computing solutions AlGC, content generation, intelligent vision, natural language processing, embodied intelligence, robot computing power support;
◆ Supporting services and ecology
Intelligent computing center EPC, planning and design, testing and evaluation, operation and maintenance hosting, technical consulting;
Computing power leasing, cloud computing services, public/private/hybrid clouds, computing power trading platforms;
Research institutes, industry associations, investment institutions, industrial parks, talent cultivation and certification;
◆ Liquid cooled raw materials:
Including coolant, refrigerant, fluorinated liquid, silicone oil, mineral oil carbon dioxide/hydrogen, aqueous solution, etc;
Liquid cooling devices: cold plate liquid cooling products, metal cold plates, heating equipment and components, liquid circulation equipment submerged liquid cooling products, heat dissipation devices, radiators, heat pipe fans, coolant, pumps, compressors, driving ring power components, temperature control components, thermostats/thermostats, temperature sensors, evaporators, condensers, expansion pots/coolant tanks, etc;
Pipeline and connecting components: rubber hose, metal pipe, corrugated pipe, insulation pipe, water pipe/joint, cooling pipeline and connecting components, etc;
◆ Auxiliary cooling devices: cooling fans, cooling materials, enhanced heat sinks, ambient air exchange devices;
Core technologies and equipment for liquid cooling: including cold plate liquid cooling (including fully liquid cooled plate servers), immersion liquid cooling (single-phase/two-phase), and spray liquid cooling; Cold module decoupling design, intelligent temperature control system, fluid distribution technology: key components such as coolant (fluorinated liquid, mineral oil, etc.), cold plate, pump, valve, quick connector, heat exchanger: leakage detection equipment, intelligent sensors, phase change materials (PCM);
Exhibition Tips:
1. Exhibitors determine the area and select the booth;
2. Fill in the exhibition application receipt (contract) and sign and stamp it, then fax the form to the organizing committee;
3. After selecting the booth, the enterprise must transfer 50% or the full amount of the exhibition fee to the designated account within 3 working days, otherwise the selected booth will not be retained;
4. The organizing committee will send the exhibitor handbook to the participating units one month before the exhibition;
5. The conference catalogue will publish free company profiles (within 200 words) for participating companies
Exhibition registration:
For matters related to exhibitions, advertising, and seminars, please inquire:
2026 Shenzhen International Data Center Liquid Cooling Technology and AI Computing Industry Conference and Exhibition:
Contact: Li Jun 159 2171 7039 (same as WeChat)
Scope


Costs & Precautions
Contact
- Telephone:159 2171 7039
- Contact:Li Jun
- Mobile:159 2171 7039
- Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen
Disclaimer
The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870



