ES-SHOW 2026 Shenzhen International Semiconductor Technology and Application Exhibition

Date: October 27-29, 2026

Location: Shenzhen International Convention and Exhibition Center

Host: Shenzhen Electronic Chamber of Commerce, Reed Exhibitions Group

Organizer: Shanghai Ruimeng Exhibition Service Co., Ltd

Exhibition Introduction

The semiconductor sales in the Chinese market account for one-third of the world's total, the largest share, equivalent to the sum of the United States, the European Union, and Japan. However, this is mainly because China is the center of global manufacturing, especially in the production of computers and mobile phones, which consume the most chips. With the rapid development of artificial intelligence and the promotion of strategic emerging industries such as 5G, Internet of Things, energy conservation and environmental protection, and new energy vehicles, the demand for semiconductors continues to increase. The global semiconductor equipment sales are expected to reach 138.1 billion US dollars in 2025, and are expected to continue to grow in 2026. The demand scale of the Chinese semiconductor market will further expand. In order to better promote communication and interaction in the semiconductor industry and enhance its internationalization level, the "ES-SHOW2026 Shenzhen International Semiconductor Technology and Application Exhibition" will be held on October 27-29, 2026 at the Shenzhen International Convention and Exhibition Center. The 2026 Shenzhen Semiconductor Exhibition is divided into three major sections: exhibitions, summit forums, and academic conferences. It is an annual event for the semiconductor industry and a comprehensive professional exhibition platform for communication and cooperation between the semiconductor industry and related industries.

The 2026 Shenzhen International Semiconductor Technology and Application Exhibition will showcase the latest products and technologies in the semiconductor industry and applications, establish brand image for enterprises, promote trade cooperation and market development, lead industry trends, strengthen production, research and development, and sales interaction, deeply understand the new development trends of the semiconductor market in the future, explore new demands of the semiconductor market with a development perspective, innovate the connotation of the exhibition, organize professional visitors from all aspects and levels, and provide the best platform for technical exchange, product display, and trade negotiations for participating enterprises and merchants.

We look forward to bringing breakthroughs to the overall industry chain through such exhibitions, conferences, and industry linkage. Invite product suppliers to participate in the exhibition Equipment providers, product manufacturers, end consumer manufacturers, venture capitalists, and consulting firms work together to use the Shenzhen International Semiconductor Industry Exhibition as an effective platform for technical communication and industrial transformation exchange, engaging in exciting interactions.

We sincerely invite you to promote the grand event, share business opportunities, and work together for the future. I hope you can arrange a time to attend at that time. Welcome to participate in this exhibition.

new opportunities

To build an international platform that integrates product display, trade negotiations, technology exchange, and investment cooperation for more semiconductor companies. Under the guidance of the higher-level supervisory department, the organizing committee of China Electronics Show and relevant supervisory units will hold the "2026 Shenzhen International Semiconductor Technology and Application Exhibition" at the Shenzhen International Convention and Exhibition Center from October 27th to 29th, 2026. The exhibition will focus on the theme of "Connecting the Chip Ecology, Creating New Opportunities for Intelligent Manufacturing", with a total planned exhibition area of 80000 square meters, covering integrated circuit design IP、EDA、 Manufacturing, packaging testing, equipment manufacturing, semiconductor materials, design services, chip applications and other products and technologies. This exhibition will gather cutting-edge technologies and products from the global semiconductor and integrated circuit industry, showcasing the innovative power of the semiconductor and integrated circuit industry from chip design to integrated circuit solutions in all aspects. By combining exhibitions and forums, we aim to showcase China's innovative strength and development achievements in the semiconductor and integrated circuit industry, especially in the Guangdong Hong Kong Macao Greater Bay Area, from different perspectives. We will share cutting-edge trends in the industry, gather innovative talents, promote technological exchanges and cooperation, and advance the construction of an industrial ecosystem. This will further promote the deep integration of the semiconductor and integrated circuit supply chains, and contribute to the high-quality development of China's semiconductor industry,

We look forward to gathering with friends from both domestic and foreign industries at the ES-SHOW 2026 Shenzhen International Semiconductor Technology and Application Exhibition!

Major categories of exhibits

IC Design/Chips and Applications: IC and related electronic product design, EDA, Al computing chips, storage chips, automotive chips, smart home appliance chips, artificial intelligence chips, IoT, artificial intelligence, automotive electronics, smart cities, intelligent terminals, health and medical products, etc;

IC manufacturing: semiconductor wafer manufacturing, semiconductor packaging and testing technology and products;

Advanced packaging: design, materials, testing, equipment, etc. for flip chip, bump, wafer level packaging, 2.5D/3D advanced packaging (TSV and TGV), fanout wafer level packaging, etc;

Wafer equipment/packaging and testing equipment: various precision equipment and semiconductor packaging equipment, semiconductor testing equipment, IC testing instruments, advanced packaging technology (such as SiP, 3D packaging) equipment, power device equipment, etc. required in the wafer processing process;

Compound semiconductors and power devices: Compound semiconductor materials (such as GaN, SiC, etc.) and related products, including power devices, RF devices, upstream equipment, materials, etc;

Semiconductor materials: monocrystalline silicon, silicon wafers and silicon-based materials, polishing pads, masks, sputtering targets, polishing solutions, etching solutions, ceramic packaging materials, bonding wires, lead frames, packaging substrates, photoresists, thin film deposition materials, specialty gases, ultrapure water, plastic packaging materials, high-performance plastics, etc;

Semiconductor core components: machine vision, sensors, sealing rings, precision bearings, metal components, valve valves, silicon/SiC parts Robots、 Quartz components, filters, RF power supplies, ceramic components, ESC electrostatic suction cups, pressure gauges, pumps, MFC flow meters, stepper motors, motion control, servo motors, linear modules, dust-free drag chains, packaging molds, refrigeration equipment, induction heaters, etc;

AI computing power: AI chips, servers, switches, power supplies, liquid cooled temperature control, etc;

Supporting facilities and services: support products/cleanrooms, general business services/consulting, sales and services, standards and others.

Exhibition Area Setting

1. IC Design/Chips and Applications

2. IC manufacturing

3. Wafer equipment

4. Sealing and testing equipment

5. Core components and materials

6. Compound semiconductors and power devices

7. AI computing power

8. Supporting facilities and services

9. Local exhibition groups and regional clusters in various provinces and cities

Focusing on the latest breakthroughs in "high-end chips" and "domestic substitution", we aim to create the most cutting-edge technology display platform in the industry,

exhibition fee

★ Standard booth:

A: Domestic enterprises: Standard booth 18800/exhibition period (RMB) 3m × 3m (10% additional fee for double opening)

B: Foreign companies: Standard booth 5000/exhibition period (USD) 3m x 3m (double opening with an additional 10% fee)

The booth includes: three white wall panels, Chinese (English) lintel production, one consultation table, two folding chairs, carpet and lake floor, booth lighting, one 220V/5A power socket, and one waste paper basket. )

★ Indoor lighting:

A: Domestic enterprises: 1950 RMB per square meter

B: Foreign companies: 500 (USD) per square meter

Note: (Minimum rental area of 36 square meters) "bare space" only provides exhibition area and does not include display racks, exhibition equipment, carpets, power supplies, etc.

Business Cooperation

Shanghai Ruimeng Exhibition Service Co., Ltd

Contact: Chen Hua 17612137926 (same as V)

Fax: 021-60774835

• Company:Hong Kong Trade Development Exhibition Group Co., Ltd. Shenzhen Trade Development Exhibition Services Co., Ltd. Shanghai Trade Development Exhibition Services Co., Ltd
• Telephone:17612137926
• Contact:Chen Hua
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

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