2026 Shanghai International Digital Infrastructure Equipment and Supporting Industry Exhibition

Shanghai New International Expo Center, December 9-11, 2026

At present, the digital economy has become the core engine driving high-quality development of the global economy. China's "Digital China" strategy continues to deepen, and digital infrastructure, as the core base for carrying computing power, data, and communication, is facing unprecedented development opportunities. With the comprehensive outbreak of artificial intelligence big models, cloud computing, big data, and the Internet of Things industry, the construction scale of computing power carriers such as intelligent computing centers, supercomputing centers, and data centers continues to climb. High density computing power scenarios have put forward higher requirements for industrial supporting facilities, and have also driven the upstream and downstream industrial chains to achieve leapfrog growth.

As the core support of digital infrastructure, the semiconductor industry is accelerating the process of chip localization. From chip design, manufacturing to packaging and testing, the demand for the entire industry chain continues to expand, providing key hardware guarantees for digital infrastructure; Data centers and intelligent computing centers are transforming towards high efficiency and green development. Liquid cooling technology, with its advantages of high heat dissipation efficiency and low energy consumption, has become the mainstream development direction in the industry. Thermal management materials and technologies run through the entire scenario of semiconductor chip heat dissipation, data center temperature control, and computing power equipment cooling, solving the core pain points of high-density computing power operation. The four major fields are deeply integrated and synergistically developed, jointly building a complete ecosystem of digital infrastructure.

The 2026 Shanghai International Digital Infrastructure Equipment and Supporting Industry Exhibition will be held in response to the times, deeply integrating into and belonging to the entire industry chain system of the thermal management materials expo, data center liquid cooling exhibition, precision ceramics and power semiconductor exhibition, and semiconductor materials exhibition held at the same time and in the same venue. It will be highly coordinated with core application areas, customer communication, and resource sharing, forming an integrated professional exhibition platform of "materials devices systems supporting terminal applications". At the same time, the 2026 Shenzhen International Digital Infrastructure Equipment and Supporting Industry Exhibition will be held from November 26th to 28th at the Shenzhen International Convention and Exhibition Center (Bao'an New Hall), officially included in the Shenzhen High tech Fair system.

This exhibition is based in Shanghai, an international industrial highland, with a precise focus on the entire digital infrastructure industry chain. It deeply integrates equipment manufacturing, supporting services, core technologies, and upstream and downstream resources, organically integrating core sectors such as semiconductors, data centers, liquid cooling, and thermal management, and creating a highly professional and authoritative exchange and trading platform in China. The exhibition closely follows industry development trends, faces industry pain points, gathers high-quality enterprises and cutting-edge technologies from around the world, helps enterprises break down supply and demand barriers, promotes technological innovation, achievement transformation and industrial upgrading, and injects strong impetus into the high-quality development of the digital infrastructure industry.

Exhibition Scope

1、 Core digital intelligent computing device equipment and supporting facilities

-Computing chips, power devices, storage and electronic components

-Specialized equipment for device manufacturing, packaging, testing, cleaning, and inspection

-Packaging materials, process consumables, heat dissipation devices, testing instruments

-Tooling, molds, and industrial chain supporting accessories

2、 Digital data center and intelligent computing equipment

-Server, storage, network communication, cloud computing hardware

-Integrated solution and engineering construction for intelligent computing center and computing power room

-Cabinet, chassis, integrated equipment room

-Computer room operation and maintenance, data security, intelligent control system

-Computer room decoration, anti-static, dust-proof, shielding and other supporting equipment

3、 Temperature controlled heat dissipation and efficient fluid cooling

-Immersion type, cold plate liquid cooling unit, cooling cabinet CDU

-Cooling medium, pipeline, pump valve, joint, seal

-Thermal conductive gel, phase change materials, carbon/ceramic based heat dissipation materials

-Heat pipes, heat sharing plates, fins, heat exchange modules, precision temperature control equipment

-Intelligent temperature control, energy-saving heat dissipation, waste heat recovery system

4、 Digital infrastructure power supply and distribution and supporting equipment

-High and low voltage distribution cabinets, precision distribution, intelligent busbars, distribution boxes

- UPS、 Energy storage battery, generator set, emergency power supply system

-Dynamic environmental monitoring, security access control, environmental monitoring equipment

-Integrated cabling, fiber optic cables, connecting devices, and supporting accessories

-Firefighting, anti-static flooring, insulation and noise reduction, dust purification equipment

5、 Supporting services and technology

-Engineering general contracting, system integration, third-party operation and maintenance hosting

-Testing and certification, planning consulting, investment and financing, technology incubation

-Temperature control simulation, computer room management, energy consumption monitoring software

-Display and transformation of new technologies, new processes, and research and development achievements

-Industry associations, research institutes, professional media, and communication platforms

exhibition fee

Kind reminder: Please contact the sales manager of the organizing unit for specific marketing opportunities, sponsorship plans, and booth fee standards

A. Standard booth size of 9 square meters (3M * 3M) with configuration:

1. Signboard with company name, 2. Two spotlights, 3. Carpet covering the booth, 4. One 220V power outlet, 5. One consultation table

6. Two chairs, 7, and 1 garbage bin

B. Indoor open space:

The minimum rent for indoor open space is 36 square meters, and the organizer only provides empty space. Exhibitors are responsible for decoration and construction, and all expenses involved are borne by the exhibitors themselves.

Exhibition Contact

Mobile/WeChat: 159 2108 9962 (add WeChat remarks for basic exhibition)

Shanghai Organizing Committee Phone: 021-6047 2525

• Telephone:159 2108 9962
• Contact:Chairman's Committee
• Mobile:159 2108 9962
• Address:No. 2345 Longyang Road, Pudong New Area, Shanghai

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870