2026 Chengdu International Semiconductor and Integrated Circuit Innovation Conference and Exhibition

Time: October 16-18, 2026 Location: Chengdu Western International Expo City

Regarding the exhibition:

With the rapid development of new technologies such as artificial intelligence, smart cars, drones, automotive electronics, security, the Internet of Things, mobile phones, consumer and wearable electronics, home appliances, power supplies, 5G communication, etc., the demand for semiconductors has continued to grow rapidly, adding new impetus to the global semiconductor industry. As the center of the global electronics manufacturing industry and the largest consumer electronics market in the world, China's semiconductor industry has also grown rapidly recently, and China has become an active semiconductor market in global trade. In addition, with the strong support of the Chinese government for the semiconductor industry, the development of the Chinese semiconductor industry is accelerating. ”During the 14th Five Year Plan period, China's semiconductor industry will have more comprehensive development and accelerate breakthroughs and applications of key core technologies in high-end chip design and other fields.

In recent years, China has attached unprecedented importance to the semiconductor industry, continuously increasing policy and financial support for the semiconductor industry. Propose to accelerate the improvement of the integrated circuit design, manufacturing, packaging and testing industry chain, promote the development of key projects such as EDA tool software, semiconductor materials, high-end chips, and advanced manufacturing, promote the construction of key projects such as 12 inch chip production lines and third-generation semiconductors, and create a number of high-level semiconductor and integrated circuit industry bases and industrial parks. With the release and implementation of policies, under the general trend of rapid development of domestic 5G communication, new energy vehicles, industrial Internet, big data, photovoltaic and other industries, and the continuous promotion of the green low-carbon strategy of "carbon peaking, carbon neutrality", the application of the third generation semiconductor market has gradually opened, and the industrial scale has continued to grow.

Sichuan is not only a military industrial hub, but also one of the economic centers in western China. Chengdu is the core city of the electronic information industry in western China. In recent years, the output value of Chengdu's electronic information industry has exceeded one trillion yuan, and global leading enterprises such as Intel, Huawei, and BOE have laid out here, forming a complete industrial ecosystem. Has significant strength in military industry, aviation industry, electronic technology, aerospace technology, nuclear industry, automobile manufacturing, equipment manufacturing and other fields. As one of the six key advantageous industries cultivated in Sichuan, "Advanced Materials" is at the forefront of the domestic market in areas such as lithium battery materials, crystalline silicon photovoltaic materials, polymer composite materials, vanadium titanium, rare earth elements, basalt fiber, graphene, etc.

Chengdu, as an authoritative and specialized semiconductor industry brand event in the western region and even across the country, will host the 2026 Chengdu International Semiconductor and Integrated Circuit Innovation Conference and Exhibition from October 16-18, 2026 at the Chengdu Western International Expo City. The exhibition is expected to cover an area of 30000 square meters, with over 600 exhibitors and an estimated audience of over 30000. This exhibition focuses on integrating innovative products, technologies, solutions, and business cooperation models in the semiconductor industry, providing a one-stop solution platform for semiconductor enterprise brand promotion, product display, and exchange and cooperation, helping enterprises achieve communication and interoperability throughout the entire industry chain. As a semiconductor industry brand event that combines scale and influence, the exhibition follows market development trends and provides an opportunity for the domestic and international semiconductor industry to enhance brand awareness and expand markets. Give full play to its role as a window for transmitting market information and exchanging advanced technologies, and identify the direction of industry development. Sharing an international platform and expanding the semiconductor market together, let's work hand in hand to create business opportunities!

Organizational structure:

Organizational unit: Shanghai Shunqi Exhibition Service Co., Ltd

Venue: Chengdu Western International Expo City

Time: October 16-18, 2026

Audience invitation:

Integrated circuit regulatory authorities: Ministry of Industry and Information Technology of China, departments of industry and information technology of various provinces, bureaus of industry and information technology of various cities (autonomous regions, municipalities directly under the central government), counties (county-level cities), etc

The relevant person in charge of the integrated circuit regulatory department.

Integrated circuit industrialization enterprises: semiconductor design, materials, manufacturing, packaging and testing, and application related enterprises.

Park: Demonstration Zone, Industrial Park, Science and Technology Park, Entrepreneurship Park, etc.

Research institutions and associations: research institutes, industry associations, societies, alliances, etc.

Channel partners: technology and equipment research and development production enterprises, distributors, agents, service providers, traders, etc.

Industry chain enterprises: financial companies, corporations, technology development companies, e-commerce platforms, cultural and tourism companies and other industry related enterprises involved in the field of integrated circuits.

Industry stakeholders: experts, scholars, staff, university students, and individuals interested in the integrated circuit industry.

International audience: Industry professionals from concentrated regions of the global integrated circuit industry in the United States, Japan, Europe, and the Asia Pacific region.

Exhibition scope:

Semiconductor equipment: packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, thinning machine, cutting machine, surface mount machine, single crystal furnace, oxidation furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, polishing machine, chamfering machine, ion implantation equipment CVD/PVD equipment, coating/developing machines, front-end testing equipment, wet process equipment, thermal processing, coating equipment, single crystal deposition systems, solidification machines, plasma cleaning equipment, cutting machines, mounting machines, bonding machines, wire bonding machines, plastic packaging machines, reflow soldering, wave soldering, testing machines, bending equipment, sorting machines, robot automation, machine vision, other materials and electronic specialized equipment, coupling machines, carrier forming machines, testing equipment, constant temperature and humidity test chambers, sensors, packaging molds, testing fixtures, precision slide tables, stepper motors, valves, probe stations, clean room equipment, water treatment, etc;

IC design: IC and related electronic product design, IC product and application technology, IC testing methods and testing instruments, IC design and design tools, IC manufacturing and packaging, EDA, IP design, embedded software, digital circuit design, analog and mixed signal circuit design, integrated circuit layout design, IDM, Fabless factory, etc;

Wafer Manufacturing and Packaging: Wafer Manufacturing, SiP Advanced Packaging OSATs、EMS、OEMs、IDM、 Silicon wafers and IC packaging carriers, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and packaging testing, etc EDA、MCU、 Printed circuit boards, packaging substrates, semiconductor materials and equipment, etc;

Integrated circuit manufacturing: wafer fabs, wafer foundries, analog integrated circuits, digital integrated circuits, hybrid integrated circuit manufacturing, integrated circuit terminal products, etc;

Packaging and testing accessories: testing probe station, probe card, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, lead bonding, soldering testing, automation testing, laser cutting and others, grinding fluid, cutting fluid, sealing film (adhesive) high-temperature tape, laminated substrate, patch adhesive, feeding board, solder wire flow control, quartz graphite, silicon carbide, etc;

Third generation semiconductors: Third generation semiconductors such as silicon carbide (SiC), gallium nitride (GaN), wafers, substrates, packaging, testing, optoelectronic devices (LED), laser (LD), detector ultraviolet), power electronic devices (diode, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc.), microwave and radio frequency devices (HEMT, MMIC), etc;

Semiconductor materials: silicon wafers and silicon-based materials, silicon wafers, silicon wafers, monocrystalline silicon, silicon wafers, germanium silicon materials, S01 materials, silicon materials and compound semiconductor materials for solar cells, quartz products, graphite products, anti-static materials, photoresist and its supporting reagents, wafer tapes, photomasks, electronic gases, specialty chemical gases, CMP polishing materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, chip bonding materials, photoresist materials, wet electronic chemicals, sputtering targets, sealing materials, slicing, grinding, polishing, thin films, etc;

Automotive Semiconductor Exhibition Area: IGBT, Silicon Carbide, Gallium Nitride and other automotive grade power semiconductors, automotive grade MCU, ECU and domain controllers, intelligent cockpit ADAS、 Autonomous driving chips and systems, automotive grade memory and high-performance computing chips (AI/GPU/CPU), automotive safety and vehicle networking chips, modules and systems, etc

Electronic components: resistors, capacitors, potentiometers, electronic tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices/IGBTs, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectricity, crystals, quartz, ceramic magnetic materials, printed circuit substrates, electronic functional process specific materials, electronic adhesive (tape) products, electronic chemical materials and components, passive devices, 5G core components, special electronics, components, power management, storage, connectors, cables, plug-in devices, crystal oscillators, resistors, potentiometer magnetic components, filtering components PCB board, motor fan, electroacoustic device, display device, diode, transistor filter element, switch and component materials and equipment, etc;

Exhibition Tips:

1. Exhibitors determine the area and select the booth;

2. Fill in the exhibition application receipt (contract) and sign and stamp it, then fax the form to the organizing committee;

3. After selecting the booth, the enterprise must transfer 50% or the full amount of the exhibition fee to the designated account within 3 working days, otherwise the selected booth will not be retained;

4. The organizing committee will send the exhibitor handbook to the participating units one month before the exhibition;

5. The conference catalogue will publish free company profiles (within 200 words) for participating companies

Exhibition registration:

For matters related to exhibitions, advertising, and seminars, please inquire:

2026 Chengdu International Semiconductor and Integrated Circuit Innovation Conference and Exhibition Organizing Committee:

Phone: 021-3478 1799

Contact: Li Jun 159 2171 7039 (same as WeChat)

• Telephone:159 2171 7039
• Contact:Li Jun
• Mobile:159 2171 7039
• Address:No. 88, East Fuzhou Road, Tianfu New Area, Chengdu City, Sichuan Province

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870