2026 Shanghai International Semiconductor Technology Conference and Exhibition
Dear all relevant units and industry colleagues
Currently, the rapid development of industries such as artificial intelligence, intelligent vehicles, 5G communication, Internet of Things, and new energy is driving the continuous growth of semiconductor demand. China has become the world's largest and most active semiconductor market in terms of trade. Driven by policy support and technological innovation, China's semiconductor industry is embarking on a new journey of high-end breakthroughs and independent controllability.
To build a platform for communication and cooperation across the entire industry chain, promote technological innovation and industrial synergy, the 2026 Shanghai International Semiconductor Technology Conference and Exhibition (SIA) is scheduled to be held from June 3 to 5, 2026 at the Shanghai New International Expo Center. The theme of this exhibition is "Breakthrough in 'Chip', Half Wall New Journey", gathering high-quality resources from around the world, showcasing cutting-edge technologies and innovative achievements, and helping enterprises seize market opportunities and expand business cooperation.

Basic information of the exhibition
Exhibition Name: 2026 Shanghai International Semiconductor Technology Conference and Exhibition
Exhibition theme: Breakthrough in "Core", Half Wall New Journey
Time: June 3-5, 2026
Location: Shanghai New International Expo Center
Registration and Exhibition: June 1-2, 2026 (08:00-17:00)
organizational unit
Host: China Equipment Management Association
Shanghai Zhongzhan Shixin Exhibition Group Co., Ltd
Organizer: Shanghai Guozhan Shixin Exhibition Co., Ltd

exhibition scale
Exhibition area: 60000 square meters
Exhibitors: 1000+
Professional audience: 100000+people
Simultaneous forums: 50+sessions

Exhibition Scope
1. Wafer Manufacturing Exhibition Area: Wafer processing equipment, materials, subsystems, components, wafer foundry and design enterprises, etc
2. Compound Semiconductor Exhibition Area: SiC, GaN, Gallium Arsenide Materials, RF Devices, High Power Semiconductors, etc
3. EDA/IP and Design Services Exhibition Area: EDA Software, Chip Design IP, Advanced Packaging Design, AI Design Platform, etc
4. Packaging and testing exhibition area: packaging and testing equipment, materials, packaging and testing factories, components and consumables, etc
5. Core Components Exhibition Area: Process Components, RF Power Supplies, Optics, Vacuum Systems, Sensors, Instruments, etc
6. Automotive Semiconductor Exhibition Area: Automotive grade power devices MCU、 Intelligent cockpit/autonomous driving chip, vehicle grade memory, etc

Concurrent Events
General meeting and closed door high-level meetings
Global Electronic Semiconductor Technology Conference
Global Semiconductor Supply Chain Development Technology Conference
Yangtze River Delta Semiconductor/Integrated Circuit Industry Innovation Forum
Supply Chain New Product and Technology Promotion Conference
Supply and demand docking, business negotiations, unveiling ceremonies, etc

exhibition fee
Standard booth (9 square meters): 15800 yuan/piece, double opening plus 10% charge
Deluxe booth (12 square meters): 25800 yuan/piece, double opening additional charge of 10%
Indoor bare space (minimum rent of 36 square meters): 1580 yuan/square meter

Exhibition Highlights
Insight into industry trends, release cutting-edge technologies and new products
Connect with precise procurement and expand global sales channels
Gathering industry elites, building high-end networks and cooperation platforms
Enhance brand influence and consolidate core market position
We sincerely invite domestic and foreign semiconductor companies, research institutes, investment institutions, and industry colleagues to actively participate in the exhibition and conference, discuss technological innovation, explore industry opportunities, and build a new future for China's semiconductor industry together!

2026 Shanghai International Semiconductor Technology Conference and Exhibition Organizing Committee
Organizing Committee: Mr. Wang 131 6637 5719

Exhibition Scope
1. Wafer Manufacturing Exhibition Area: Wafer processing equipment, materials, subsystems, components, wafer foundry and design enterprises, etc
2. Compound Semiconductor Exhibition Area: SiC, GaN, Gallium Arsenide Materials, RF Devices, High Power Semiconductors, etc
3. EDA/IP and Design Services Exhibition Area: EDA Software, Chip Design IP, Advanced Packaging Design, AI Design Platform, etc
4. Packaging and testing exhibition area: packaging and testing equipment, materials, packaging and testing factories, components and consumables, etc
5. Core Components Exhibition Area: Process Components, RF Power Supplies, Optics, Vacuum Systems, Sensors, Instruments, etc
6. Automotive Semiconductor Exhibition Area: Automotive grade power devices MCU、 Intelligent cockpit/autonomous driving chip, vehicle grade memory, etc

• Telephone:131 6637 5719
• Contact:Mr. Wang
• Mobile:131 6637 5719
• Address:No. 2345 Longyang Road, Pudong New Area, Shanghai

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870