2026 Shandong International Data Center and Liquid Cooling Technology Exhibition

time Room: 2026year9moon15～17day  land Point:Yantai Bajiaowan International Convention and Exhibition Center

25+Technical Forum; 800+leading exhibitors; 30000+professional audience; 50000 square meters+exhibition area

Exhibition Background

In recent years, with the explosive growth of big data, the data throughput and computational load required by data centers have significantly increased, making the data center industry increasingly demanding servers. However, due to the limited area of data center construction and environmental regulations, the server carrying capacity of existing data centers in China is relatively limited, and they need to continuously increase the power density of single cabinets to accommodate the rapidly growing demand for computing power. Based on its efficient technological advantages, liquid cooling has become a pioneer in further reducing PUE in data centers.

With the development of 5G technology, edge computing, AI and other applications, the power density of single cabinet will become higher and higher, and the proportion of liquid cooling in industrial applications will become larger and larger. Although the trend is good, we also clearly see that the entire industry ecosystem of liquid cooling is not yet perfect, and there is great room for improvement in both cost and technology for liquid cooling products and solutions. The "2026 Shandong AI Computing Industry Exhibition and Data Center Liquid Cooling Technology Exhibition" will be held from September 15-17, 2026 at the Bajiaowan International Convention and Exhibition Center in Yantai. It will showcase the latest products and technologies in AI computing power, data centers, and liquid cooling industry, establish brand image for enterprises, promote trade cooperation, market development, and lead industry development.

█target audience

We mainly invite executives of enterprises in various scientific and technological fields, such as intelligent computing center, EPC general contractor, design institute, system integrator, finance, data center, power, electronics, aviation, aerospace, automobile, aircraft, medical care, communication, battery, new energy, high-performance computing, edge computing, artificial intelligence, lithium battery equipment, energy storage, power generation, energy, photovoltaic equipment, semiconductor equipment, automation, hydrogen energy, to visit and negotiate.

█Exhibition schedule

Report Exhibition: September 13-14, 2026 Opening Ceremony: September 15, 2026 09:30

Display transaction: September 15-17, 2026 Withdrawal: September 17, 2026 15:00

Reason for participation

Collect new sales information and meet high-quality buyer groups from both domestic and international sources;

Understand future product demands and obtain new market development information;

Seeking new business opportunities through industry division of labor cooperation and industry chain demand;

A platform for releasing new technologies and showcasing new products, gaining opportunities for market promotion and brand building, and increasing industry awareness;

Participate in relevant forum activities to learn about industry development trends and new information on technological innovation.

Our goal will be to build an international procurement and trade platform, promote enterprise exchanges and cooperation, and improve exhibition effectiveness!

█Exhibition Scope

【1】 Al computing power/algorithm:Infrastructure server/storage, network equipment, optical communication/optical transmission, AI chip/DPU/CPU/GPU, server, switch, optical module, storage chip, edge computing chip, edge computing, supercomputing center/intelligent computing center/edge data center, cloud service, Internet of Things, computing security, software application, firewall and gateway, etc;

【two】Data center infrastructure:Infrastructure solutions for data centers, edge data center solutions, micro module data centers, air conditioning, cooling, and fresh air systems, power supply and distribution systems, comprehensive cabling systems, building and decoration materials for computer rooms, large screen display systems, fire protection systems, security systems, etc;

【three】Liquid cooled raw materials:Including coolant, refrigerant, fluorinated liquid, silicone oil, mineral oil carbon dioxide/hydrogen, aqueous solution, etc;

【four】Liquid cooling device:Cold plate liquid cooling products, metal cold plates, heating equipment and components, submerged liquid cooling products for liquid circulation equipment, heat dissipation devices, radiators, heat pipe fans, coolant, pumps, compressors, drive ring power components, temperature control components, thermostats/thermostats, temperature sensors, evaporators, condensers, expansion pots/coolant tanks, etc;

【five】Pipeline and connectors:Rubber hoses, metal pipes, corrugated pipes, insulation pipes, water pipes/joints, cooling pipelines and connecting components, etc;

【six】Auxiliary cooling equipment:Cooling fans, cooling materials, enhanced heat sinks, environmental air exchange equipment, etc;

【seven】Core technologies and equipment for liquid cooling:Including cold plate liquid cooling (including full liquid cold plate servers), immersion liquid cooling (single-phase/two-phase), spray liquid cooling, cold module decoupling design, intelligent temperature control system, and fluid distribution technology; Key components such as coolant (fluorinated liquid, mineral oil, etc.), cold plates, pumps, valves, quick couplings, heat exchangers, leak detection equipment, intelligent sensors, phase change materials (PCM), etc;

【8】 Liquid cooling materials and solutions:High thermal conductivity metal materials (aluminum alloys, copper alloys), insulation materials, sealing materials; Graphene thermal conductive film, ceramic substrate, carbon nanotube composite material. Data center solutions: modular data center, container data center, edge computing liquid cooling solution; Liquid cooling system thermal simulation software, AI driven intelligent operation and maintenance platform.

█Booth fees

Standard booth: (3M x 3M) booth (including three side panels, fascia board, one table and two chairs, 220V power sockets, carpet, cleaning fees, etc.).

Open space: does not include any supporting facilities, and can be rented separately if needed.

█Exhibition Tips

1. Please fill out the "Exhibition Application and Contract" form carefully and fax it to the organizing committee with the official seal.

2. After applying for a booth, exhibitors are required to wire transfer the booth fee to the designated account of the conference within 3 working days. After making the remittance, please fax the remittance receipt to the organizing committee for verification; If payment is not made in a timely manner within the specified time, the organizing committee will not reserve the original booth.

3. The principle of booth sequence allocation is "apply first, pay first, arrange first".

4. In order to ensure the overall image of the conference, the organizing committee reserves the final right to adjust the booths of some exhibitors.

█Exhibition Scope

【1】 Al computing power/algorithm:Infrastructure server/storage, network equipment, optical communication/optical transmission, AI chip/DPU/CPU/GPU, server, switch, optical module, storage chip, edge computing chip, edge computing, supercomputing center/intelligent computing center/edge data center, cloud service, Internet of Things, computing security, software application, firewall and gateway, etc;

【two】Data center infrastructure:Infrastructure solutions for data centers, edge data center solutions, micro module data centers, air conditioning, cooling, and fresh air systems, power supply and distribution systems, comprehensive cabling systems, building and decoration materials for computer rooms, large screen display systems, fire protection systems, security systems, etc;

【three】Liquid cooled raw materials:Including coolant, refrigerant, fluorinated liquid, silicone oil, mineral oil carbon dioxide/hydrogen, aqueous solution, etc;

【four】Liquid cooling device:Cold plate liquid cooling products, metal cold plates, heating equipment and components, submerged liquid cooling products for liquid circulation equipment, heat dissipation devices, radiators, heat pipe fans, coolant, pumps, compressors, drive ring power components, temperature control components, thermostats/thermostats, temperature sensors, evaporators, condensers, expansion pots/coolant tanks, etc;

【five】Pipeline and connectors:Rubber hoses, metal pipes, corrugated pipes, insulation pipes, water pipes/joints, cooling pipelines and connecting components, etc;

【six】Auxiliary cooling equipment:Cooling fans, cooling materials, enhanced heat sinks, environmental air exchange equipment, etc;

【seven】Core technologies and equipment for liquid cooling:Including cold plate liquid cooling (including full liquid cold plate servers), immersion liquid cooling (single-phase/two-phase), spray liquid cooling, cold module decoupling design, intelligent temperature control system, and fluid distribution technology; Key components such as coolant (fluorinated liquid, mineral oil, etc.), cold plates, pumps, valves, quick couplings, heat exchangers, leak detection equipment, intelligent sensors, phase change materials (PCM), etc;

【8】 Liquid cooling materials and solutions:High thermal conductivity metal materials (aluminum alloys, copper alloys), insulation materials, sealing materials; Graphene thermal conductive film, ceramic substrate, carbon nanotube composite material. Data center solutions: modular data center, container data center, edge computing liquid cooling solution; Liquid cooling system thermal simulation software, AI driven intelligent operation and maintenance platform.

• Company:Shanghai Xuntong Exhibition Co., Ltd
• Telephone:021-54155272
• Contact:Liang Jiajin
• Mobile:13681658788
• E-mail:295662837@qq.com
• Address:31 Beijing Middle Road, Fushan District, Yantai City, Shandong Province

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