The 2026 China Chongqing International Electronic Information Expo will be held on October 16th

Host: Organizing Committee of Chongqing High tech and Advanced Intelligent Manufacturing Industry Expo, China

Organizer: Chongqing Zhongbo Exhibition Co., Ltd

Exhibition Background:

Electronic products are widely used in application industries such as 4C, industrial control and automation, lighting and display, new energy, rail transit, security, Internet of Things, cloud computing, 5G, smartphones, drones, etc. The electronics industry is currently in a critical period of technological iteration and market restructuring. The national strategy is promoting industrial upgrading, and technologies such as 5G, AI, and the Internet of Things are driving intelligent, green, and scenario based development. Focus on building a globally competitive industrial ecosystem for semiconductors, new materials, and other industries.

The expo focuses on showcasing consumer electronics, embodied intelligence, AI big models, intelligent computing centers, AI+application scenarios, integrated circuits, low altitude economy, electronic components, special electronics, and dual-use electronic technologies. It systematically presents the innovation of the entire industry chain from intelligent terminals, artificial intelligence, low altitude economy to semiconductor foundation, closely focusing on intelligent mobile terminals, intelligent wearables, smart homes, artificial intelligence robots, low altitude economy, data storage, AI computing power, artificial intelligence big models, sports technology AR/VR、 Comprehensive display of the latest products and technologies in hot fields such as integrated circuits, electronic components, and special electronic components

The expo is driven by basic electronic components and serves application industries such as 5G, new energy vehicles, the Internet of Things, big data, cloud computing, lighting and display security, consumer electronics, and intelligent manufacturing.

The expo will establish new generation information technology innovation applications, AI computing power, data centers, core leading components, special electronic components, etc., closely focusing on intelligent mobile terminals, intelligent wearables, smart homes, artificial intelligence robots, low altitude economy, data storage and computing, AI computing power, artificial intelligence big models, sports technology AR/VR、 Comprehensive display of the latest products and technologies in hot fields such as integrated circuits, electronic components, and special electronic components.

The consumer electronics area focuses on the trend of personalization and intelligence driven by AI, and will showcase innovative products such as foldable screen phones, AI phones, whole house intelligence, healthy wearables, and new payment terminals. Embodied intelligence presents humanoid robots, robotic dogs, industrial and service robots in a centralized manner AGV、 Cutting edge achievements such as robotic arms and virtual digital humans demonstrate the enormous potential for intelligent agents to interact with the physical world; AI large model and intelligent computing center area focus on computing cornerstone, and display server, storage, edge computing, intelligent computing center, liquid cooling technology (immersion, cold plate), computing operation and maintenance and other key links. The AI+application scenario area comprehensively showcases the deep integration and innovative applications of AI in vertical fields such as finance, healthcare, education, toys, driving, security, and eyewear, witnessing the intelligent empowerment of AI in various industries.

The integrated circuit application area showcases key products such as AI chips, storage chips, analog/RF/power management chips, and presents eVTOL (electric vertical takeoff and landing aircraft), various drones, detection equipment, flight simulators, and industry solutions in the low altitude economic zone. The electronic components area extensively displays upstream key products such as passive components, connectors, sensors, semiconductor equipment core components, discrete devices, etc., meeting the strong demand for high-performance basic components in fields such as communication, automotive, industrial control, AI, etc; The military industrial group, research institutes, and technology enterprises in the special electronic and dual-use electronic technology zone showcase special integrated circuits, high-end basic components, electronic process materials, testing equipment, and intelligent unmanned systems, promoting collaborative innovation and integrated development of military and civilian technologies

Exhibition schedule and location:

Date: October 16-18, 2026 Location: Chongqing Yuelai International Expo Center

Exhibition time: October 14-15, 2026, 8:30-22:00

Exhibition time: October 16-18, 2026, 9:00-17:30

Demolition time: 17:30 PM, October 18, 2026

Exhibition fee:

Standard booth: (3m x 3m)=9 square meters, domestic: 11800 yuan/piece, foreign: 1800 US dollars/piece

Special empty space (minimum rent of 36 square meters), domestic: 1180 yuan/square meter, foreign: 180 US dollars/square meter

Exhibition Content

Integrated circuits: microprocessors, logic ICs, memory, analog ICs, etc;

Semiconductor discrete devices: diodes, transistors, thyristors, etc;

Passive components: resistors, capacitors, inductors, power transformers, relays, electroacoustic devices, resonators, filters, quartz crystals, buttons, buzzers, speakers, PCBs, etc;

Equipment and instruments: electronic devices and intelligent manufacturing, instruments and electronic tools, etc

Cable connection: various connectors, electronic wire plugs, sockets, switches, terminals, cable materials, wiring equipment, wires and cables, specialized mechanical equipment for wires and cables, etc;

Sensor components: new MEMS sensors, sensitive components, temperature sensors, gas sensors, displacement sensors, velocity sensors, photoelectric sensors, biochemical sensors, electroacoustic devices, etc;

Electronic materials: semiconductor materials, optoelectronic materials, magnetic materials, electronic ceramics, crystal materials, thermal conductive materials, electromagnetic wave shielding materials, etc;

Semiconductor equipment and core components: semiconductor device equipment, material equipment, chip equipment, packaging manufacturing equipment and core components, integrated circuit equipment, solar cell chip equipment, LED equipment, third-generation semiconductor equipment, etc

Electronic manufacturing equipment: covering SMT and soldering technology, industrial robots, AI vision inspection systems, PCB and electronic materials, testing and measurement, semiconductor parameter testers, 3D X-ray inspection equipment;

Innovation in Information Technology Applications: Core technology products such as domestically produced CPUs, operating systems, databases, middleware, etc; Industrial AI innovation system development, industrial vertical domain large model, industry innovation solutions, information security and ecological adaptation, terminal security products, and domestic encryption technology;

Software: industrial software R&D, industrial Internet, AI big model and algorithm, cloud platform, embedded software, industrial security solutions, AR/VR software, smart travel, etc;

Electronic components: display resistors, capacitors, inductors, potentiometers, connectors, sensors, power supplies, switches, relays, crystals, quartz;

Semiconductors and integrated circuits: covering the entire industry chain of computing power, chip design, manufacturing, packaging and testing, advanced process equipment, third-generation semiconductor materials, and automotive grade chips;

Smart sensors and industrial intelligence: display pressure, temperature, MEMS sensors, as well as PLC, servo system, industrial robot, intelligent factory, 5G+industrial Internet; Connectors and cable harnesses: various connectors, electronic wire plugs, sockets, switches, terminals, cable materials, wiring equipment, wires and cables, specialized mechanical equipment for wires and cables, etc;

Sensors and electronic components: new MEMS sensors, sensitive components, temperature sensors, gas sensors, displacement sensors, velocity sensors, photoelectric sensors, biochemical sensors, electroacoustic devices, component distribution, relays, micro nano systems, electromagnetic compatibility, power modules and power supply units, etc

New energy and automotive electronics: power battery testing equipment, hydrogen fuel cell components, photovoltaic inverters, energy storage systems, onboard radar, intelligent cockpit systems, autonomous driving domain controllers, and other full industry chains;

Communication and Information Technology: Showcasing base station RF modules, millimeter wave communication equipment, 5G+AI fusion applications, cloud computing and big data, industrial data center solutions, aviation electronic equipment, high-speed rail signal control modules, high temperature resistant and radiation resistant electronic components;

Consumer electronics: smart home, whole house intelligent control system, intelligent security equipment, mobile phones, computers, smart wearables, audio and video products, e-sports game products, supporting voice interaction and remote control;

Emerging application areas

Low altitude economy: unmanned aerial vehicle automated airport, flight control system, serving logistics distribution and urban inspection;

Metaverse and Digital Twin: Virtual Design Platform, VR/AR Industrial Training System.

Testing and measurement: machine vision, electronic and communication instruments, electrical instruments and meters, environmental testing instruments and equipment, analytical instruments, certification testing, automation instruments and meters, etc

New Display and Intelligent Terminals: OMini/MicroLED Display, Car Display, Medical Display, Educational Display, Wearable Display VR Display, Intelligent Transportation Display and Application Terminal Display, Flexible Display and Materials and Equipment

3D glass, touch screen modules, AR/VR/MR devices, mobile phones, laptops, smart bracelets, wearable devices, smart robots, audio-visual equipment, industry terminals, etc

Smart home, smart terminal, high-end chip and Internet, cloud computing and big data, artificial intelligence, 5G8K HD, information security, integrated circuit, etc.

New Display and Application Pavilion. Mainly including: LCD, OLED, Micro LED/Mini LED, laser display, upstream and downstream materials and equipment for display, semiconductor display, 3D cover glass, touch screen, etc

Semiconductor industry and applications, intelligent manufacturing, 3D printing, intelligent control, robot intelligent systems, big data storage facilities; New Generation Information Industry Intelligent Manufacturing Museum;

IoT intelligent communication should use technologies such as automotive electronics, intelligent driving, and new energy vehicles;

Components: integrated circuits, electronic components, basic electronics, electronic materials, electronic equipment, instruments and meters, electronic tools, special components

Invitation to Expo Visitors:

The organizing committee of the Expo will focus on inviting senior management personnel such as the chairman, general manager, and deputy general manager of electronic manufacturing companies such as consumer electronics, home appliances, and smart terminals, as well as engineers, technicians, and designers from supply chain management, procurement, technology, research and development, production and manufacturing, product testing, and other departments.

Electronic components and supporting enterprises: personnel from semiconductor equipment, wafer/packaging manufacturers, design chip manufacturers, semiconductor materials, semiconductor components, electronic components and other enterprises.

Distributors and retailers: domestic distributors and agents of household appliances and consumer electronics, import and export companies, cross-border e-commerce, retailers, etc.

Research institutes and universities: Researchers and faculty and students in electronic related fields.

Investment and financial institutions: personnel from investment companies, incubators, crowdfunding platforms, and other institutions.

Other related industries: military industry, aerospace, automotive, medical, industrial control, communication, transportation, energy and other industries involving electronics.

Contact information of the Expo Organizing Committee:

Chongqing Zhongbo Exhibition Co., Ltd

Contact: Teacher Feng

Mobile phone and WeChat ID: 15923519466

• Telephone:15923519466
• Contact:Teacher Feng
• Mobile:15923519466
• Address:No. 66 Yuelai Avenue, Yubei District, Chongqing

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