Currently, global digital transformation is accelerating, and semiconductors, as the "industrial heart" of the digital age, are the core cornerstone supporting strategic areas such as 5G, artificial intelligence, new energy vehicles, and advanced computing. They are also the key to cultivating new quality productivity and promoting industrial innovation for the country. As a strategic and fundamental industry of the country, semiconductors have received multiple policy key supports such as "Made in China 2025" and "14th Five Year Plan". The global market is steadily expanding and the industrial pattern is accelerating restructuring, ushering in significant development opportunities.

The 2027 exhibition will further expand and upgrade, striving to attract more global leading enterprises and top research institutions to participate, focusing on technological breakthroughs, supply and demand matching, cross-border cooperation and talent exchange, helping domestic and foreign enterprises seize industry opportunities, deepen collaborative innovation, work together to build a new ecosystem of semiconductor industry, and promote the high-quality development of the global semiconductor industry.

Review of the Previous Session

The previous exhibition brought together Hefei Xianwei Semiconductor, Yiyue Technology, Yita Semiconductor, Hefei Fuxian Automation, Boiling Point Sealing, Hefei Juque, Horkheimer, Hikvision, Huace Testing, Hefei Zhizhen Precision, Pioneer Group, Hefei Yuchi, Jianxing Technology, Apast, Sanying Precision Control, Futai Purification, Gasipak, Anhui Renhe, Hefei Lingwei, Linstron, Zhangjiagang Integrated Circuit Industry Promotion Center, Jiangsu Third Generation Semiconductor Research Institute, MacAudie, Xihe Superconductor, Shanghai Yifan, Lixin Electronics, Bengbu Danpu, Wanweikelin, Weikete, Bit Intelligent Computing, Jinshexin, Weimai Core Materials, Nanjing Juqiao, Micaro Well, Jiangsu Anruisen, Yingrui High tech, Yingruizhi, Anhui Xiangyu, Bojin Chemical, Wanrui Cold Electric, Yinguan Semiconductor, Shanghai Yifan, Shanghai Aerospace Yuda 300 well-known domestic and foreign enterprises, including Shanghai Micro Spectrum Testing, Youlide, Anhui Benfeng, Nongtai, Xinhongjun, Keweixince, Anhui Qihui Semiconductor, Hefei Zhichang Optoelectronics, Hefei Zhire Equipment, Anhui Yingchuang Precision, Anhui Huayuan Micro, Haishida, Huidechuang, etc., showcased cutting-edge technologies, core equipment, and innovative solutions, effectively promoting the deep integration of the industrial chain and supply chain.

Exhibition Scope：

1. IC Design and Chip Zone

EDA full process design software, IP core, embedded system software, digital/analog/mixed signal integrated circuit design, layout design and verification services; Artificial intelligence chips (end/edge/training), general-purpose GPUs, NPUs, TPUs, DPUs, AI SoCs, large model training and inference chips, heterogeneous computing processors, high and low voltage power management chips (PMIC), industrial IoT MCUs, 5G/millimeter wave RF chips, automotive grade chips (AEC-Q100 certified), secure encryption chips, storage chips (DRAM/Flash/storage control chips, high bandwidth memory HBM, storage stack chips), full category display driver chips (OLED/LCD/TCON/Mini Micro LED), integrated storage and computing chips, AI storage and computing fusion chips, intelligent vision chips; Server CPU, memory interface chip, high-speed optical module, silicon optical integration and other AI server and data center core chips and supporting components.

2. Integrated Circuit Manufacturing Zone

12 inch wafer manufacturing and outsourcing, DRAM storage wafer manufacturing, display driver (DDI) wafer manufacturing, 28/40nm logic/MCU specialty processes, power device/BD/MEMS dedicated processes, IDM vertical integration whole plant project, overall wafer plant construction plan, process upgrade and mass production supporting solutions, wafer regeneration, wafer testing and verification, process reliability evaluation, and mass production yield optimization services; Covering advanced GAA processes, backside power supply processes, glass packaging substrates, photonic SOI and other cutting-edge new process technologies and supporting services; Mask detection, mask repair equipment, and supporting technical solutions.

3. Semiconductor Materials Zone

12 inch semiconductor silicon wafer (polished/epitaxial/SOI silicon wafer), high-end photoresist (ArF/KrF/i wire) and supporting reagents, high-purity electronic special gas, CMP polishing solution and polishing pad, high-purity metal target material (Al/Cu/Ti/Ta/W alloy target material), photolithography supporting chemicals, photomask plate, wet electronic chemicals, semiconductor precursor materials, special coating materials, functional thin film materials, wide bandgap compound semiconductor materials (SiC/GaN/gallium oxide substrate and epitaxial materials), high-end packaging materials (packaging substrate, lead frame, bonding wire, epoxy encapsulation material, etc.).

4. Semiconductor Equipment and Core Components Zone

Front equipment: lithography equipment, etching equipment, thin film deposition equipment (PVD/CVD/ALD), ion implantation equipment, semiconductor grade cleaning equipment, coating and developing equipment, precision measurement and testing equipment, annealing/oxidation/diffusion heat treatment equipment;

Rear equipment: wafer thinning machine, wafer cutting machine, solidification machine, bonding equipment, plastic packaging equipment, rib cutting and forming equipment, testing sorting machine, automatic probe station, ATE integrated circuit testing system;

Core precision components: dry vacuum pump, RF power supply, electrostatic chuck (ESC), wafer transfer equipment (EFEM), high-purity control valve, precision motion platform, optical components, semiconductor specific robots and automation supporting components, semiconductor precision ceramic components, cavity components, heaters, wafer carrying accessories, equipment precision consumables, non-standard customized components; Complete solutions for wafer handling automation and wafer inspection automation; Ultra pure water system, clean room equipment, and supporting engineering facilities in semiconductor factory buildings.

5. Advanced Packaging and Testing Zone

Chiplet chip heterogeneous integration technology, 2.5D/3D stacked packaging, TSV silicon via process, Fan out fan out packaging, WLCSP wafer level packaging, Bumping bump manufacturing, SiP system level packaging; Specialized packaging and testing for storage chips, automotive grade high reliability packaging, and power semiconductor module packaging; Integrated circuit testing equipment and technology: ATE fully automated testing system, digital/analog/mixed signal testing, high and low temperature aging testing system, failure analysis equipment (SEM/EDX/FIB), wafer yield control and data analysis system.

6. Third Generation Semiconductor Zone

Second and third generation compound semiconductor materials and devices: silicon carbide (SiC), gallium nitride (GaN), gallium oxide, gallium arsenide (GaAs), indium phosphide (InP) substrates and epitaxial materials, various power devices, RF microwave devices, high-speed communication devices, and wide bandgap semiconductor power modules; Focusing on the overall application solutions of power semiconductors and RF communication in the fields of new energy vehicles, photovoltaic energy storage, industrial power supply, high-end fast charging, 5G/6G communication, aerospace information, microwave radar, etc.

7. Application Ecological Zone of "Chip Screen Auto Fusion"

Display field: Mini/Micro LED, OLED, LCD new display driver technology, car displays, flexible displays, ultra clear high refresh rate displays, integrated core chips and supporting materials under the screen;

In the automotive field: automotive grade core chips, battery management systems (BMS), automotive motor controllers, and onboard power modules;

Industrial/AI/data center field: industrial control chip, edge computing intelligent module, AI computing module, server computing acceleration scheme, large model hardware supporting, server and storage dedicated chip, industrial/vehicle gauge level sensor interface chip;

Industrial Supporting Services: Industrial policy promotion, industrial funds, industrial park carriers, industry university research innovation achievements, product testing and certification, intellectual property rights, and comprehensive industry supporting services.

8Components Zone

Vehicle grade/industrial grade resistors, capacitors, potentiometers, power semiconductor discrete devices, high-end specialized connectors, heat sinks, electromechanical components; Electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, industrial/automotive grade sensors, dedicated power supplies, switches, micro motors, electronic transformers, relays; High end printed circuit boards (HDI/high-frequency/automotive grade PCBs), various specialized circuits, piezoelectric, crystalline, quartz, ceramic magnetic materials; Printed circuit substrates, specialized materials for electronic functional processes, electronic adhesive (tape) products, electronic chemical materials and components; High end specialized supporting components and materials such as microwave components, communication equipment microwave materials, microwave RF detection instruments, industry-specific software, and electronic tubes.

professional visitor

1. Integrated circuit design, wafer manufacturing, specialty process outsourcing, IDM vertical integration, advanced packaging testing and other full chain enterprises; Upstream and downstream research and development, production, procurement, and operation teams for high-end semiconductor equipment, core precision components, high-purity semiconductor materials, lithography supporting materials, packaging materials, etc; EDA software, IP core, layout verification, testing verification, yield optimization, failure analysis and other technical service organizations.

2. Enterprises producing wide bandgap semiconductor materials and devices such as silicon carbide, gallium nitride, gallium oxide, gallium arsenide, and indium phosphide; Research and development manufacturers of power semiconductor modules, RF microwave devices, and high-speed communication devices; We are a solution integrator and terminal procurement enterprise targeting the fields of new energy vehicles, photovoltaic energy storage, industrial power supply, 5G/6G communication, aerospace information, and microwave radar.

3Core procurement enterprise for terminal applications

New Display Field：Mini/Micro LED、OLED、 Terminal enterprises such as in car displays, flexible displays, and ultra high definition displays, as well as upstream and downstream supporting supply chain enterprises.

Automotive electronics fieldA research and procurement team focused on automotive grade chips, intelligent driving, in car electronic control systems, and battery management systems, including vehicle manufacturers, new energy vehicle companies, and Tier 1 core component manufacturers.

AI computing power and data center field: Cloud computing, AI big model, data center, AI server enterprises, covering the selection, procurement and technical R&D teams of products such as computing chips, high-speed optical modules, silicon optical integration, edge computing, etc.

High end manufacturing and general terminal fieldHigh end terminal application enterprises such as industrial automation, intelligent equipment, industrial robots, consumer electronics, optical communication, aerospace, national defense and military industry, medical electronics, and new energy storage.

4. A research and development, production, procurement, and supply chain support enterprise for automotive grade, industrial grade resistive capacitive components, power discrete devices, high-end connectors, intelligent sensors, high-frequency, high-speed, and automotive grade PCBs, microwave and RF devices, special electronic materials, and electromechanical supporting components.

5. Local departments in charge of industry and information technology, industrial parks, science and technology innovation parks, and investment operation platforms; National semiconductor industry associations, societies, and standardization organizations; Higher education institutions, research institutes, and industry university research innovation platforms; Third party testing and certification, intellectual property, trade distribution, industry supporting service providers, and industry professional media.

6. Semiconductor special industry funds, venture capital institutions, financial investment companies, securities research teams, and various industry investment and financing platforms.

7. Core positions such as corporate executives, technical directors, R&D engineers, process engineers, equipment engineers, testing engineers, product managers, procurement directors, supply chain managers, project decision-makers, and market operation backbone personnel.

Beijing Zhongwei International Exhibition Co., Ltd

Contact: Liu Jiao (Ms.)

Phone: 13257086620 (WeChat Sync)

Exhibition Scope：

1. IC Design and Chip Zone

EDA full process design software, IP core, embedded system software, digital/analog/mixed signal integrated circuit design, layout design and verification services; Artificial intelligence chips (end/edge/training), general-purpose GPUs, NPUs, TPUs, DPUs, AI SoCs, large model training and inference chips, heterogeneous computing processors, high and low voltage power management chips (PMIC), industrial IoT MCUs, 5G/millimeter wave RF chips, automotive grade chips (AEC-Q100 certified), secure encryption chips, storage chips (DRAM/Flash/storage control chips, high bandwidth memory HBM, storage stack chips), full category display driver chips (OLED/LCD/TCON/Mini Micro LED), integrated storage and computing chips, AI storage and computing fusion chips, intelligent vision chips; Server CPU, memory interface chip, high-speed optical module, silicon optical integration and other AI server and data center core chips and supporting components.

2. Integrated Circuit Manufacturing Zone

12 inch wafer manufacturing and outsourcing, DRAM storage wafer manufacturing, display driver (DDI) wafer manufacturing, 28/40nm logic/MCU specialty processes, power device/BD/MEMS dedicated processes, IDM vertical integration whole plant project, overall wafer plant construction plan, process upgrade and mass production supporting solutions, wafer regeneration, wafer testing and verification, process reliability evaluation, and mass production yield optimization services; Covering advanced GAA processes, backside power supply processes, glass packaging substrates, photonic SOI and other cutting-edge new process technologies and supporting services; Mask detection, mask repair equipment, and supporting technical solutions.

3. Semiconductor Materials Zone

12 inch semiconductor silicon wafer (polished/epitaxial/SOI silicon wafer), high-end photoresist (ArF/KrF/i wire) and supporting reagents, high-purity electronic special gas, CMP polishing solution and polishing pad, high-purity metal target material (Al/Cu/Ti/Ta/W alloy target material), photolithography supporting chemicals, photomask plate, wet electronic chemicals, semiconductor precursor materials, special coating materials, functional thin film materials, wide bandgap compound semiconductor materials (SiC/GaN/gallium oxide substrate and epitaxial materials), high-end packaging materials (packaging substrate, lead frame, bonding wire, epoxy encapsulation material, etc.).

4. Semiconductor Equipment and Core Components Zone

Front equipment: lithography equipment, etching equipment, thin film deposition equipment (PVD/CVD/ALD), ion implantation equipment, semiconductor grade cleaning equipment, coating and developing equipment, precision measurement and testing equipment, annealing/oxidation/diffusion heat treatment equipment;

Rear equipment: wafer thinning machine, wafer cutting machine, solidification machine, bonding equipment, plastic packaging equipment, rib cutting and forming equipment, testing sorting machine, automatic probe station, ATE integrated circuit testing system;

Core precision components: dry vacuum pump, RF power supply, electrostatic chuck (ESC), wafer transfer equipment (EFEM), high-purity control valve, precision motion platform, optical components, semiconductor specific robots and automation supporting components, semiconductor precision ceramic components, cavity components, heaters, wafer carrying accessories, equipment precision consumables, non-standard customized components; Complete solutions for wafer handling automation and wafer inspection automation; Ultra pure water system, clean room equipment, and supporting engineering facilities in semiconductor factory buildings.

5. Advanced Packaging and Testing Zone

Chiplet chip heterogeneous integration technology, 2.5D/3D stacked packaging, TSV silicon via process, Fan out fan out packaging, WLCSP wafer level packaging, Bumping bump manufacturing, SiP system level packaging; Specialized packaging and testing for storage chips, automotive grade high reliability packaging, and power semiconductor module packaging; Integrated circuit testing equipment and technology: ATE fully automated testing system, digital/analog/mixed signal testing, high and low temperature aging testing system, failure analysis equipment (SEM/EDX/FIB), wafer yield control and data analysis system.

6. Third Generation Semiconductor Zone

Second and third generation compound semiconductor materials and devices: silicon carbide (SiC), gallium nitride (GaN), gallium oxide, gallium arsenide (GaAs), indium phosphide (InP) substrates and epitaxial materials, various power devices, RF microwave devices, high-speed communication devices, and wide bandgap semiconductor power modules; Focusing on the overall application solutions of power semiconductors and RF communication in the fields of new energy vehicles, photovoltaic energy storage, industrial power supply, high-end fast charging, 5G/6G communication, aerospace information, microwave radar, etc.

7. Application Ecological Zone of "Chip Screen Auto Fusion"

Display field: Mini/Micro LED, OLED, LCD new display driver technology, car displays, flexible displays, ultra clear high refresh rate displays, integrated core chips and supporting materials under the screen;

In the automotive field: automotive grade core chips, battery management systems (BMS), automotive motor controllers, and onboard power modules;

Industrial/AI/data center field: industrial control chip, edge computing intelligent module, AI computing module, server computing acceleration scheme, large model hardware supporting, server and storage dedicated chip, industrial/vehicle gauge level sensor interface chip;

Industrial Supporting Services: Industrial policy promotion, industrial funds, industrial park carriers, industry university research innovation achievements, product testing and certification, intellectual property rights, and comprehensive industry supporting services.

8Components Zone

Vehicle grade/industrial grade resistors, capacitors, potentiometers, power semiconductor discrete devices, high-end specialized connectors, heat sinks, electromechanical components; Electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, industrial/automotive grade sensors, dedicated power supplies, switches, micro motors, electronic transformers, relays; High end printed circuit boards (HDI/high-frequency/automotive grade PCBs), various specialized circuits, piezoelectric, crystalline, quartz, ceramic magnetic materials; Printed circuit substrates, specialized materials for electronic functional processes, electronic adhesive (tape) products, electronic chemical materials and components; High end specialized supporting components and materials such as microwave components, communication equipment microwave materials, microwave RF detection instruments, industry-specific software, and electronic tubes.

• Contact:Liu Jiao
• Mobile:13257086620
• E-mail:243163251@qq.com
• Address:3899 Jinxiu Avenue, Baohe District, Hefei City

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