The 23rd China International Semiconductor Expo 2026

Date: November 12-14, 2026 Location: Beijing National Convention Center

Organizational structure:

Hosted by: China Electronics Information Industry Development Research Institute, China Semiconductor Industry Association

Organizer: Beijing CCID Publishing Media Co., Ltd

Co organizers: China Electronics Standardization Technology Association, China Gas Exhibitors Alliance, China Electronic Materials Industry Association, China Semiconductor Industry Association Integrated Circuit Design Branch, China Semiconductor Industry Association Integrated Circuit Branch, China Semiconductor Industry Association Packaging Branch, China Semiconductor Industry Association Discrete Devices Branch, China Semiconductor Industry Association Supporting Industry Branch, China Semiconductor Industry Association MEMS Branch, Beijing Semiconductor Industry Association, Shanghai Integrated Circuit Industry Association, Tianjin Integrated Circuit Industry Association, Chongqing Semiconductor Industry Association, Shaanxi Semiconductor Industry Association, Jiangsu Semiconductor Industry Association, Zhejiang Semiconductor Industry Association, Hubei Semiconductor Industry Association, Guangdong Integrated Circuit Industry Association, Anhui Semiconductor Industry Association, Zhuhai Semiconductor Industry Association, Shenzhen Semiconductor Industry Association, Xiamen Integrated Circuit Industry Association, Dalian Semiconductor Industry Association, Nanjing Integrated Circuit Industry Association, Hefei Semiconductor Industry Association, Suzhou Integrated Circuit Industry Association, Wuxi Semiconductor Industry Association, Guangzhou Semiconductor Association, Liaoning Semiconductor Industry Association, Chengdu Integrated Circuit Industry Association China Machine Tool Industry Association, Shandong Semiconductor Chamber of Commerce, Hebei Semiconductor Industry Alliance

Overseas co organizers: American Semiconductor Industry Association, European Semiconductor Industry Association, Japanese Semiconductor Industry Association, Korean Semiconductor Industry Association, Malaysian Semiconductor Industry Association

Exhibition advantages:

From 2003 to 2025, IC China served as a platform for showcasing, exchanging and cooperating with the achievements of China's semiconductor industry, and integrating the ecosystem. It witnessed significant changes in China's semiconductor industry's technological self-reliance and breakthroughs in cutting-edge technologies, effectively promoting the vigorous development of China's semiconductor industry. Nowadays, the China International Semiconductor Expo has forged six core advantages through persistent exploration.

1. Panoramic display of the entire industry chain. Covering the entire chain of semiconductor materials, design, equipment, manufacturing, packaging and testing, and terminal applications, we aim to create a one-stop industry exhibition and communication platform that integrates display, exchange, and cooperation, fully presenting the latest technologies and achievements in the global semiconductor industry.

2. Deep integration of international resources. Relying on the resources of the World Semiconductor Council (WSC) and overseas associations, we gather high-quality exhibition groups from Brazil, Southeast Asia, South Korea and other parts of the world, build international industrial exchange bridges, and promote international industrial cooperation and resource docking.

3. Implementation of cutting-edge application scenarios. Focusing on popular fields such as AI computing power, vehicle to chip connectivity, embodied intelligence, commercial aerospace, and new energy storage, we will create an immersive themed exhibition area to achieve deep integration of semiconductor technology and terminal applications, showcasing the practical value of technology implementation and application.

4. Multi dimensional collaboration between production, finance, teaching and research. Integrating exhibition displays, technology forums, supply and demand docking, capital docking, industry education integration and other diverse activities, connecting the four core links of industry, finance, education, and scientific research, and building a comprehensive semiconductor industry ecosystem.

5. Launch site for new product technology. Create an exclusive new product launch platform for exhibitions, concentrate on releasing cutting-edge technologies and innovative products in the industry, help enterprises enhance brand influence, establish industry technology development benchmarks, and lead industry development trends.

6. Accurate and efficient matching of supply and demand. Build an integrated online and offline supply and demand docking system, set up exclusive communication spaces such as one-on-one negotiation areas and special promotion events, achieve precise matching of upstream and downstream enterprises in the industrial chain, and promote project cooperation and resource integration.

Exhibition Introduction:

The pace of independent innovation in China's semiconductor industry is accelerating, achieving technological breakthroughs in core areas such as design, manufacturing, and packaging testing. The supporting capabilities of the industry chain continue to improve, and it occupies an important place in the global industrial chain pattern. The China International Semiconductor Expo (IC China) has been successfully held for 22 consecutive sessions since 2003, and is the most authoritative and professional landmark event in China's semiconductor industry.

IC China 2026 focuses on panoramic chain display, terminal application empowerment, and leading enterprise driving, with a focus on integrated circuit equipment, materials EDA&IP、 The latest technologies and achievements in the entire industry chain, including design, manufacturing, packaging, testing, and application, are committed to creating a high-end industrial cooperation platform that integrates exhibition display, business negotiation, technology exchange, capital docking, and policy interpretation. It promotes precise collaborative innovation in the upstream and downstream of the industry chain, helps China's semiconductor industry achieve high-quality development, and contributes to maintaining the stability and smoothness of the global integrated circuit industry chain and supply chain with Chinese strength.

Exhibition Area Planning:

The exhibition covers an area of 50000 square meters and includes eight exhibition areas

（1） The industrial chain exhibition area is divided into five zones: semiconductor materials, design, equipment, manufacturing, and packaging and testing, comprehensively showcasing innovative products, cutting-edge technology equipment, and the overall strength image of enterprises in the upstream and downstream of the semiconductor industry chain. Gather global industrial resources, showcase the division of labor and cooperation in the global integrated circuit system, promote the gathering, collaboration, innovation, and exchange of industrial and supply chain resource elements, and maintain the stability and innovation of the global integrated circuit industry and supply chain.

（2） The collaborative service exhibition area focuses on the supporting service system of the semiconductor industry, showcasing the charm of the semiconductor supporting service industry such as green and intelligent construction, factory construction, warehousing and transportation, testing, cleanliness, pumps and valves, industrial investment, legal aid, intellectual property services, logistics support, etc., improving the industrial supporting system, promoting industrial cooperation and resource integration.

（3） The component exhibition area showcases semiconductor basic components such as circuit components, connection components, electromechanical components, sensing components, functional material components, optical communication devices, quantum devices, artificial intelligence devices, etc., creating a platform for showcasing and connecting the basic component industry.

（4） The local characteristic exhibition group and the local branch of the Semiconductor Association jointly organize relevant exhibition areas, showcasing the development achievements, leading enterprises, characteristic technologies, and industrial plans of the semiconductor industry in various regions, reflecting the characteristics and highlights of the local semiconductor industry, and promoting the coordinated development of regional industries and resource sharing.

（5） The overseas exhibition group fully relies on the resources of the World Semiconductor Council (WSC) member units, actively integrates the strength of semiconductor industry associations in Brazil, Southeast Asia, and South Korea, invites semiconductor core enterprises from their respective regions to participate in the exhibition, showcases advanced overseas technologies and products, and promotes deep exchanges and international cooperation in the semiconductor industry between China and foreign countries.

（6） The industry education integration exhibition area collaborates with relevant universities and research institutes at home and abroad to showcase the innovative talent training mechanism, school enterprise cooperation achievements, scientific research and technology achievements, and achievements transformation practices in the integrated circuit industry; On site release of industry talent demand information, conduct on-site recruitment activities for enterprises, school enterprise docking and negotiation, and build a bridge for industrial talent cultivation and transportation.

（7） The AI innovation application exhibition area focuses on large models, generative AI, intelligent computing, edge computing and other fields, displays AI special chips, AI computing solutions, AI chip application scenarios, and creates an innovation exhibition platform integrating semiconductor technology and artificial intelligence.

（8） The automotive chip exhibition area showcases automotive grade MCU, power semiconductors, sensors, vehicle RF chips and other automotive chip products, as well as supporting technologies and services such as automotive chip design, testing, certification, etc., promoting the localization and international cooperation of the automotive chip industry.

Important activities (proposed):

● Opening Ceremony and 8th Global IC Entrepreneur Conference

Microelectronics Intelligence China Conference

China Semiconductor Packaging and Testing Technology and Development Forum

Artificial Intelligence and Large Model Forum

Collaborative Innovation and Matchmaking Conference on Integrated Circuit Silicon Materials Industry Chain

Semiconductor Equipment and Materials Innovation and Development Forum

New Energy Storage Chip Technology Application Forum

Theme activity:

Brazil Southeast Asia Semiconductor Industry Cooperation Forum

Korea Semiconductor Industry Cooperation Forum

China Xinchuang Chip Industry Development Forum

Automotive Core Interconnection Industry Collaboration Forum

Please communicate and contact us in a timely manner to obtain the latest exhibition information

Contact information for the organizing committee of the 23rd China International Semiconductor Expo in 2026:

Contact: Mr. Zhao 150 000 33892 (same as WeChat)

• Telephone:150 000 33892
• Contact:Mr. Zhao
• Mobile:150 000 33892
• Address:Beijing Chaoyang District Beichen Road Olympic Park

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