SEMICON VIETNAM 2026 is the first professional exhibition project in the semiconductor field held by the Vietnamese government. It is guided and hosted by units such as the Ho Chi Minh City High tech Development Zone Management Committee,? Integrating product display, trading, high-level forums, trade docking, project investment attraction, and cooperation and exchange, with a focus on showcasing advanced technologies and products such as semiconductors, circuit boards, optoelectronics, as well as their production equipment, key components, and materials. As an annual international event supported and nurtured by Vietnam, it has attracted numerous domestic and foreign brands to participate in the exhibition. The positioning and radiation of the exhibition will quickly build the integration of the semiconductor and optoelectronic industry chains and supply chain docking through the siphon effect, efficiently connecting investment, trade and supply and demand sides, and building an efficient trade promotion and investment bridge for international technology suppliers, brand merchants, project investors and industrial capital to enter the Vietnamese semiconductor market. It is one of the best platforms for enterprises to quickly build a Vietnamese market network and cooperation channels.

The last exhibition attracted nearly 100 Vietnamese local enterprises and enterprises from China, Taiwan, South Korea, Germany, the United States and other countries and regions to sign up for the exhibition, with an exhibition scale of about 7000 square meters. It intensively displayed various advanced semiconductor materials, wafer manufacturing and packaging, integrated circuit manufacturing technology, semiconductor accessories and software, cleaning and edging materials and equipment, semiconductor manufacturing equipment and instruments, and became the leader in seizing the high-tech market in Southeast Asia through this exhibition platform!

During the exhibition, the organizers organized a series of business supporting activities, including the "Vietnam Semiconductor and Optoelectronic Industry Supply Chain International Cooperation Fair", "Semiconductor, Chip and Optoelectronic Industry Technology Demonstration Zone", "Seminar on Surface Active Agent Technology for Wafer Cutting, Laser slotting and Packaging", professional buyer B2B matching, high-tech park factories and other activities to interact with each other. Representatives from various countries conducted in-depth analysis and discussions on the development space of the semiconductor and optoelectronic industry market, and reached a consensus on the necessity of cross-border high-tech interconnection.

>>Wafer Manufacturing and Semiconductor Packaging Testing Technology

Wafer manufacturing, SiP packaging, silicon wafers and IC packaging carriers, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and packaging testing, etc PCB、EDA、MCU、IC、 Printed circuit boards, packaging substrates, etc; Testing probe station, probe card, testing machine, sorting machine, packaging equipment, packaging substrate, lead frame bonding wire, lead bonding, soldering testing, laser cutting, grinding fluid, sealing film (adhesive) high-temperature tape, laminated substrate, patch adhesive, feeding board, solder wire flow control and other packaging and testing supporting technologies.

>>Semiconductor and Integrated Circuit Manufacturing Technology

Wafer manufacturing/foundry, analog integrated circuits, mixed signal integrated circuits; Related microprocessors, memory FPGA、 Discrete devices, optoelectronic devices, power devices, sensor devices and other technical devices, as well as integrated circuit terminal products; Packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, surface mount machine, single crystal furnace, oxidation furnace, grinding machine, lithography machine, etching machine, polishing machine, ion implantation equipment, CVD/PVD equipment, coating/developing machine, reflow soldering, wave soldering, probe station, clean room equipment, etc.

>>Third generation semiconductors and cutting-edge innovative applications

Third generation semiconductor materials such as silicon carbide (SiC), gallium nitride (GaN), wafers, substrates, packaging, testing, optoelectronic devices (LED, laser LD, detector UV), power electronic devices (diode, MOSFET, JFET, BJT, IGBT, GTO, ETO, SBD, etc.), microwave frequency devices (HEMT, MMIC), etc; Cutting edge innovative applications include AI chips, display chips, driver chips, power management chips, electrical chips, sensor chips, IoT chips, communication chips, transportation electronics chips, computer and control chips, memory chips, 5G chips, automotive grade chips, audio and video processing chips, and more.

>>Semiconductor materials, ICs, and electronic components

Silicon wafers and silicon-based materials, silicon wafers, silicon wafers, monocrystalline silicon, silicon wafers, germanium silicon materials, S01 materials, silicon materials and compound semiconductor materials for solar cells, quartz products, graphite products, anti-static materials, photoresist and its supporting reagents, wafer tapes, photomasks, electronic gases, special chemical gases, CMP polishing materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, packaging materials, etc; IC and related electronic product design, IC product and application technology, IC testing methods and instruments, digital circuit and integrated circuit layout design, analog and mixed signal circuit design and other IC design fields; Resistors, capacitors, potentiometers, electronic tubes, heat sinks, sensors, connectors, discrete components/IGBTs, optoelectronic devices, electroacoustic devices, laser devices, electronic display devices, power switches, micro motors, electronic transformers, passive components, storage devices, motor fans, diodes, transistors and other electronic components.

• Company:Guangzhou Lizhiying Exhibition Service Co., Ltd
• Telephone:13763320311
• Contact:Xu Zhilong
• Mobile:13763320311
• E-mail:gzxuzhilong_88@163.com
• Address:425 Dongrui Building, Chebei East Bank, Tianhe District, Guangzhou City

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870