Exhibition Name: 2026 China (Shanghai) International Semiconductor Industry Exhibition

Exhibition TimeJune 3-5, 2026

Forum Time:June 3-4, 2026

Exhibition location:Shanghai New International Expo Center

Exhibition Introduction

As an authoritative and specialized semiconductor industry brand event in East China and even across the country, the 2026 Shanghai International Semiconductor Industry Exhibition will be held from June 3-5, 2026 at the Shanghai New International Expo Center. This exhibition focuses on integrating innovative products, technologies, solutions, and business cooperation models in the semiconductor industry, providing a one-stop solution platform for semiconductor enterprise brand promotion, product display, and exchange and cooperation, helping enterprises achieve communication and interoperability throughout the entire industry chain. As a semiconductor industry brand event that combines scale and influence, the exhibition follows market development trends and provides an opportunity for the domestic and international semiconductor industry to enhance brand awareness and expand markets. Give full play to its role as a window for transmitting market information and exchanging advanced technologies, and identify the direction of industry development. Sharing an international platform and expanding the semiconductor market together, let's work hand in hand to create business opportunities.

We sincerely treat every customer who consults about the exhibition, ensuring one-on-one customer communication, accurate pricing, clear introductions, and allowing every exhibitor to truly experience our full service before and after the exhibition on our website

Please contact the exhibition organizer for participation: 16621383379

Shanghai Zhongzhan Shixin Exhibition Group

Exhibition Scope

Wafer Manufacturing Exhibition Area: Wafer Processing Equipment and Plant Equipment | Wafer Processing Materials | Subsystems, Components, and Indirect Consumables | Foundry, IDM, and Design Companies

Packaging and Testing Exhibition Area: Testing Packaging Equipment | Testing Packaging Materials | Subsystem, Component, and Indirect Consumables Packaging and Testing Factory (OSAT)

Compound Semiconductor Exhibition Area: Silicon Carbide (SiC) | Gallium Nitride (GaN) | Gallium Arsenide (GaAs) Materials | Radio Frequency (RF) | High Power Semiconductors | New Energy Power Devices

Parts Exhibition Area: Process Components | Structural Components | Modules | Gas Pipelines | RF Power Sources | Optics | Vacuum Systems | Sensors, Instruments and Meters, etc

EDA/IP and Design Services Exhibition Area: Electronic Design Automation (EDA) Software and Services | Process Control/Process Software | Chip Design IP and Services | Chiplet Design and Consulting Services | 2.5D/3D Advanced Packaging Design and Consulting Services | AI and Cloud Design Platforms and Services | Other Design Services

Automotive Semiconductor Exhibition Area: IGBT, Silicon Carbide, Gallium Nitride and other automotive grade power semiconductors | Automotive grade MCUs, ECUs and domain controllers | Intelligent cockpit/ADAS/autonomous driving chips and systems | Automotive grade memory and high-performance computing chips (AI/GPU/CPU) | Automotive safety and vehicle networking chips, modules and systems

• Contact:16621383379
• Mobile:16621383379
• Address:No. 2345 Longyang Road, Pudong New Area, Shanghai

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870