2026 Shenzhen International Electronic Microwave Ceramic Packaging Shell Industry Exhibition

Time: June 10-12, 2026

Location: Shenzhen International Convention and Exhibition Center

Exhibition Overview

With the rapid development of 5G/6G communication, Internet of Things, artificial intelligence, satellite communication, aerospace, high-performance computing and other technologies, microwave RF devices are upgrading towards high frequency, miniaturization, and high reliability. Microwave dielectric ceramics, as the core basic material, directly determine the signal transmission, power consumption, and integration of devices; Ceramic packaging has become a key solution for high-power microwave devices due to its advantages of high thermal conductivity, high-frequency stability, and high airtightness.

Ceramic packaging uses aluminum oxide, aluminum nitride and other core materials to provide chips with a long-term stable working environment that isolates external water vapor and pollution. It has excellent electrical insulation, high mechanical strength, chemical stability and other characteristics, and is widely used in high-end fields such as aerospace, military, medical, 5G base stations, and new energy vehicles. The main packaging forms include CDIP, CQFP, CLCC, LTCC, HTCC, etc. The key processes include chip mounting, wire bonding, parallel seam welding, air tightness leak detection, etc.

Microwave dielectric ceramics (MWDC) work in the UHF and SHF microwave frequency bands, with characteristics such as high dielectric constant, low dielectric loss, and small resonant frequency temperature coefficient. They are widely used in mobile communication, satellite communication, navigation, radar, automotive electronics, and other fields. They are key materials for core components of base stations such as dielectric filters, resonators, and duplexers.

To promote collaborative innovation in the upstream and downstream of the ceramic packaging and microwave ceramic industry chain, this exhibition focuses on innovative materials, advanced processes, and cutting-edge applications, and builds a platform for technical exchange, business docking, and achievement display to explore the future trends of the industry together.

Exhibition Scope

-Ceramic packaging, ceramic tube shell, ceramic substrate LTCC/HTCC、 Thin film/thick film substrate

-Electronic ceramic materials such as alumina, aluminum nitride, silicon nitride, beryllium oxide, glass powder, etc

-Metal paste, solder, Kovar alloy, heat sink, copper foil, electroplating solution, additives and other supporting materials

-Powder equipment, casting machine, printing machine, laminating/laminating equipment, sintering furnace, brazing furnace, electroplating equipment

-SMT machine, wire bonding machine, capping machine, parallel seam welding machine, cutting/drilling/laser equipment

-Air tightness leak detector X-RAY、AOI、 Ultrasonic scanning, film thickness testing, reliability testing equipment

-Solutions for universities, research institutes, testing institutions, and industries

Exhibition Procedures

1. Fill out the "Exhibition Application Form", stamp it with the official seal, and scan or fax it to the organizing committee

2. Complete the payment of exhibition fees within 3 working days after applying for a booth

3. Booth rules: apply first, pay first, arrange first

After receiving the application form and fees, the organizing committee will send out invoices and the "Exhibition Handbook" in a unified manner

Exhibitors voluntarily register and will not be allowed to withdraw midway. The fees already paid will not be refunded.

contact information

Contact: Xu Jie

Phone: 13636349782

WeChat: xj549296991

• Telephone:13636349782
• Contact:Xu Jie
• Mobile:13636349782
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

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