Exhibition Introduction:

The 2026 Shenzhen International Advanced Surface Mount Technology Exhibition (SMT Shenzhen 2026) is scheduled to be held at the Shenzhen International Convention and Exhibition Center from October 27-29, 2026. It is a highly authoritative professional event in the field of Asian electronic manufacturing, with the core theme of "Smart Connected Future · SMT Empowerment", focusing on the innovative development of the entire SMT industry chain, and creating a high-end industry service platform that integrates technology display, business docking, and trend analysis. Relying on Shenzhen's location advantage as the core hub of the global electronic information industry, the exhibition deeply links electronic manufacturing resources in South China and even the world, helping enterprises seize market opportunities brought by 5G communication, new energy vehicles, medical electronics and other fields, and promoting the industry's transformation towards intelligence, precision and green.

As the annual event of the SMT industry, the 2026 Shenzhen International Advanced Surface Mount Technology Exhibition will continue to uphold the exhibition concept of "internationalization, specialization, and marketization", with an expected exhibition area of over 50000 square meters, gathering more than 600 industry leaders from around the world to participate, attracting more than 60000 professional buyers and technical decision-makers from consumer electronics, automotive electronics, communication equipment, medical equipment, industrial automation and other fields, and building an efficient and accurate supply and demand docking ecosystem. We cordially invite global SMT equipment, materials, testing technology and related enterprises to gather in Shenzhen, attend industry events together, share development opportunities, and jointly draw a new blueprint for high-quality development of electronic manufacturing!

Display scope:

SMT core equipment area: high-speed surface mount machine, multifunctional surface mount machine, printing machine, reflow soldering furnace, wave soldering furnace, SPI/AOI testing equipment, dispensing machine, repair equipment, etc;

Semiconductor packaging technology area: wafer level packaging, system level packaging, flip chip technology, bonding equipment, packaging materials, etc

Electronic manufacturing automation area: robots, automated production lines, loading and unloading machines, transfer machines, logistics conveying systems, etc

Components and Materials Area: SMD components, connectors, solder, solder paste, flux, PCB substrates, electronic adhesives, etc

Testing and measurement technology area: ICT testing equipment, FCT functional testing system, X-ray detection equipment, environmental testing equipment, etc

Intelligent Manufacturing Solution Area: MES System, Industrial Software, Digital Twin, AI Visual Inspection, Industrial Internet of Things (IIoT), etc

3、 Core values of the exhibition

Business docking: Deeply communicate with over 5000 top purchasers in the fields of automotive electronics, communication equipment, consumer electronics, new energy, medical electronics, etc., and accurately match supply and demand;

Technological Frontiers: Focused on showcasing global leading technologies such as micro component mounting, high-precision ball placement, and heterogeneous integrated packaging, we plan ahead for the next generation of electronic manufacturing trends. Insight: Over 30 industry summit forums focused on the four hot topics of AIoT, automotive electronics, advanced packaging, and green manufacturing, and released annual industry white papers;

International Expansion: Attracting international buyer groups from over 20 countries and regions including Southeast Asia, the Middle East, Japan, and South Korea, helping enterprises expand into global markets

Integration of industry, academia and research: Connecting with more than 20 research institutes of universities such as Tsinghua University and University of Electronic Science and Technology of China, promoting the transformation of technological achievements and joint research and development

4、 Audience group (precise invitation)

Electronic manufacturing enterprises: Production Director, Procurement Manager, R&D Engineer, Process Engineer

Automotive electronics companies: Technical leaders in the fields of new energy vehicles, intelligent driving, and connected vehicles

Communication and consumer electronics enterprises: manufacturers of 5G devices, smartphones, and smart homes

Semiconductor and packaging companies: chip design, manufacturing, packaging and testing executives

Research institutions and universities: Professors and researchers in the field of electronic engineering

Cross border e-commerce and traders: international electronic component purchasers

• Company:Lijia Exhibition (Shanghai) Co., Ltd
• Contact:Mr. Lu
• Mobile:13818219172
• E-mail:3087083730@qq.com
• Address:Shenzhen

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