2026 Shenzhen International AI Computing and Data Center Liquid Cooling Exhibition

Exhibition location: Shenzhen International Convention and Exhibition Center

Exhibition time: October 27-29, 2026

Host: Shenzhen Electronic Chamber of Commerce Reed Exhibition Group

With the rapid iteration of artificial intelligence, big data, and cloud computing industries, AI computing infrastructure is experiencing explosive growth, and traditional heat dissipation models are no longer suitable for the operational needs of high-density, high-energy consumption computing devices. Liquid cooling technology, as the core solution for computing power dissipation, energy conservation and carbon reduction, and data center upgrading, has become the core track for the green and efficient development of digital infrastructure. The market scale continues to expand, and the pace of industrial integration continues to accelerate.

The exhibition gathers upstream and downstream enterprises in the entire industry chain, including liquid cooling equipment, computing hardware, heat dissipation materials, data center infrastructure, and computing services, covering a diverse group of manufacturers, integrators, purchasers, research institutes, investment institutions, and more. Breaking down industry information barriers, achieving precise matching of technology, products, orders, and resources, significantly reducing the cost of market expansion, business docking, and channel building for enterprises, and quickly completing customer reserves and market layout.

In order to deepen the development of the liquid cooling industry, break down the barriers between the upstream and downstream industry chains of AI computing power, build a one-stop industry platform for technology exchange, product display, business docking, and resource integration, and help enterprises accurately grasp new trends in the industry and seize new opportunities in the market, the 2026 Shenzhen International Liquid Cooling Industry and AI Computing Power Exhibition will be held with great weight, gathering high-quality resources from the entire industry chain of global liquid cooling technology, computing power equipment, heat dissipation materials, data center supporting facilities, AI computing power infrastructure, etc., to create a highly influential event in the domestic liquid cooling and AI computing power industry.

Exhibition scope:

AI computing infrastructure exhibition area: covering various AI computing chips, training and inference chips such as GPU, CPU, DPU, NPU, FPGA, etc; High density AI server, liquid cooling server GPU computing power cluster, supercomputing and intelligent computing center equipment, edge computing machine; High speed distributed storage, NVMe dedicated storage, data disaster recovery and backup system; 800G/1.6T high-speed optical module, switch, computing power network transmission equipment; Computing power scheduling platform, computing power virtualization system, computing power security protection, AI industry customized computing power solutions, etc

Exhibition Area for Full Series Liquid Cooling Technology and Core Equipment: Cold Plate Liquid Cooling System: Server Cold Plate, CDU Cooling Distribution Unit, Cabinet Level Liquid Cooling Heat Dissipation System, Pipeline Components; Immersion liquid cooling system: single-phase/two-phase immersion equipment, fully immersed cabinet, high-density computing power cluster liquid cooling solution; Spray type and pipeline type new liquid cooling equipment; Special insulation coolant for liquid cooling, thermal conductive medium, anti-corrosion and noise reduction supporting products; Core components such as liquid cooling water pump, valve group, quick connector, temperature control sensor, etc.

Green Data Center Infrastructure Exhibition Area: Modular Data Center, Micro Module Machine Room, Intelligent Cabinet System; Precision air conditioning, fresh air energy-saving cooling, evaporative cooling, and waste heat recovery equipment; UPS power supply, precision distribution cabinet PDU、 Energy storage power supply, busbar system and other power distribution equipment; Data center energy-saving control system, intelligent temperature control energy consumption monitoring, environmental monitoring system; Data center fire and security, cabling system, and operation and maintenance management solutions

The exhibition area for computing power applications and industrial services includes artificial intelligence industry computing power application solutions, cloud computing, and edge computing services; Low carbon and energy-saving transformation of data centers, green carbon reduction solutions; Planning and construction of computing power industrial parks, data centers, and outsourcing of operation and maintenance services; Industry associations, research institutions, testing and certification, media information and other supporting services.

Accurate integration across the entire chain, reducing costs and increasing efficiency to expand channels

The exhibition has landed in the core highland of the digital economy in the Guangdong Hong Kong Macao Greater Bay Area, with a dense cluster of AI technology, cloud computing, data centers, and high-end manufacturing industries in the region. The industrial chain is well-equipped and the terminal demand is strong. Relying on Shenzhen's industrial radiation ability, it can efficiently connect with high-quality customers in South China, the country and even overseas, help enterprises break through regional market barriers, and rapidly expand high-quality customer sources such as government enterprises, operators, Internet giants, and computing parks.

Authoritative industry empowerment, shaping brand core competitiveness. The exhibition will simultaneously hold high-end industry forums, technology achievement release conferences, policy interpretation meetings, supply and demand docking meetings, and other heavyweight supporting activities, gathering industry academicians and experts, leading enterprise executives, and industry authorities. Exhibitors can showcase cutting-edge technologies, release new product solutions, participate in industry exchanges, gain in-depth insights into 2026 industrial policies, technology trends, and market trends, enhance their industry awareness and brand influence, and seize the high ground of industry technology and brand.

The landing of technological achievements will help promote industrial upgrading and transformation. Focusing on core pain points such as high energy consumption, difficult heat dissipation, and PUE control, we will showcase innovative solutions such as efficient liquid cooling, low-carbon energy conservation, and intelligent computing scheduling, accelerating the industrialization of advanced technological achievements. Assist in the green transformation of traditional data centers, improve the quality and efficiency of computing power enterprises, promote the deep integration of liquid cooling technology with AI computing power, new energy, and high-end manufacturing, and empower enterprises to transform, upgrade, and innovate.

3、 Exhibition fees

（1） Standard booth: 15000 yuan/9m2 (including basic configuration and tax)

（2） Open space booth: 1500 yuan/m2 (minimum order of 36m2, excluding construction and tax) and above fees do not include booth decoration fees, electricity fees, management fees, etc.

Please inquire for more information on the exhibition details and the latest booth map

Contact: Yi Lin

Phone/Tel: 182 1090 8343

Please contact the exhibition organizer before participating in the exhibition to confirm.

• Telephone:18210908343
• Contact:Yi Lin
• Mobile:18210908343
• E-mail:1992129382@qq.com
• Address:No.1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen

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