2026 Shenzhen International Semiconductor and Integrated Circuit Industry Exhibition

Exhibition time: April 9-11, 2026

Exhibition location: Futian Convention and Exhibition Center, Shenzhen

Introduction:

Chinese semiconductor integrated circuits will follow the trend and rise against it

During the 14th Five Year Plan period, China's semiconductor industry will have more comprehensive development and accelerate breakthroughs and applications in key core technologies such as high-end chip design. With China's massive investment in technologies such as 5G, AI, IoT, cloud computing, and big data, "new infrastructure" represented by 5G networks, industrial Internet of Things, etc. will drive the high-speed growth of the semiconductor industry. It is predicted that by 2030, the semiconductor market supply in China will reach 538.5 billion US dollars, still the largest in the world. 69% of the consumption will come from local Chinese companies, and the demand will mainly come from application fields such as data centers, consumer electronics, automobiles, and medicine.

Shenzhen enhances the independent innovation capability of the semiconductor integrated circuit industry and strives to build a complete industrial ecosystem

During the 14th Five Year Plan period, Shenzhen will enhance its independent innovation capabilities in the semiconductor integrated circuit industry, strive to create a complete industrial ecosystem, strengthen forward-looking and disruptive technology research and development layout, build an innovation platform system mainly supported by the Shenzhen Integrated Circuit R&D Center, and focus on the layout of major productive forces. It will accelerate the construction and early production of major projects such as advanced and characteristic process production lines, accelerate breakthroughs in key links of the industrial chain such as high-end chip design, key devices, core equipment materials, EDA design tools, etc., strengthen cooperation in the Greater Bay Area industrial chain, gradually form a comprehensive integrated circuit industry cluster, and drive the accelerated development of the national integrated circuit industry.

The China International Semiconductor Integrated Circuit Industry Expo is about to be held

With the digital transformation and commercialization of 5G, the development of intelligent terminals, autonomous driving, artificial intelligence, and the Internet of Things will become faster and faster, and the types and specifications of chips will also increase. For integrated circuit design companies, they not only face the challenges of accelerated product iteration and evolving customer demands, but also the impact of the global pandemic and international situation, as well as the "supply chain" crisis caused by huge demand fluctuations and further lengthening of manufacturing cycles.

Last year's Central Economic Work Conference clearly pointed out the need to enhance the independent and controllable capabilities of industrial and supply chains, and the development plans for integrated circuits also require comprehensive improvement and change of the industrial ecology. From enterprises to enterprises, especially the rising Chinese integrated circuit design industry, we must actively respond and turn crisis into opportunity. To this end, the 2026 China International Semiconductor Integrated Circuit Industry and Application Expo will focus on design and application, starting from supply and demand matching, integrating supply chain and distribution procurement functions, creating a platform for communication for enterprises, and promoting the development of the semiconductor industry.

Exhibition scope:

Semiconductor Integrated Circuit Design and Products

The 14th Five Year Plan emphasizes the need to accelerate breakthroughs and applications in key core technologies such as high-end chips, as well as breakthroughs in integrated circuit design tools, advanced integrated circuit processes, and characteristic processes such as IGBT, MEMS, MCU, CPU, embedded, and storage. Upgrades to advanced storage technologies and the development of wide bandgap semiconductors such as silicon carbide and gallium nitride have all created vast space for innovation in integrated circuit design and product innovation.

IC Design/Chips and Applications

IC and related electronic product design, EDA, AI computing power chips, storage chips, automotive chips, smart home appliance chips, artificial intelligence chips, IoT, artificial intelligence, automotive electronics, smart cities, intelligent terminals, health and medical products, etc;

IC manufacturing

Semiconductor wafer manufacturing, semiconductor packaging and testing technology and products;

advanced packaging

Design, materials, testing, equipment, etc. for flip chip, bump, wafer level packaging, 2.5D/3D advanced packaging (TSV and TGV), fanout wafer level packaging, etc;

semiconductor equipment

Wafer equipment/packaging and testing equipment: various precision equipment and semiconductor packaging equipment, semiconductor testing equipment, IC testing instruments, advanced packaging technology (such as SiP, 3D packaging) equipment, power device equipment, etc. required in the wafer processing process;

Compound semiconductors and power devices

Compound semiconductor materials (such as GaN, SiC, etc.) and their related products, including power devices, RF devices, upstream equipment, materials, etc;

semiconductor material

Monocrystalline silicon, silicon wafers and silicon-based materials, polishing pads, masks, sputtering targets, polishing solutions, etching solutions, ceramic packaging materials, bonding wires, lead frames, packaging substrates, photoresists, thin film deposition materials, special gases, ultrapure water, plastic packaging materials, high-performance plastics, etc;

Semiconductor core components

Machine vision, sensors, seals, precision bearings, metal components, Valve valves, silicon/SiC parts Robots、 Quartz components, filters, RF power supplies, ceramic components, ESC electrostatic suction cups, pressure gauges, pumps, MFC flow meters, stepper motors, motion control, servo motors, linear modules, dust-free drag chains, packaging molds, refrigeration equipment, induction heaters, etc;

AI computing power

AI chips, servers, switches, power supplies, liquid cooled temperature control, etc;

2026 Shenzhen International Semiconductor and Integrated Circuit Industry Exhibition Organizing Committee

Contact person: Mr. Xu 13636349782 (same WeChat account)

Semiconductor Integrated Circuit Design and Products

The 14th Five Year Plan emphasizes the need to accelerate breakthroughs and applications in key core technologies such as high-end chips, as well as breakthroughs in integrated circuit design tools, advanced integrated circuit processes, and characteristic processes such as IGBT, MEMS, MCU, CPU, embedded, and storage. Upgrades to advanced storage technologies and the development of wide bandgap semiconductors such as silicon carbide and gallium nitride have all created vast space for innovation in integrated circuit design and product innovation.

IC Design/Chips and Applications

IC and related electronic product design, EDA, AI computing power chips, storage chips, automotive chips, smart home appliance chips, artificial intelligence chips, IoT, artificial intelligence, automotive electronics, smart cities, intelligent terminals, health and medical products, etc;

IC manufacturing

Semiconductor wafer manufacturing, semiconductor packaging and testing technology and products;

advanced packaging

Design, materials, testing, equipment, etc. for flip chip, bump, wafer level packaging, 2.5D/3D advanced packaging (TSV and TGV), fanout wafer level packaging, etc;

semiconductor equipment

Wafer equipment/packaging and testing equipment: various precision equipment and semiconductor packaging equipment, semiconductor testing equipment, IC testing instruments, advanced packaging technology (such as SiP, 3D packaging) equipment, power device equipment, etc. required in the wafer processing process;

Compound semiconductors and power devices

Compound semiconductor materials (such as GaN, SiC, etc.) and their related products, including power devices, RF devices, upstream equipment, materials, etc;

semiconductor material

Monocrystalline silicon, silicon wafers and silicon-based materials, polishing pads, masks, sputtering targets, polishing solutions, etching solutions, ceramic packaging materials, bonding wires, lead frames, packaging substrates, photoresists, thin film deposition materials, special gases, ultrapure water, plastic packaging materials, high-performance plastics, etc;

Semiconductor core components

Machine vision, sensors, seals, precision bearings, metal components, Valve valves, silicon/SiC parts Robots、 Quartz components, filters, RF power supplies, ceramic components, ESC electrostatic suction cups, pressure gauges, pumps, MFC flow meters, stepper motors, motion control, servo motors, linear modules, dust-free drag chains, packaging molds, refrigeration equipment, induction heaters, etc;

AI computing power

AI chips, servers, switches, power supplies, liquid cooled temperature control, etc;

• Company:2026 Shenzhen International Semiconductor and Integrated Circuit Industry Exhibition Organizing Committee
• Contact:Mr. Xu
• Mobile:13636349782
• Address:Intersection of Fuhua 3rd Road and Jintian Road, Futian District, Shenzhen, Guangdong Province

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870