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The review of domestic substitution achievements at the 2026 Hefei Electronics Exhibition focuses on the full chain innovation of "chip screen automotive integration"
Industry: Communications / Electronics
Cycle: Once a year
Time: 2026/05/22 - 05/24 (Fri To Sun Total 3 Days)    Error Correction
Address: Anhui Hefei Binhu International Convention and Exhibition Center ChinaAnhui ProvinceHefei CityBaohe District 3899 Jinxiu Avenue, Baohe District, Hefei City
Sponsor:Beijing Zhongwei International Exhibition Co., Ltd
Organizer:Zhongwei Exhibition
144Days To Go
  • Contact:Liu Jiao
  • Mobile:132527086620
  • Address:3899 Jinxiu Avenue, Baohe District, Hefei City

INTRODUCTION

The review of domestic substitution achievements at the 2026 Hefei Electronics Exhibition focuses on the full chain innovation of "chip screen automotive integration" - www.globalomp.com

The review of domestic substitution achievements at the 2026 Hefei Electronics Exhibition focuses on the full chain innovation of "chip screen automotive integration" - www.globalomp.com

The 2026 Hefei Electronics Show will take this "full chain advantage" to the extreme: Huada Jiutian's EDA tools will be deeply adapted with Haiguang Information's domestically produced DCU, improving chip simulation computing efficiency by more than 30% and breaking the bottleneck of "design tool computing power support" adaptation; 1200V SiC adaptive high-voltage connector, directly connected to the 800V fast charging needs of car companies such as Chery and BYD, matched with lightweight wiring harness and electromagnetic shielding materials, achieving dual upgrades of range and safety; PCB products with high number of layers and low dielectric materials support the computing power demand of AI servers such as Nvidia GB200, with a single GPU corresponding to a PCB value of up to $346.

During the exhibition, 150 precise supply and demand matching meetings will be held, inviting buyers such as Huawei and JD.com to set up a "specialized, refined, unique and new" enterprise zone, allowing innovative technologies such as Hesai Technology's automotive grade chips and Doubao mobile assistant ecosystem solutions to directly meet market demand. This model of "setting up exhibitions and industry performances" makes Hefei not only a window for technology display, but also a "super hub" for cooperation and implementation

The review of domestic substitution achievements at the 2026 Hefei Electronics Exhibition focuses on the full chain innovation of "chip screen automotive integration" - www.globalomp.com

Exhibition Scope

1. Electronic intelligent manufacturing: electronic devices and intelligent manufacturing, instruments and electronic tools, SMT technology and equipment, automotive electronics and consumer electronics assembly equipment, laser equipment, welding and dispensing technology, special-shaped plug-in equipment technology, AOI/ATE testing, burning equipment, ESD anti-static and purification equipment, etc.

2. Integrated circuits: microprocessors, logic ICs, memory, analog ICs, etc;

3. Semiconductor discrete devices: diodes, transistors, thyristors, etc;

4. Passive components: resistors, capacitors, inductors, power transformers, relays, electroacoustic devices, resonators, filters, quartz crystals, buttons, buzzers, speakers, PCBs, etc;

5. Connectors and cables/harnesses: various connectors, electronic wire plugs, sockets, switches, terminals, cable materials, wiring equipment, wires and cables, specialized mechanical equipment for wires and cables, etc;

6. Sensors and electronic components: new MEMS sensors, sensitive components, temperature sensors, gas sensors, displacement sensors, velocity sensors, photoelectric sensors, biochemical sensors, electroacoustic devices, component distribution, relays, micro nano systems, electromagnetic compatibility, power modules and power supply units, etc;

7. Electronic materials: semiconductor materials, optoelectronic materials, magnetic materials, electronic ceramics, crystal materials, thermal conductive materials, electromagnetic wave shielding materials, etc;

8. Semiconductor equipment and core components: semiconductor device equipment, material equipment, chip equipment, packaging manufacturing equipment and core components, integrated circuit equipment, solar cell chip equipment, LED equipment, third-generation semiconductor equipment, etc;

9. Testing and measurement: machine vision, electronic and communication instruments, electrical instruments and meters, environmental testing instruments and equipment, analytical instruments, certification testing, automation instruments and meters, etc;

10. New types of displays and intelligent terminals: OLED, AMOLED, Mini/MicroLED displays, in car displays, medical displays, educational displays, wearable displays VR displays, intelligent transportation displays and application terminal displays, flexible displays and materials and equipment, 3D glass, touch screen modules, AR/VR/MR devices, mobile phones/laptops/computers/smart bracelets, wearable devices, intelligent robots, audio-visual equipment, industry terminals, etc.

Exhibition Advantages

The unique advantage of Hefei Electronic Technology Exhibition lies in the "industry real-life" in-depth experience. Relying on the trillion level industrial cluster of "Chip Screen Device Integration" in Hefei, the exhibition can seamlessly connect the full chain resources from chip design, panel manufacturing to intelligent terminal assembly in the local area, allowing exhibitors to immerse themselves in the forefront trends of electronic technology and connect with the upstream and downstream industries of semiconductor, display, electronic components and other fields on site, achieving efficient transformation from information exchange to cooperation landing.

Choosing Hefei Electronic Technology Exhibition is to seize the entrance to the high ground of the electronics industry. This not only connects domestic and foreign electronic technology core enterprises, but also directly faces the innovative achievements and market demand in key fields such as automotive grade chips, flexible AMOLED, intelligent sensors, etc. Next, Hefei will focus on developing high-end chips, new displays, and intelligent terminals, with deepening technology cooperation with domestic and foreign enterprises as the engine, to achieve coordinated promotion of research and development, manufacturing, and application, accelerate the construction of a national electronic information industry cluster, and fully consolidate its position as the "IC Capital of China" and "New Energy Capital", providing a broader platform for industrial cooperation and development for participating enterprises.


audience

Electronic manufacturing: Senior management personnel such as chairman, general manager, and deputy general manager of manufacturing enterprises related to consumer electronics, home appliances, and smart terminals, as well as engineers, technicians, designers, etc. from supply chain management, procurement, technology, research and development, production manufacturing, product testing, and other departments.

Electronic components and supporting enterprises: personnel from semiconductor equipment, wafer/packaging manufacturers, IC design/chip manufacturers, semiconductor materials, semiconductor components, electronic components and other enterprises.

Distributors and retailers: domestic distributors/agents of household appliances and consumer electronics, import and export companies, cross-border e-commerce, retailers, etc.

Research institutes and universities: Researchers and faculty and students in electronic related fields.

Investment and financial institutions: personnel from investment companies, incubators, crowdfunding platforms, and other institutions.

Other related industries: enterprises and institutions involved in electronic technology applications in the military, aerospace, automotive, medical, industrial control, communication, transportation, energy and other industries.


Beijing Zhongwei International Exhibition Co., Ltd

ally be Person:Liu Jiaolady

electricityWords:13257086620(WeChat synchronization)

mailBox:243163521@

Scope

Exhibition Scope

1. Electronic intelligent manufacturing: electronic devices and intelligent manufacturing, instruments and electronic tools, SMT technology and equipment, automotive electronics and consumer electronics assembly equipment, laser equipment, welding and dispensing technology, special-shaped plug-in equipment technology, AOI/ATE testing, burning equipment, ESD anti-static and purification equipment, etc.

2. Integrated circuits: microprocessors, logic ICs, memory, analog ICs, etc;

3. Semiconductor discrete devices: diodes, transistors, thyristors, etc;

4. Passive components: resistors, capacitors, inductors, power transformers, relays, electroacoustic devices, resonators, filters, quartz crystals, buttons, buzzers, speakers, PCBs, etc;

5. Connectors and cables/harnesses: various connectors, electronic wire plugs, sockets, switches, terminals, cable materials, wiring equipment, wires and cables, specialized mechanical equipment for wires and cables, etc;

6. Sensors and electronic components: new MEMS sensors, sensitive components, temperature sensors, gas sensors, displacement sensors, velocity sensors, photoelectric sensors, biochemical sensors, electroacoustic devices, component distribution, relays, micro nano systems, electromagnetic compatibility, power modules and power supply units, etc;

7. Electronic materials: semiconductor materials, optoelectronic materials, magnetic materials, electronic ceramics, crystal materials, thermal conductive materials, electromagnetic wave shielding materials, etc;

8. Semiconductor equipment and core components: semiconductor device equipment, material equipment, chip equipment, packaging manufacturing equipment and core components, integrated circuit equipment, solar cell chip equipment, LED equipment, third-generation semiconductor equipment, etc;

9. Testing and measurement: machine vision, electronic and communication instruments, electrical instruments and meters, environmental testing instruments and equipment, analytical instruments, certification testing, automation instruments and meters, etc;

10. New types of displays and intelligent terminals: OLED, AMOLED, Mini/MicroLED displays, in car displays, medical displays, educational displays, wearable displays VR displays, intelligent transportation displays and application terminal displays, flexible displays and materials and equipment, 3D glass, touch screen modules, AR/VR/MR devices, mobile phones/laptops/computers/smart bracelets, wearable devices, intelligent robots, audio-visual equipment, industry terminals, etc.

Exhibition Advantages

The unique advantage of Hefei Electronic Technology Exhibition lies in the "industry real-life" in-depth experience. Relying on the trillion level industrial cluster of "Chip Screen Device Integration" in Hefei, the exhibition can seamlessly connect the full chain resources from chip design, panel manufacturing to intelligent terminal assembly in the local area, allowing exhibitors to immerse themselves in the forefront trends of electronic technology and connect with the upstream and downstream industries of semiconductor, display, electronic components and other fields on site, achieving efficient transformation from information exchange to cooperation landing.

Choosing Hefei Electronic Technology Exhibition is to seize the entrance to the high ground of the electronics industry. This not only connects domestic and foreign electronic technology core enterprises, but also directly faces the innovative achievements and market demand in key fields such as automotive grade chips, flexible AMOLED, intelligent sensors, etc. Next, Hefei will focus on developing high-end chips, new displays, and intelligent terminals, with deepening technology cooperation with domestic and foreign enterprises as the engine, to achieve coordinated promotion of research and development, manufacturing, and application, accelerate the construction of a national electronic information industry cluster, and fully consolidate its position as the "IC Capital of China" and "New Energy Capital", providing a broader platform for industrial cooperation and development for participating enterprises.


audience

Electronic manufacturing: Senior management personnel such as chairman, general manager, and deputy general manager of manufacturing enterprises related to consumer electronics, home appliances, and smart terminals, as well as engineers, technicians, designers, etc. from supply chain management, procurement, technology, research and development, production manufacturing, product testing, and other departments.

Electronic components and supporting enterprises: personnel from semiconductor equipment, wafer/packaging manufacturers, IC design/chip manufacturers, semiconductor materials, semiconductor components, electronic components and other enterprises.

Distributors and retailers: domestic distributors/agents of household appliances and consumer electronics, import and export companies, cross-border e-commerce, retailers, etc.

Research institutes and universities: Researchers and faculty and students in electronic related fields.

Investment and financial institutions: personnel from investment companies, incubators, crowdfunding platforms, and other institutions.

Other related industries: enterprises and institutions involved in electronic technology applications in the military, aerospace, automotive, medical, industrial control, communication, transportation, energy and other industries.


Beijing Zhongwei International Exhibition Co., Ltd

ally be Person:Liu Jiaolady

electricityWords:13257086620(WeChat synchronization)

mailBox:243163521@


Costs & Precautions

Please contact the exhibition organizer before participating in the exhibition to confirm.

The review of domestic substitution achievements at the 2026 Hefei Electronics Exhibition focuses on the full chain innovation of "chip screen automotive integration" - www.globalomp.com

The review of domestic substitution achievements at the 2026 Hefei Electronics Exhibition focuses on the full chain innovation of "chip screen automotive integration" - www.globalomp.com

Contact

  • Contact:Liu Jiao
  • Mobile:132527086620
  • Address:3899 Jinxiu Avenue, Baohe District, Hefei City

Disclaimer

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870

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