Exhibition Introduction:

The Pearl River Delta is the region with the most solid foundation, complete industrial chain, and advanced technology in China's semiconductor industry.

As a major province in electronic information, Guangdong has inherent advantages in vigorously developing the semiconductor industry. The integrated circuit industry in Guangdong Province is gradually maturing, and third-generation semiconductors have become a highlight. Shenzhen and Guangzhou, as the main cities of the semiconductor industry, along with nine Pearl River Delta cities including Zhuhai, Foshan, Huizhou, Dongguan, Zhongshan, Jiangmen, and Zhaoqing, are making strong efforts to build a semiconductor and integrated circuit industry cluster with international influence. From the perspective of the industrial chain, the Pearl River Delta region is highly concentrated with Huawei, ZTE OPPO、vivo、 A group of globally influential terminal manufacturers such as BYD, CSR, and DJI have provided rich downstream application scenarios for the development of their third-generation semiconductors.

In order to further strengthen exchanges and cooperation in the semiconductor industry, accelerate breakthroughs in key core semiconductor technologies, and effectively promote the coordinated development of the semiconductor industry chain, the organizer of the China Electronics Show, which began in 1964, has launched the China Semiconductor Industry and Application Expo (IC Expo) based on the strong resource advantages of the industry and the successful hosting of the 100th China Electronics Show and the 14th China Electronic Information Expo. The IC Expo is held concurrently with the Shenzhen China Electronics Fair Spring Festival in April every year, to facilitate efficient collaboration between industry, academia, and research in the semiconductor industry, and to gather strength to strengthen, supplement, and extend the semiconductor industry chain in the Pearl River Delta.

Scope of exhibits:

Chip Design/Wafer Manufacturing: Integrated Circuit Design and Chip Manufacturing EDA、MCU、 Wafer manufacturing and equipment and components, etc;

Advanced packaging: Chiplet, SiP packaging, wafer level packaging (WLP), 3D packaging, panel level packaging (PLP), TSV/TGV packaging, organic/silicon/glass substrates, packaging substrates, packaging carriers, IC carriers, semiconductor packaging materials and equipment, etc;

Semiconductor specialized equipment/components: thinning machines, single crystal furnaces, grinding machines, heat treatment equipment, lithography machines, etching machines, ion implantation equipment, CVD/PVD equipment, cleaning equipment, cutting machines, mounting machines, bonding machines, testing machines, sorting machines, probe stations and components, etc;

Advanced materials/carbon materials/diamond semiconductors: silicon wafers and silicon-based materials, photomasks, electronic gases, photoresist and its supporting reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, ceramic substrates, chip bonding materials, carbon based materials, diamond semiconductors, graphite materials, superhard materials, etc;

Compounds and third-generation semiconductors: nitrides (GaN) and silicon carbide (SiC), zinc oxide (ZnO) diamonds, wafers, substrates and epitaxy, power devices, IGBT packaging materials, RF devices and processing equipment, etc;

Power devices/automotive semiconductors: automotive grade semiconductor control/computing chips, power semiconductors (IGBT and MOSFET), automotive grade SiC modules, power management chips, automotive electronic microassembly and power devices, packaging and testing equipment, automation equipment, etc;

Computing power, storage, artificial intelligence, CPO co packaging: artificial intelligence chips, solutions, computing power chips and solutions, algorithm solutions, data storage, optoelectronic co packaging modules and technologies and equipment, etc;

Semiconductor empowerment hotspots and solutions: automotive electronics, specialty electronics, 5G, AI, IoT scenario applications, IoT, motor drives, industrial control, etc.

• Company:Lijia Exhibition (Shanghai) Co., Ltd
• Contact:Mr. Lu
• Mobile:13818219172
• E-mail:3087083730@qq.com
• Address:Shenzhen

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