Exhibition Introduction:

As an authoritative and specialized semiconductor industry brand event in East China and even across the country, the 2026 Shanghai International Semiconductor Technology Conference and Exhibition will be held at the Shanghai New International Expo Center from June 3rd to 5th, 2026. The exhibition is expected to cover an area of 60000 square meters, with over 1000 exhibitors and an estimated audience of 100000+. This exhibition focuses on integrating innovative products, technologies, solutions, and business cooperation models in the semiconductor industry, providing a one-stop solution platform for semiconductor enterprise brand promotion, product display, and exchange and cooperation, helping enterprises achieve communication and interoperability throughout the entire industry chain. As a semiconductor industry brand event that combines scale and influence, the exhibition follows market development trends and provides an opportunity for the domestic and international semiconductor industry to enhance brand awareness and expand markets. Give full play to its role as a window for transmitting market information and exchanging advanced technologies, and identify the direction of industry development. Sharing an international platform and expanding the semiconductor market together, let's work hand in hand to create business opportunities!

Display scope:

Chip Design, Wafer Manufacturing and Packaging Exhibition Area: Integrated Circuit Design and Chip, Wafer Manufacturing, SiP Advanced Packaging, Power Device Packaging and Testing MEMS Packaging and Testing, Silicon Wafer and IC Loading Board, Packaging Substrate and Application Manufacturing and Packaging Testing EDA、MCU、 Semiconductor materials, equipment, and components for packaging and testing substrates

Semiconductor specialized equipment/components exhibition area: thinning machine, single crystal furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD equipment, cleaning equipment, cutting machine, mounting machine, bonding machine, testing machine, sorting machine, probe station and components, etc

Advanced Materials/Carbon Materials/Diamond Semiconductor Exhibition Area: Silicon wafers and silicon-based materials, photomasks, electronic gases, photoresist and its supporting reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, ceramic substrates, chip bonding materials, carbon based materials, diamond semiconductors, graphite materials, superhard materials, etc

Third Generation Semiconductor Exhibition Area: Nitride (GaN) and Silicon Carbide (SiC), Zinc Oxide (ZnO) Diamond, Wafer, Substrate and Epitaxy, Power Devices, IGBT Packaging Materials, RF Devices and Processing Equipment, etc

IC Carrier Board/Ceramic Substrate Exhibition Area: IC Carrier Board and Packaging Process (Substrate, Copper and other structural materials, dry film, gold salt and other chemicals/consumables) Chiplet Packaging Technology, Storage, MEMS and Chip Applications and Materials, Equipment, Ceramic Substrate and Packaging Materials and Equipment, etc

Component Exhibition Area: Passive Devices, Semiconductor Discretes/1GBT, 5G Core Components, Special Electronics, Component Power Management, Sensors, Memories, Connector Relays, Cables, Plug in Devices, Crystals, Resistors, Display Devices, Diodes, Transistor Filter Components, Switches, and Component Materials and Equipment

Power Devices/Power Electronics/Automotive Semiconductors Exhibition Area: Automotive grade semiconductor control/computing chips, power semiconductors (IGBT and MOSFET), automotive grade SiC modules, power management chips, automotive electronic micro assembly and power devices, packaging and testing equipment, automation equipment, etc

Computing power, storage, artificial intelligence, CPO packaging area: artificial intelligence chips, solutions, computing power chips and solutions, algorithm solutions, data storage, optoelectronic co packaging modules and technologies and equipment, etc

Semiconductor Display/Mini/Micro LED Exhibition Area: OLED, AMOLED, Mini/Micro LED Display, Flexible Display and Materials and Equipment, etc

• Company:Lijia Exhibition (Shanghai) Co., Ltd
• Contact:Mr. Lu
• Mobile:13818219172
• E-mail:3087083730@qq.com
• Address:Shanghai

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870