2026 China (Shanghai) International Electronic Packaging and Testing Exhibition
Date: June 3-5, 2026 | Location: Shanghai New International Expo Center

Exhibition Preface

With the continuous increase in demand for AI computing power, servers, and high-end chips, the packaging and testing process is becoming a key driving force for upgrading the PCB industry. Chinese enterprises are actively laying out in this field, increasing research and development investment, and promoting continuous innovation in packaging technology. From traditional DIP and SOP packaging to advanced SiP, Fan out and other packaging technologies, continuous breakthroughs have been made in technological innovation, providing more diversified and high-performance product choices for the global market. In the global integrated circuit packaging and testing market, the competitiveness of Chinese enterprises is increasing day by day. At the same time, with the continuous expansion of the domestic market and the overseas market, China's packaging and testing industry is gradually forming a good pattern of leading enterprises and coordinated development of small and medium-sized enterprises.

As one of the most influential leading trade events in the global electronic packaging and testing industry, the 2026 China (Shanghai) International Electronic Packaging and Testing Exhibition will be held from June 3 to 5, 2026 at the Shanghai New International Expo Center. The exhibition will focus on showcasing advanced packaging and testing equipment, key materials, and innovative packaging and testing technologies and processes, with the theme of "Smart Packaging and Testing Future", creating a communication hub for collaborative innovation between PCB manufacturing and packaging and testing industry chains. During the exhibition, multiple international technology conferences will be held, inviting industry experts and renowned scholars to gather together. Through keynote speeches, forums, and other forms, the latest market trends and cutting-edge topics will be shared, and industry trends and opportunities will be deeply analyzed and systematically interpreted, providing attendees with forward-looking industry insights.

We sincerely invite you to participate in this industry event, join hands to seize the opportunities and challenges in the field of electronic packaging and testing, and jointly draw a new blueprint for the development of the industry!

‌Core Highlights‌

‌Full industry chain coverage‌
Focusing on advanced packaging (such as Fan Out, 3D IC, SiP), testing equipment, materials and processes, intelligent manufacturing, and other full chain technologies, covering upstream and downstream ecosystems such as design, manufacturing, and application terminals.

‌International Participation‌
Attract top companies, research institutions, and industry organizations from countries and regions such as the United States, Japan, Europe, and South Korea to jointly explore technological trends and market opportunities.

‌Frontier Technology Release‌
Establish a dedicated "Innovation Technology Release Conference" area to showcase breakthrough achievements in the industry and assist enterprises in seizing the technological high ground.

‌Precise business docking‌
Through the pre matching system and on-site B2B negotiation meetings, connect packaging and testing manufacturers with buyers in application fields such as consumer electronics, automotive electronics, AIoT, etc.

‌Authoritative Forum Activities‌
Simultaneously holding the "Global Electronic Packaging Testing Summit Forum", inviting academicians, experts, and corporate executives to share policy interpretations, technical routes, and business practices.

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Scope of Exhibits:

1. Electronic metal packaging, electronic ceramic packaging, electronic plastic packaging, electronic epoxy resin material packaging, packaging materials and processes, electronic packaging equipment and advanced manufacturing technology, electronic packaging testing technology equipment, electronic sintering related products and technologies, etc;

2. Advanced packaging and system integration: ball grid array packaging, chip packaging, flip chip, wafer packaging, 3D integration, and various other advanced packaging and system integration technologies;

3. Packaging materials and processes: interconnect materials such as keys and wires, solder balls, solder paste, conductive adhesives, etc; Underchip fillers, adhesives, thin film materials, dielectric materials, substrate materials, frame materials, thermal conductive materials, green electronic materials, and other new materials that can achieve high packaging performance and reduce costs; And various packaging and assembly processes, etc;

4. Packaging design and simulation: various new packaging/assembly designs; Modeling, simulation, and verification methods for electrical, thermal, optical, and mechanical characteristics of electronic packaging; Multi scale and multi physics modeling, etc;

5. Emerging domain packaging: packaging technologies for sensors, actuators, microelectromechanical systems, nanoelectromechanical systems, and micro electromechanical systems; Optoelectronic packaging, CMOS image sensor packaging; The application of packaging and integration technology in emerging fields such as liquid crystal displays, passive components, RF, power and high-voltage devices, and nanodevices;

6. High density substrate and assembly technology: embedded passive and active component substrate technology; High density interconnect substrates, printed circuit boards, high-density high-performance substrates; And various new substrate technologies that can improve substrate density and performance;

• Company:2026 Shanghai Electronic Packaging and Testing Exhibition Organizing Committee
• Telephone:021-31007656
• Contact:Mr. Yin
• Mobile:18217255997
• E-mail:2366454544@qq.com
• Address:Shanghai New International Expo Center

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870