2026 Global Semiconductor Industry (Chongqing) Expo

Date: May 13-15, 2026

Location: Chongqing International Expo Center

The Global Semiconductor Industry (Chongqing) Expo GSIE is one of the most important semiconductor industry events in the central and western regions of China, held annually in Chongqing. The exhibition is expected to attract over 500 exhibitors, with an exhibition area of 30000 square meters and approximately 25000 professional visitors. As the annual gathering of the semiconductor industry, GSIE is not only a platform to showcase the latest products and technologies, but also an important occasion for exchanging ideas and exploring future trends within the industry.

The Global Semiconductor Industry (Chongqing) Expo GSIE will cover all aspects of the semiconductor industry chain, including but not limited to IC design, integrated circuit manufacturing, packaging and testing, semiconductor materials, production equipment, electronic components, AI+5G applications, and smart power supply. During the exhibition, a series of high-end forums and specialized seminars will also be held, focusing on industry hot topics such as power semiconductor storage, automotive electronics, digital analog hybrid, artificial intelligence, and the Internet of Things. In addition, the conference will invite experts from renowned universities and research institutions such as the Chinese Academy of Sciences and Tsinghua University, as well as senior representatives from major companies, to give speeches and discussions, providing valuable learning opportunities and online resources for participants.

Through professional platforms such as the Global Semiconductor Industry (Chongqing) Expo GSIE, domestic and foreign enterprises can cooperate more closely, promote technological progress and market expansion. With the development of the Chengdu Chongqing economic circle and the increasing support for technological innovation and intelligent manufacturing, Chongqing is gradually becoming an important node in the national and even global semiconductor industry. GSIE not only promotes the development of the local semiconductor industry, but also provides reference cases for industrial upgrading in other regions of China. Looking ahead to the future, GSIE will continue to play its bridging role, assisting in the continuous innovation and development of the semiconductor industry, while promoting the prosperity of related supporting industries, and contributing to the high-quality development of China's manufacturing industry.

Exhibition Scope

Semiconductor, integrated circuit design, manufacturing, packaging:

Integrated circuit design and chips, chip design tools, and testing, wafer manufacturing, SIP advanced packaging, power device packaging and testing, MEMS packaging and testing, advanced packaging (Chiplet) technology, silicon wafers and IC packaging carriers, packaging substrates and application manufacturing and packaging testing, packaging substrate semiconductor materials and equipment and components, etc;

Equipment Manufacturing Zone:

Thinning machine, single crystal furnace, oxidation furnace, grinding, polishing, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, scribing, CVD/PVD/ALD, PECVD equipment MOCVD、 Glue coating, developing machine, solidification machine, cutting machine, cleaning equipment, mounting machine, burning, optical vacuum coating, imaging and testing measurement (microscope/spectrometer/interferometer/optical measurement and testing instrument/optical design/optical platform and displacement table, etc.), optical instruments, lenses and cameras (lenses/lenses), laser equipment, bonding machine, testing machine, sorting machine, vacuum fluid, testing equipment, refrigeration equipment, oxidation equipment, oxidation equipment, clean room equipment;

Semiconductor Materials Zone:

Third generation semiconductor materials, silicon wafers and silicon-based materials, optical masks, high-purity gases, electronic specialty gases, wet electron chemistry, photoresist and its supporting reagents, CMP polishing materials, target materials, optical fibers, packaging materials, nanomaterials, chip bonding materials, pipeline valves, crystals, quartz, sapphire, graphene, etc;

Automotive Electronics:

Vehicle grade semiconductor control/AI chips, power semiconductors (IGBT and MOSFET), vehicle grade SiC modules, power management chips, automotive electronic micro assembly and power devices, advanced packaging technology for vehicle grade, intelligent networking, intelligent driving intelligent cockpit chips CPU and storage chips MCU, GPU image processing, vision processing chips, vision, sensing technology, radar technology, optics, intelligent decision-making technology, high-precision positioning and mapping, design and development, and testing solutions, etc;

Electronic components:

Passive components, sensors, storage devices, connectors, relays, cables, wiring harnesses, plug-in devices, crystal oscillators, resistors, instruments, display devices, secondary and tertiary transistor filtering components, switches and component materials and equipment, ceramic magnetic materials, printed circuit substrates, etc;

Test measurement:

Electronic and communication instruments, electrical instruments and meters, environmental testing instruments and equipment, analytical instruments, certification testing, automation instruments and meters, etc;

New Display and Intelligent Terminal:

Display and applications, 3D glass, touch screen modules, AR/VR/MR devices, mobile phones/laptops/computers/smart bracelets, wearable devices, intelligent robots, audio-visual equipment, industry terminals, etc;

Smart Power Zone:

Microwave RF, semiconductor LED, power management chip, plasma power supply, module power supply, laser power supply, AC, DC power supply, communication power supply, special power supply, power manufacturing equipment and materials, power related, photovoltaic/wind power/energy storage power supply design, military, power converter magnetic technology, etc;

Intelligent manufacturing:

SMT technology and equipment, automotive electronics and consumer electronics assembly equipment, smart factories, smart warehousing, smart robots, welding and dispensing technology AI+5G、 Industrial Internet platform, intelligent vehicle networking, anti-static, clean purification, etc;

Comprehensive exhibition area:

Government groups from all over the country, high-tech industrial parks related to semiconductors, banks, insurance companies, funds, financial institutions, negotiation zones, etc.

Exhibition fees

Exhibition fee: 12800 yuan for a 9-square meter luxury standard booth. 18 square meter luxury standard booth costs 25600 yuan. Specially designed bare land with a minimum rent of 36 square meters, priced at 1200 yuan per square meter

Exhibition Contact

Huaxin Jusha Exhibition (Shanghai) Co., Ltd

Building B, Guojia Garden, No. 485 Yangnan Road, Pudong New Area, Shanghai

Contact: Li Yan 15311812802 (same as WeChat)

• Telephone:15311812802
• Contact:Li Yan
• Mobile:15311812802
• Address:No. 66 Yuelai Avenue, Yubei District, Chongqing

The information on this site comes from the network and related members, and the website has done its duty to review it. Due to the uncontrollability of the process of organizing the exhibition, some of the exhibition information in the station may change the subject matter, Extending or cancelling the event, please exhibitors and visitors must check with each other again before exhibiting! All the exhibitions in this site are not hosted/co-organized or organized, if there are any disputes during the exhibition, please hold the main responsibility of the exhibition organization! QQ Email: 523138820@qq.com WeChat: 523138820 Mobile: 15313206870