2026 Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Exhibition

Simultaneously held: The 2nd Hangzhou International Humanoid Robot and Robot Technology Exhibition

Time; May 14-16, 2026

Location: Hangzhou Grand Convention and Exhibition Center - Zhejiang

Approved by: Ministry of Commerce of the People's Republic of China

Host: Zhejiang Semiconductor Industry Association

Co organizer: Semiconductor Industry Development Branch of China International Association for the Promotion of Science and Technology

Organizer: Shanghai Gaodeng Exhibition Group Co., Ltd

Execution unit: Shanghai Dadao Guofu Exhibition Co., Ltd

Exhibition Introduction:

The semiconductor and integrated circuit industry is an important driving, supportive, and iconic blue ocean industry representing the future. With the acceleration of global digital transformation, the importance of the semiconductor and integrated circuit industry is becoming increasingly prominent. The semiconductor and integrated circuit industry in Zhejiang Province has established a complete industrial chain covering design, materials, equipment, manufacturing, packaging and testing, forming a characteristic industrial cluster of analog chips and power devices around Hangzhou Bay with Hangzhou, Shaoxing, Ningbo, and Jiaxing as the core, and a semiconductor material support industrial cluster with Lake, Jin, Qu, and Li as the core. As an important base for the design of the national integrated circuit industry, the Hangzhou Municipal Government attaches great importance to the development of the integrated circuit industry. It has successively issued a series of special policies, including "Special Policies to Further Encourage the Accelerated Development of the Integrated Circuit Industry in Hangzhou", "Implementation Opinions on Promoting the High quality Development of the Integrated Circuit Industry", and "Several Policies to Promote High quality Economic Development", including financial subsidies, tax incentives, talent introduction, and platform construction. It proposes to build a core city for integrated circuits in the Yangtze River Delta and work together with Ningbo, Shaoxing, and Jiaxing to create a core industrial cluster area for integrated circuits around Hangzhou Bay. By 2025, the scale of Hangzhou's integrated circuit industry aims to reach 80 billion yuan and sprint towards 100 billion yuan, with an average annual growth rate of 20%. In terms of industrial ecology construction, Hangzhou has built a complete industrial chain covering "chip design basic materials integrated circuit manufacturing large-scale application", gathering upstream and downstream industries to form an industrial cluster centered on wafer manufacturing

A group of "specialized, refined, unique, and new" small and medium-sized enterprises have been cultivated in the fields of conductors, semiconductor core materials, key equipment, and components. Their products widely serve multiple fields such as consumer electronics, industrial control, and automotive electronics, providing important strength for the development of the industry.

New opportunities

To build an international platform that integrates product display, trade negotiation, technology exchange, and cooperation for more semiconductor and integrated circuit enterprises. Under the guidance of the superior supervisory department, Gaodeng Exhibition, together with relevant supervisory units, will hold the "2026 Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Exhibition" at the Hangzhou Grand Convention and Exhibition Center from May 14th to 16th, 2026. The exhibition will focus on the theme of "linking the chip ecosystem and creating new opportunities for intelligent manufacturing", with a total planned exhibition area of 30000 square meters, covering integrated circuit design IP、EDA、 Manufacturing, packaging testing, equipment manufacturing, semiconductor materials, design services, chip applications and other products and technologies. This exhibition will gather cutting-edge technologies and products from the global semiconductor and integrated circuit industry, showcasing the innovative power of the semiconductor and integrated circuit industry from chip design to integrated circuit solutions in all aspects. By combining exhibitions and forums, we aim to showcase the innovative strength and development achievements of China's semiconductor and integrated circuit industry (especially in the Yangtze River Delta region) from different perspectives, share cutting-edge industry trends, gather innovative talents, promote technological exchanges and cooperation, advance the construction of industrial ecology, further promote the deep integration of the semiconductor and integrated circuit innovation chain, industrial chain, and supply chain, and assist in the high-quality development of China's semiconductor and integrated circuit industry.

Concurrent Events

At the same time as the exhibition, multiple professional activities will be held, including the Semiconductor and Integrated Circuit Industry Development Summit Forum, Technology Exchange Meeting, Investment and Financing Matchmaking Meeting, and First Debut Show. Top experts, corporate executives, and institutions will gather to deeply explore the global trends and key application scenarios of semiconductor and integrated circuit development. During this period, multiple supply and demand matchmaking events in semiconductor manufacturing, integrated circuits, electronic power, electronic manufacturing, display manufacturing, as well as automotive, information and communication, consumer electronics and other fields will be the biggest highlight of the exhibition. The matchmaking events will be conducted in the form of face-to-face communication between buyers and exhibitors, completing the exchange of product details and information collection through communication and matchmaking, aiming to promote precise business cooperation between upstream and downstream enterprises in the industry chain.

Exhibition Area Setting

1. IC Design/Chips and Applications

2. IC manufacturing

3. Wafer equipment

4. Sealing and testing equipment

5. Core components and materials

6. Compound semiconductors and power devices

7. AI computing power

8. Supporting facilities and services

9. Local exhibition groups and regional clusters in various provinces and cities

Focusing on the latest breakthroughs in "high-end chips" and "domestic substitution", we aim to create the most cutting-edge technology display platform in the industry.

Major categories of exhibits

1. IC Design/Chips and Applications: IC and related electronic product design, EDA, AI computing chips, storage chips, automotive chips, smart home appliance chips

2. Artificial intelligence chips and products related to the Internet of Things, artificial intelligence, automotive electronics, smart cities, intelligent terminals, and healthcare;

3. IC manufacturing: semiconductor wafer manufacturing, semiconductor packaging and testing technology and products;

4. Advanced packaging: design, materials, testing, equipment, etc. for flip chip, bump, wafer level packaging, 2.5D/3D advanced packaging (TSV and TGV), fanout wafer level packaging, etc;

5. Wafer equipment/packaging and testing equipment: various precision equipment and semiconductor packaging equipment, semiconductor testing equipment, IC testing instruments, advanced packaging technology (such as SiP, 3D packaging) equipment, power device equipment, etc. required in the wafer processing process;

6. Compound semiconductors and power devices: Compound semiconductor materials (such as GaN, SiC, etc.) and related products, including power devices, RF devices, upstream equipment, materials, etc;

7. Semiconductor materials: monocrystalline silicon, silicon wafers and silicon-based materials, polishing pads, masks, sputtering targets, polishing solutions, etching solutions, ceramic packaging materials, bonding wires, lead frames, packaging substrates, photoresists, thin film deposition materials, specialty gases, ultrapure water, plastic packaging materials, high-performance plastics, etc;

8. Semiconductor core components: machine vision, sensors, sealing rings, precision bearings, metal components, valve valves, silicon/SiC parts Robots、 Quartz components, filters, RF power supplies, ceramic components, ESC electrostatic suction cups, pressure gauges, pumps, MFC flow meters, stepper motors, motion control, servo motors, linear modules, dust-free drag chains, packaging molds, refrigeration equipment, induction heaters, etc;

9. AI computing power: AI chips, servers, switches, power supplies, liquid cooled temperature control, etc;

10. Supporting facilities and services: support products/cleanrooms, general commercial services/consulting, sales and services, standards and others.

Standard booth:

A: Domestic enterprises: Standard booth 16800.00/exhibition period (RMB) 3m × 3m

B: Foreign companies: Standard booth 4800.00/exhibition period (USD) 3m x 3m

The booth includes: three white wall panels, Chinese (English) lintel production, one consultation table, two folding chairs, full carpet, booth lighting, one 220V/5A power socket

A waste paper basket. ）

Indoor lighting:

A: Domestic enterprises: 1600 RMB per square meter

B: Foreign companies: 480 USD/square meter

Note: (Minimum rental area of 36 square meters) "bare space" only provides exhibition area and does not include display racks, exhibition equipment, carpets, power supplies, etc.

Audience organization

This exhibition will fully invite global semiconductor, integrated circuit, electronic power, electronic manufacturing, display manufacturing, as well as automotive and aviation industries

Professionals from fields such as aerospace, healthcare, information and communication, and consumer electronics gathered in Hangzhou to explore cutting-edge technologies, discuss cooperation plans, and work together to decode the new ecology of the industry, jointly building an open, collaborative, and resilient global semiconductor and integrated circuit industry "chip" future.

Book a booth

Please book your booth for "SICE 2026" immediately. The earlier you reserve the space, the better, striving for maximum exposure, leading competitors, and exploring unlimited business opportunities.

If you want to book a booth for the "SICE 2026" procurement trade fair, or for more information, please use the following contact methods to book a booth.

Organizing Committee Phone/Tel: Manager Li 133 8382 6291 (also WeChat)

• Telephone:133 8382 6291
• Contact:Manager Li
• Mobile:133 8382 6291
• Address:West of the intersection of Meishi Line and Yannan Line in Xiaoshan District, Hangzhou City

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