2026 China International Thermal Management Materials and Equipment Exhibition

Date: April 7-9, 2026 Location: Guangzhou Poly World Trade Center Expo Center (1000 Xingang East Road, Haizhu District, Guangzhou)

Host: China Industrial Cooperation Association

China New Materials Development Industry Alliance

Organizer: New Materials and Energy Application Professional Committee of China Industrial Cooperation Association

Qiyuan International Exhibition (Beijing) Co., Ltd

Designated media: Hot Design Network Consultation Hotline: 010-85863863/136 9134 2007

1. Preface

With the advancement of consumer electronics, 5G, and artificial intelligence XR、 Against the backdrop of continuous technological penetration and upgrading in fields such as data centers, the Internet of Things, power batteries, energy storage, and Industry 4.0, the miniaturization and continuous increase in power density of electronic devices have led to rapid accumulation of heat energy, weakened safety, and shortened service life. With the continuous advancement of technology, the demand for thermal management, heat conduction, and heat dissipation is also constantly increasing, and the market size is growing exponentially. This has brought enormous potential and commercial cooperation space to the thermal management, heat conduction, and heat dissipation industry. It is predicted that by 2029, the global thermal management system market revenue will reach $39.11 million, with a compound annual growth rate (CAGR) of 7.1%. This trend will drive continuous innovation and upgrading of thermal management technology. In the future development, the thermal management industry will continue to maintain a rapid growth trend and become an important force in promoting the development of fields such as electronics, communication, and new energy vehicles. In order to further promote communication and interaction in the thermal management and heat dissipation industry, strengthen the awareness of communication and cooperation in China's thermal management and heat dissipation industry, and achieve mutual promotion and common development, the "2026 China International Thermal Management Materials and Equipment Exhibition" hosted by the China Industrial Cooperation Association and the China New Materials Development Industry Alliance, and organized by the New Materials and Energy Application Professional Committee of the China Industrial Cooperation Association and Qiyuan International Exhibition (Beijing) Co., Ltd. is scheduled to be held from April 7-9, 2026 at the Poly World Trade Center Expo in Guangzhou (hereinafter referred to as the "Thermal Management Exhibition"). The conference aims to build a communication platform for exhibition, exchange, and information exchange in the field of thermal management and heat dissipation, and promote breakthroughs in technology and industrial development in the thermal management and heat dissipation industry. The conference warmly welcomes experts, scholars, researchers, and representatives from relevant fields at home and abroad to actively participate. At the same time, companies, enterprises, and institutions are welcome to showcase their technological achievements and negotiate cooperation between industry, academia, and research. This exhibition and forum will become the best platform for showcasing and exchanging ideas in the thermal management industry. We look forward to more exhibitors and professional visitors participating in this grand event to witness the brilliant future of the thermal management industry together.

2、 Contemporary Forum

2026 China Thermal Management Materials Innovation and Application Development Conference

Forum organizer: China Industrial Cooperation Association

China New Materials Development Industry Alliance

New Materials and Energy Application Professional Committee of China Industrial Cooperation Association

Forum time: July 8th, 2026

Forum location: Guangzhou Poly World Trade Center Expo Conference Room

Invitations to the forum: Shanghai Jiaotong University, Wuhan University of Science and Technology, Shanghai University of Engineering and Technology, Beijing University of Technology, Guangxi University, Institute of Microelectronics, Chinese Academy of Sciences, China University of Metrology, China Civil Aviation Flight Academy, Peking University, South China Normal University, Institute of Chemical Materials, China Academy of Engineering Physics, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Xi'an Jiaotong University, South China University of Technology, etc.

Forum application: Participating units can voluntarily apply for forum speeches and new product releases. Those who are interested in applying for forum speeches can submit materials, and only after being approved by the organizer can they register to participate in the speeches.

Forum fee: The forum fee is 20000 yuan per session and lasts for 20 minutes.

3、 Exhibition schedule and location:

Exhibition time: April 5-6, 2026 (8:30-17:00)

Exhibition time: April 7-9, 2026 (9:00-17:00)

Exhibition location: Guangzhou Poly World Trade Center Expo Center (1000 Xingang East Road, Haizhu District, Guangzhou)

6、 Exhibition Procedure

1. For enterprises that meet the scope of the exhibition, please fill out the exhibition application form carefully and stamp it with the official seal before sending it to the organizing unit.

2. The principle of booth allocation in order: priority should be given to the size of the booth, and according to the principle of "apply first, pay first, arrange first", in order to ensure the overall image of the exhibition, the exhibitor ultimately reserves the right to move some booths.

3. The organizer shall send the 'Exhibitor Handbook' to exhibitors who have already paid 40 days before the opening of the exhibition. The content includes information related to exhibit transportation, opening and closing times, booth design and construction requirements, museum application process, item rental and services, exhibition safety matters, etc. Please read carefully and follow the contents of the exhibitor manual!

7、 Audience invitation

We mainly invite industry leaders and decision-makers from national, provincial, municipal, and relevant research institutions, consumer electronics, power supply, automotive industry, electronics, household appliances, computers/computer components, displays, semiconductors, military supplies, optoelectronic/LED, frequency converters, mechanical industry, electronic equipment, electronic components, instruments and meters, communication/communication networks, medical instruments, wind power, solar energy, chassis/cabinets, chokes, integrated circuits, transistors, electrical appliances, transformers, welding equipment, power electronic devices, and other enterprises to visit, purchase, exchange, and negotiate.

Terminal operator solution providers: Apple, Samsung, Huawei, Nubia OPPO、 Xiaomi VIVo、 Transsion, Microsoft, ZTE, Meizu, Lenovo, TCL, LG, Amazon, Hisense, 360 Mobile, Asus, China Mobile, China Unicom, China Telecom, Qualcomm ...

Intelligent hardware: iFlytek, 360, Wanxing Technology, TCL Technology, Huichuan Technology, Dahua Co., Ltd., Zhongke Chuangda, Helitai, Midea Group, Shaoyin Technology, NetEase Youdao, Jiahe Co., Ltd., Beisi Technology, Lanhe Technology, Lvmi Lianchuang, Fenda Intelligence, etc.

New energy vehicles: Tesla, BYD, Ideal Automobile, NIO, Xiaopeng Motors, BMW, Aion, Nezha Motors, Jike, AITO, Geely Automobile, SAIC, FAW, GAC, BMW, Audi Dongfeng, Toyota, Honda, Great Wall Motors, WM Motor, etc.

Material companies: Feirongda, Hongfucheng, Bowen Industrial, Huitianxin, Leizdun, Huijing New Materials, Liqun Lianfa, Zhonglan Chengguang, Zhongshi Technology, Carbon Element Technology, Anjie Technology, Xinlun Technology, Meiqing Technology, Huazheng New Materials, Lingyi Zhizao, Stick DSM, Zhongshi Technology, 3M Company, Laird, Dow, Noland, Zhongshan Yongda, Anbus, Aochuan Technology, DuPont, etc.

Power batteries and energy storage: CATL, BYD, Zhongchuang Chuanghang, Guoxuan High tech, Xinwangda, EVE Energy, Honeycomb Energy, Funeng Technology, LG New Energy, Ruipu Lanjun, Zhongke Electric, Xinwangda, Panasonic, Samsung, Fudi Battery, Bick Battery, Pengwei Energy, Tianneng Battery, Chaowei Battery, etc.

Processing companies: Foxconn, BYD, Changying Precision, Samsung Electronics, Tongda Group, Bern Optics, Lansi Technology, OFILM, Chaozhou Sanhuan, Ruisheng Technology, Jingsheng Precision, Yi'an Technology, Xingke Electronics, Xinwangda, Bern Optics, etc.

8、 Plan to conduct extensive publicity and promotion in over 100 media outlets both domestically and internationally

Powder Circle, China Thermal Design Network, China Powder Network, CEVEL Battery Thermal Management Technology Network, Chemical Instrument Network, China Thermal Management Network, Wire Harness World, New Materials Online, Global Organic Silicon Network, Electronic Trade Network, Industry Exhibition Network, China Defense Electronics Network, China Heat Sink Network, Electronic Network, China Vacuum Coating Network IC trading network element device professional consulting media, coating talent network, Link World, Electronic Component Network, China Power Grid, Electronic Component Network, China Electronics Network, China Electronics Network, Electronic Component Industry Network, Component Trading Network, China Superhard Materials Network, etc. The promotion scope covers new media such as websites, magazines, newspapers, mobile newspapers, Weibo, WeChat, etc., keeping up with the latest market development trends, sharing and interacting, and being tracked by well-known national network media such as Xinhua News Agency, Reuters, CCTV, Phoenix TV, Oriental TV, First Financial News Agency, China Daily News, United Daily News Agency, Kyodo News Agency, Oriental Net, Xinhua Net, People's Daily Online, Sina, Sohu, NetEase, Tencent, Phoenix Net, industry websites, etc.

4、 Exhibition content:

（1） Thermal conductive filler

Inorganic Non Metals: Aluminum Oxide, Silicon Oxide, Zinc Oxide, Boron Nitride, Aluminum Nitride, Silicon Nitride, Silicon Carbide, Magnesium Oxide, Beryllium Oxide, Graphite, Carbon Black, etc;

Metal powders: copper powder, silver powder, gold powder, nickel powder and aluminum powder, sodium potassium alloy, lead bismuth alloy, gallium indium alloy, liquid metal concentrate;

Chemical raw materials: organic silicon, epoxy resin, polyurethane, acrylic resin, polyimide, phenolic resin, and chemical raw materials, etc

（2） Electronic packaging materials

Metal: aluminum, copper (beryllium copper), tungsten/copper, molybdenum/copper, silicon/aluminum, beryllium/aluminum, foam metal/porous metal, etc; Rubber;

Ceramic materials: aluminum nitride, aluminum oxide, zirconium oxide, carbides, borides, nitrides, silicides; glass, etc.

（3） Thermal conductive and heat dissipating materials

Thermal interface materials: thermal conductive silicon tape, film/tape, thermal conductive silica gel, thermal conductive silicone grease, thermal conductive gel, thermal conductive potting adhesive, thermal conductive pad/carbon fiber thermal conductive pad, polymer based composite thermal conductive material, liquid metal, thermal conductive potting adhesive, etc

Ceramic substrates: alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), beryllium oxide (BeO); Silicon carbide (SiC), boron nitride (BN), etc

Heat sink material: metal/alloy (semi-solid die-casting parts); Diamond/copper, diamond/aluminum and other composite materials, graphite/copper, graphite/aluminum and other composite materials, metal based composite materials

Thermal conductive polymers: Thermal conductive plastics (PPS, PA6/PA66, PC, PP, PPA, LDPE, PEEK), thermal conductive insulating plastics, thermal conductive rubber, etc

Carbon materials: graphite film (PI film), carbon nanotubes, carbon fiber short fibers, graphene thermal conductive film, diamond materials, etc

Phase change materials (thermal storage): paraffin, fatty alcohols, fatty acids, alkane based alloys; Molten salts, salt hydrates, eutectic mixtures, etc

Thermal insulation materials: aerogel materials (carbon base, silica, zirconia, alumina, etc.), carbon felt, composite silicate materials, etc

（4） Thermal conduction and heat dissipation components

Heat pipes/heat exchangers, copper-clad laminates, power devices (silicon carbide, gallium nitride, gallium oxide, MOSFETs, IGBTs) and modules, etc.

Cooling fan accessories: copper, aluminum products, aluminum equipment, cooling profiles, iron cooling fins, sheet metal, metal stamping parts, chassis, cooling pads, finned tubes, heat pipes, heat plates, cooling modules, touchpad, fan grille, fan, motor, motor, fan automatic assembly machine, radiator welding, etc;

Heat dissipation equipment: liquid metal heat sink, profile heat sink, heat dissipation fan, heat dissipation module, heat pipe, plug-in heat sink, plug-in heat sink, chassis integrated heat sink, water-cooled heat sink, resistance heat sink, LED heat sink, CPU heat sink, IGBT heat sink, welding machine heat sink, rib heat sink, frequency conversion heat sink, heat pipe heat sink, forked heat sink, liquid cooling heat sink, combination heat sink, heat sink for solid-state relays, high-power transistor heat sink and related accessories, etc;

（5） Liquid cooling and heat dissipation technology for data centers

Raw materials: coolant, metal materials, etc. Liquid cooled plates: aluminum, copper, ammonia testing, brazing, insulation plastic, processing equipment, etc. Components: quick connectors, liquid cooled pipelines, water separators, expansion valves, throttle valves, solenoid valves, pumps, compressors, evaporators, heat exchangers, chassis, cooling distribution units, uninterruptible power supplies, filtration and purification devices, etc

Temperature control equipment: air conditioning, cold source equipment, fresh air systems, etc. Liquid cooling technology: cold plate liquid cooling, immersion liquid cooling, spray liquid cooling, intelligent temperature control technology, etc. Solutions: servers, data centers, energy storage, electric vehicles, etc. Innovative achievements: laboratory application research results, proprietary technologies, etc

（6） Energy storage thermal management

Temperature control system: environmentally friendly refrigerants, liquid cooling solutions, air cooling solutions, temperature control technology and equipment, energy storage battery thermal management solutions, fire and safety PCS thermal management liquid cooling solutions, etc. Thermal runaway monitoring and warning: temperature sensors, gas sensors (H2, VOC), battery management systems and other thermal management phase change materials, thermal storage and exchange devices (packed bed, tube shell and plate), device design,

（7） Analysis and Testing

Analytical instruments, X-ray diffractometers, laser thermal conductivity meters, thermal conductivity analyzers, thermal conductivity meters, thermal expansion meters, electronic thermal testers, air volume and pressure testers, laser thermal conductivity meters, material strength testing machines, leakage detection, thermal property measurement equipment, etc;

（8） Processing equipment

Rolling machine, coating machine, dispensing machine, slitting machine, die-cutting machine, rewinding machine, slicing machine; Roll cutting machine; Slitting machine, precision cutting machine, automatic slitting machine, thermal conductive material production equipment, spray dryer, CNC coil cutting equipment, CNC machine tool equipment, automatic production line and heat transfer laboratory, complete process and customized equipment, etc.

（9） Thermal Design System and Solutions

Thermal simulation mode, thermal design software, 3D printing, etc.

（10） New energy vehicle battery modules and PACK materials

Battery materials: thermal insulation insulation materials such as foam, ceramic silicone rubber, ceramic fiber, expansive coating, plastic foam, aerogel, mica, PET film, ultra-fine glass wool, phase change materials, adhesive materials such as thermal conductive structural adhesive, sealant, structural adhesive, thermal conductive adhesive, potting adhesive, foam adhesive, adhesive tape, flame retardant polymer materials such as PA, PBT, PP, PC, PC/ABS, PPO, PPE, PPS, composite materials such as SMC, PCM, HP-RTM, carbon fiber, aluminum alloy, high-strength steel, etc;

Battery equipment: PACK sorting, machine vision, welding, coating, assembly, testing, packaging, cutting, inspection, dispensing, filling, etc.

• Telephone:136 9134 2007
• Contact:Zhu Liping
• Mobile:136 9134 2007
• Address:1000 Xingang East Road, Haizhu District, Guangzhou City

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