2025 Shanghai International Ceramic Packaging Shell Industry Exhibition

Date: December 17-19, 2025

Address: Shanghai New International Expo Center

Exhibition Overview:

Packaging not only has the functions of installing, fixing, sealing, protecting chips, and enhancing chip heat dissipation performance, but also serves as a bridge between the internal world of chips and external circuits. It can be said that electronic packaging not only provides protection for chips in terms of electrical, thermal, optical, and mechanical performance, but also meets increasing performance requirements and functions such as reliability, heat dissipation, and power distribution at a certain cost. In the field of packaging, ceramic packaging has unique advantages compared to plastic and metal materials. Ceramic packaging belongs to airtight packaging, which has the advantage of good moisture resistance and is not prone to micro cracking; No damage occurs after thermal shock and temperature cycling experiments, and the mechanical strength is high; Low coefficient of thermal expansion and high thermal conductivity; Good airtightness, chips and circuits are not affected by the surrounding environment. Therefore, it is suitable for high reliability microelectronic packaging, such as industries with high reliability requirements such as aerospace, weapon equipment, ground radar, medical devices, and sensors. At present, although ceramic packaging accounts for a small proportion in the entire packaging industry, it is a relatively high-performance packaging method. In recent years, fields such as smart cars, the Internet of Things, drones, and data centers have developed rapidly.

Ceramic packaging shells have a wide range of applications in fields such as communication, industrial lasers, consumer electronics, and automotive electronics. They can meet the development needs and foresight of emerging fields such as smart cars, the Internet of Things, unmanned aerial vehicle markets, and virtual reality (VR). The manufacturing process of ceramic packaging tube shells is complex and the technical threshold is high. Currently, the high-end electronic ceramic shell market is mainly occupied by foreign companies such as Japan. China's high-end electronic ceramic shells rely heavily on imports. In recent years, domestic enterprises have caught up and developed rapidly, but there is still a significant gap with foreign large manufacturers in terms of production scale and technological level. To strengthen the communication and linkage between the upstream and downstream of the ceramic packaging shell industry, the 2025 Shanghai International Ceramic Packaging Shell Industry Exhibition will be held in Shanghai on December 17th. The theme of this forum will revolve around simulation design, electronic ceramic new materials, production processes, application innovation, and other aspects. We sincerely invite friends from the upstream and downstream of the industry chain to exchange ideas and contribute to the development of the industry.

Exhibition scope:

Ceramic packaging, ceramic tube shell, and ceramic substrate production enterprises; Ceramic material enterprises such as alumina, aluminum nitride, and silicon nitride; Solder, metal paste (tungsten paste, molybdenum manganese paste), Kovar alloy, heat sink and other material enterprises; Ceramic powder production and preparation equipment, powder grinding machines, sand mills, casting machines, punching machines, printing machines, laminating machines, laminating machines, hot cutting machines, adhesive sintering, brazing equipment, electroplating, chemical plating, cleaning equipment, surface mounting machines, wire bonding machines, capping machines, parallel seam welding machines, rib cutting machines, marking machines X-RAY、AOI、 Upstream supply chain enterprises such as appearance inspection, film thickness tester, helium leak detector, performance testing, aging testing equipment, automation, etc; Research institutes, university institutions, etc.

The main structure of ceramic packaging shell includes multi-layer ceramic substrate, metal ring frame, packaging cover plate, lead frame, heat dissipation bottom plate, etc. Multi layer ceramic shell manufacturing technology, including raw material preparation, casting, punching and cavity punching, metalization printing, lamination, hot cutting, sintering, nickel plating, brazing, gold plating and other technologies; The packaging process includes shell cleaning, mounting, cleaning, wire bonding, sealing, external wire processing, labeling, testing, etc. The materials involved include ceramic powders such as alumina and aluminum nitride, as well as matching metallization pastes (tungsten paste, molybdenum manganese paste), Kovar alloys, solder, heat sinks, etc; The equipment includes powder grinding machines, casting machines, punching machines, printing machines, laminating machines, laminating machines, hot cutting machines, adhesive sintering, brazing equipment, electroplating, chemical plating, cleaning equipment, surface mounting machines, wire bonding machines, capping machines, parallel seam welding machines, rib cutting machines, marking machines, appearance inspection, film thickness testers, helium leak detectors, performance testing, aging equipment, etc. required for multi-layer ceramic manufacturing.

Participation Procedures

Fill out the booth application form, stamp it and scan or fax it to the organizing committee of the conference. Within 3 working days of applying for a booth, the exhibition fee shall be wired or paid to the organizing committee. The principle of booth allocation is "apply first, pay first, arrange first". Otherwise, the organizer will consider it as giving up the exhibition. After receiving the "Exhibition Application Form" and booth fees, the organizer will send the invoice along with the "Exhibition Handbook" to the exhibitor. Exhibitors voluntarily register to participate in the exhibition after learning about the exhibition situation, and cannot withdraw for any reason or reason during the exhibition, or the fees paid will not be refunded.

Organizing Committee of the 2025 Shanghai International Ceramic Packaging Shell Industry Exhibition

Contact: Xu Jie 13636349782 WeChat: xj549296991

• Telephone:13636349782
• Contact:Xu Jie
• Address:No. 2345 Longyang Road, Pudong New Area, Shanghai

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